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    • 1. 发明授权
    • Process and system for quality management and analysis of via drilling
    • 通孔钻孔质量管理与分析流程与系统
    • US07544304B2
    • 2009-06-09
    • US11484531
    • 2006-07-11
    • Hisashi MatsumotoMark SingerLeo BaldwinJeffrey E. HowertonDavid V. Childers
    • Hisashi MatsumotoMark SingerLeo BaldwinJeffrey E. HowertonDavid V. Childers
    • H01B13/00
    • H05K3/0035B23K26/03B23K26/06B23K26/389B23K2101/42H05K1/0269H05K2201/09454H05K2203/163
    • A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    • 用于在具有多个不同几何形状的多个捕获垫的电路基板的至少一层中激光形成盲通孔的方法可以包括:至少一个盲孔以形成在电路基板的至少一层中, 相对于在钻孔位置处形成的盲孔通孔几何值(例如面积和/或体积),距离钻孔位置预定距离内的捕获垫几何值(例如面积和/或体积)。 该过程可以包括基于评估设置至少一个激光操作参数,以便在盲通孔形成之后获得期望的捕获垫外观。 该过程可以包括将被定义为距电路基板的至少一层中的盲孔通孔位置的预定距离范围内的捕获区域成像,量化成像捕获区域的至少一个出现值,以及确定可接受性 基于量化外观值的成像捕获垫区域。
    • 4. 发明申请
    • PROCESS AND SYSTEM FOR QUALITY MANAGEMENT AND ANALYSIS OF VIA DRILLING
    • 钻井过程质量管理与分析系统
    • US20090179017A1
    • 2009-07-16
    • US12412853
    • 2009-03-27
    • Hisashi MatsumotoMark SingerLeo BaldwinJeffrey E. HowertonDavid V. Childers
    • Hisashi MatsumotoMark SingerLeo BaldwinJeffrey E. HowertonDavid V. Childers
    • B23K26/38
    • H05K3/0035B23K26/03B23K26/06B23K26/389B23K2101/42H05K1/0269H05K2201/09454H05K2203/163
    • A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    • 用于在具有多个不同几何形状的多个捕获垫的电路基板的至少一层中激光形成盲通孔的方法可以包括:至少一个盲孔以形成在电路基板的至少一层中, 相对于在钻孔位置处形成的盲孔通孔几何值(例如面积和/或体积),距离钻孔位置预定距离内的捕获垫几何值(例如面积和/或体积)。 该过程可以包括基于评估设置至少一个激光操作参数,以便在盲通孔形成之后获得期望的捕获垫外观。 该过程可以包括将被定义为距电路基板的至少一层中的盲孔通孔位置的预定距离范围内的捕获区域成像,量化成像捕获区域的至少一个出现值,以及确定可接受性 基于量化外观值的成像捕获垫区域。