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1. 发明授权

US08908455B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US08908455B2
公开(公告)日：2014-12-09
申请号：US13438731
申请日：2012-04-03
申请人： Hiroyuki Takahashi , Seiya Yamano
发明人： Hiroyuki Takahashi , Seiya Yamano
IPC分类号： G11C7/00 , G11C7/12 , G11C7/18 , H01L27/02 , H01L27/108 , H01L21/8234
CPC分类号： H01L29/42376 , G11C7/12 , G11C7/18 , H01L21/823437 , H01L27/0207 , H01L27/088 , H01L27/10897 , H01L29/1095
摘要： Transistors formed in one identical diffusion layer and performing complementary operations are generally arranged symmetrically with respect to the diffusion layer. A semiconductor integrated device using a layout capable of partially avoiding restriction on the design of the semiconductor integrated circuit device and reducing the size and economizing the manufacturing cost is provided by breaking the stereotype idea. The size of the semiconductor integrated circuit device can be decreased further by arranging two transistors formed in one identical diffusion layer and conducting complementary operations by intentionally arranging them in an asymmetric pattern.
摘要翻译：形成在一个相同扩散层中并执行互补操作的晶体管通常相对于扩散层对称地布置。使用能够部分地避免对半导体集成电路器件的设计的限制并且减小尺寸并节省制造成本的布局的半导体集成器件通过打破刻板印象的想法来提供。通过将形成在一个相同的扩散层中的两个晶体管布置并且通过有意地将它们排列成非对称图案来进行互补操作，可以进一步降低半导体集成电路器件的尺寸。

2. 发明授权

US06291879B1 Integrated circuit chip with improved locations of overvoltage protection elements 有权
标题翻译：集成电路芯片，具有改进的过电压保护元件位置
公开(公告)号：US06291879B1
公开(公告)日：2001-09-18
申请号：US09289640
申请日：1999-04-12
申请人： Seiya Yamano
发明人： Seiya Yamano
IPC分类号： H01L2704
CPC分类号： H01L27/0266 , H01L23/62 , H01L24/06 , H01L27/0248 , H01L2224/05554 , H01L2924/14 , H01L2924/3011 , H01L2924/00
摘要： On a semiconductor integrated circuit chip, multiple equipotential power-line conductors are provided to supply power to circuit elements. First protecting elements are provided for interconnecting the power-line conductors for protecting the circuit elements. A number of input/output pads are also connected to the power-line conductors via second protecting elements. The arrangement is such that the contact positions of any of the first protecting elements and any of the second protecting elements on the power-line conductors are nearer to respective end portions of the conductors than the contact position of any of the circuit elements on the conductors. Each of the contact positions serves as a dividing point for dividing a high potential electrostatic charge into at least two low potential charges.
摘要翻译：在半导体集成电路芯片上，提供多个等电位线路导体，以向电路元件供电。提供第一保护元件用于互连电力线导体以保护电路元件。多个输入/输出焊盘也通过第二保护元件连接到电力线导体。这种布置使得电力线导体上的任何第一保护元件和任何第二保护元件的接触位置比导体中任何电路元件的接触位置更接近导体的相应端部。每个接触位置用作将高电位静电电荷分成至少两个低电位电荷的分割点。

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