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    • 2. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20050207214A1
    • 2005-09-22
    • US11130464
    • 2005-05-16
    • Hiroyuki TakahashiAtsushi NakagawaHideo Inaba
    • Hiroyuki TakahashiAtsushi NakagawaHideo Inaba
    • G06F1/32G11C11/403G11C11/406G11C11/407G11C11/4074G11C11/00
    • G11C11/40615G11C11/406G11C11/4074G11C2207/2227G11C2211/4067
    • A semiconductor memory device is provided which effectively reduces a consumption of current of a system of circuits associated with refresh operations. A control signal circuit 2 controls n-channel transistors 3C, 4B to be in an OFF-state based on an internal chip select signal SCI in an interval time period between the refresh operations, wherein the n-channel transistors 3C, 4B are connected between the system of circuits associated with refresh operations (an internal voltage-down circuit 3 and a boost circuit 4) and the ground, so as to break down a leak path of the system of circuits associated with refresh operations for reducing the leakage of current. At a timing of starting the refresh operation by triggering a timer, the internal chip select signal SCI is transitioned to a high level for supplying a ground voltage to the internal voltage-down circuit 3 and the boost circuit 4.
    • 提供一种半导体存储器件,其有效地减少与刷新操作相关的电路系统的电流消耗。 在刷新操作之间的间隔时间内,控制信号电路2基于内部片选信号SCI控制n沟道晶体管3C,4B处于截止状态,其中n沟道晶体管3 C,4 B连接在与刷新操作(内部降压电路3和升压电路4)相关联的电路系统和地之间,以便分解与刷新操作相关联的电路系统的泄漏路径,以减少 电流泄漏。 在通过触发定时器开始刷新操作的定时,内部芯片选择信号SCI转换到用于向内部降压电路3和升压电路4提供接地电压的高电平。
    • 3. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06947345B2
    • 2005-09-20
    • US10473656
    • 2002-03-28
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • G11C7/22G11C11/406G11C11/4076G11C7/00
    • G11C11/40615G11C7/22G11C11/406G11C11/4076G11C2207/2227G11C2211/4061G11C2211/4067
    • A semiconductor memory device is provided, which is capable of effectively reducing a current comsumption caused by a self-refresh operation in a stand-by mode.In the refresh operation in the stand-by mode, under the control by a refresh control circuit 8B, firstly, a suppression is made for current driving abilities of sense amplifiers 70A˜70D provided for amplifying data signals appearing on bit lines, and secondly, an expansion is made of a pulse width of a row enable signal RE, which defines a period of time for selecting word lines WL, and thirdly, parallel activations of plural word lines are made based on the row enable signal RE with the expanded pulse width, thereby reducing the frequency of operations of the circuit system associated with the refresh operations, resulting in a suppression of the current consumption.
    • 提供一种半导体存储器件,其能够有效地降低由待机模式中的自刷新操作引起的电流消耗。 在待机模式的刷新操作中,在刷新控制电路8B的控制下,首先抑制用于放大位线上出现的数据信号的读出放大器70A〜70D的电流驱动能力, 其次,扩展行限制信号RE的脉冲宽度,该行允许信号RE定义了用于选择字线WL的时间段,第三,基于行允许信号RE进行多条字线的并行激活, 扩大的脉冲宽度,从而降低与刷新操作相关联的电路系统的操作频率,导致电流消耗的抑制。
    • 7. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06928020B2
    • 2005-08-09
    • US10858728
    • 2004-06-02
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • G11C11/403G11C7/10G11C11/401G11C11/406G11C11/407G11C11/408G11C7/00
    • G11C11/40615G11C11/406G11C11/408
    • A semiconductor memory device is provided which operates according to the specification of an SRAM, and which is capable of making the memory cycle shorter than heretofore, without normal access being delayed by the influence of refresh. An ATD circuit (4) receives change of an address (“Address”), and generates a one shot pulse in an address transition detect signal (ATD) after an address skew period has elapsed. In the case of a write request, a write enable signal (/WE) is dropped within the address skew period. First, writing or reading is performed from the rising edge of the one shot pulse, and, in the case of writing, late writing is performed using the address and the data which were presented at the time of the directly preceding write request. Next, refresh is performed during the period from the falling edge of the one shot pulse until the address skew period of the subsequent memory cycle is completed. And, for late writing at the time of the next write request, the address and the data are taken into register circuits (3, 12) upon the rising edge of the write enable signal (/WE).
    • 提供了一种半导体存储器件,其根据SRAM的规范进行操作,并且能够使存储器周期比以前更短,而没有正常访问被刷新的影响延迟。 ATD电路(4)接收地址变更(“Address”),在地址偏移期间经过后,在地址转换检测信号(ATD)中产生单次脉冲。 在写入请求的情况下,写入使能信号(/ WE)在地址偏移周期内被丢弃。 首先,从单触发脉冲的上升沿执行写入或读取,并且在写入的情况下,使用在直接写入请求时呈现的地址和数据执行后期写入。 接下来,在从单触发脉冲的下降沿到后续存储器周期的地址偏移周期完成的时间段期间执行刷新。 并且,对于在下次写请求时的迟写,地址和数据在写使能信号(/ WE)的上升沿被取入寄存器电路(3,12)。
    • 8. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06876592B2
    • 2005-04-05
    • US10220951
    • 2001-03-07
    • Hiroyuki TakahashiHideo InabaMasatoshi SonodaYoshiyuki KatoAtsushi Nakagawa
    • Hiroyuki TakahashiHideo InabaMasatoshi SonodaYoshiyuki KatoAtsushi Nakagawa
    • G11C11/403G11C11/401G11C11/406G11C11/407G11C11/408G11C29/04G11C7/00
    • G11C11/406G11C11/4087
    • A semiconductor memory device capable of accelerating address access and shortening cycle time is provided. A first address decoder (2) and first refresh address decoder (5) respectively decode an external address (Xn) supplied from outside the semiconductor memory device and a refresh address (RXn) used for refreshing within the semiconductor memory device. A multiplexer (8) selects the external address side decode signal (XnDm) or the refresh address side decode signal (XnRm) and outputs the signal as a decode signal (XnMm) based on an external address transmission signal (EXTR) and refresh address transmission signal (RFTR) so that a refresh operation and a read/write operation is performed continuously within one memory cycle. A word driver (10) then decodes decode signals (XnMm, XpMq) selected with multiplexer (8) and so forth, and activates a word line (WLmq).
    • 提供能够加速地址访问和缩短周期时间的半导体存储器件。 第一地址解码器(2)和第一刷新地址解码器(5)分别解码从半导体存储器件外部提供的外部地址(Xn)和在半导体存储器件内用于刷新的刷新地址(RXn)。 复用器(8)根据外部地址发送信号(EXTR)和刷新地址发送(EXTR),选择外部地址侧解码信号(XnDm)或刷新地址侧解码信号(XnRm),并输出作为解码信号(XnMm)的信号 信号(RFTR),使得在一个存储器周期内连续地执行刷新操作和读/写操作。 字驱动器(10)然后解码用多路复用器(8)等选择的解码信号(XnMm,XpMq),并激活字线(WLmq)。
    • 9. 发明授权
    • Semiconductor storage device
    • 半导体存储设备
    • US06834020B2
    • 2004-12-21
    • US10257193
    • 2002-10-09
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • Hiroyuki TakahashiHideo InabaAtsushi Nakagawa
    • G11C700
    • G11C11/40615G11C11/406G11C11/408
    • A semiconductor memory device is provided which operates according to the specification of an SRAM, and which is capable of making the memory cycle shorter than heretofore, without normal access being delayed by the influence of refresh. An ATD circuit (4) receives change of an address (“Address”), and generates a one shot pulse in an address transition detect signal (ATD) after an address skew period has elapsed. In the case of a write request, a write enable signal (/WE) is dropped within the address skew period. First, writing or reading is performed from the rising edge of the one shot pulse, and, in the case of writing, late writing is performed using the address and the data which were presented at the time of the directly preceding write request. Next, refresh is performed during the period from the falling edge of the one shot pulse until the address skew period of the subsequent memory cycle is completed. And, for late writing at the time of the next write request, the address and the data are taken into register circuits (3, 12) upon the rising edge of the write enable signal (/WE).
    • 提供了一种半导体存储器件,其根据SRAM的规范进行操作,并且能够使存储器周期比以前更短,而没有正常访问被刷新的影响延迟。 ATD电路(4)接收地址变更(“Address”),在地址偏移期间经过后,在地址转换检测信号(ATD)中产生单次脉冲。 在写入请求的情况下,写入使能信号(/ WE)在地址偏移周期内被丢弃。 首先,从单触发脉冲的上升沿执行写入或读取,并且在写入的情况下,使用在直接写入请求时呈现的地址和数据执行后期写入。 接下来,在从单触发脉冲的下降沿到后续存储器周期的地址偏移周期完成的时间段期间执行刷新。 并且,对于在下次写请求时的迟写,地址和数据在写使能信号(/ WE)的上升沿被取入寄存器电路(3,12)。
    • 10. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07145830B2
    • 2006-12-05
    • US11130464
    • 2005-05-16
    • Hiroyuki TakahashiAtsushi NakagawaHideo Inaba
    • Hiroyuki TakahashiAtsushi NakagawaHideo Inaba
    • G11C5/14
    • G11C11/40615G11C11/406G11C11/4074G11C2207/2227G11C2211/4067
    • A semiconductor memory device is provided which effectively reduces a consumption of current of a system of circuits associated with refresh operations. A control signal circuit 2 controls n-channel transistors 3C, 4B to be in an OFF-state based on an internal chip select signal SCI in an interval time period between the refresh operations, wherein the n-channel transistors 3C, 4B are connected between the system of circuits associated with refresh operations (an internal voltage-down circuit 3 and a boost circuit 4) and the ground, so as to break down a leak path of the system of circuits associated with refresh operations for reducing the leakage of current. At a timing of starting the refresh operation by triggering a timer, the internal chip select signal SCI is transitioned to a high level for supplying a ground voltage to the internal voltage-down circuit 3 and the boost circuit 4.
    • 提供一种半导体存储器件,其有效地减少与刷新操作相关的电路系统的电流消耗。 在刷新操作之间的间隔时间内,控制信号电路2基于内部芯片选择信号SCI控制n沟道晶体管3C,4B处于截止状态,其中n沟道晶体管3 C,4 B连接在与刷新操作(内部降压电路3和升压电路4)相关联的电路系统和地之间,以便分解与刷新操作相关联的电路系统的泄漏路径,以减少 电流泄漏。 在通过触发定时器开始刷新操作的定时,内部芯片选择信号SCI转换到用于向内部降压电路3和升压电路4提供接地电压的高电平。