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    • 4. 发明授权
    • Manufacturing method of semiconductor devices
    • 半导体器件的制造方法
    • US5837568A
    • 1998-11-17
    • US763556
    • 1996-12-10
    • Kiyoshi YonedaYoshihiro MorimotoKiichi HiranoKoji SuzukiMasaru Takeuchi
    • Kiyoshi YonedaYoshihiro MorimotoKiichi HiranoKoji SuzukiMasaru Takeuchi
    • H01L21/223H01L21/336H01L29/786H01L21/339
    • H01L29/66757H01L21/2236H01L29/78621
    • To provide a manufacturing method of thin film transistors (TFT) using poly-silicone and having an LDD structure. In particular, the LDD sections of the TFTs are formed in an improved method so as to achieve a high throughput and stable performance of the TFTs. To be specific, the LD region is doped at a low concentration in the ion implantation method which includes mass spectrometry because high controllability over a dose is required. On the other hand, the source and drain regions are doped at a higher concentration than the LD region in the ion showering method which does not include mass spectrometry. Using the ion showering method, poly-crystal silicon can be doped such that less doping damage is caused thereto. This makes it possible to apply a lower temperature for annealing, such as RTA, to activate doped impurities so as to prevent the substrate from being curved. Further, combination of the ion implantation method and the showering method achieves a high throughput production of TFTs having stable performance.
    • 提供使用聚硅氧烷并具有LDD结构的薄膜晶体管(TFT)的制造方法。 特别地,TFT的LDD部分以改进的方法形成,以便实现TFT的高吞吐量和稳定的性能。 具体地说,在包括质谱法的离子注入方法中,以低浓度掺杂LD区域,因为需要剂量的高可控性。 另一方面,在不包括质谱法的离子喷淋法中,源极和漏极区域以比LD区域更高的浓度被掺杂。 使用离子喷淋法,可以掺杂多晶硅,使得对其造成较少的掺杂损伤。 这使得可以施加较低的退火温度,例如RTA,以激活掺杂杂质,以防止基板弯曲。 此外,离子注入方法和喷淋方法的组合实现了具有稳定性能的TFT的高产量生产。