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1. 发明申请

US20100148378A1 THERMOSETTING SILICONE RESIN COMPOSITION, SILICONE RESIN, SILICONE RESIN SHEET AND USE THEREOF 审中-公开
标题翻译：热固性硅树脂组合物，硅树脂，硅树脂板及其用途
公开(公告)号：US20100148378A1
公开(公告)日：2010-06-17
申请号：US12635748
申请日：2009-12-11
申请人： Hiroyuki KATAYAMA , Kazuya FUJIOKA
发明人： Hiroyuki KATAYAMA , Kazuya FUJIOKA
IPC分类号： H01L23/28 , C08G77/04 , C08G77/06 , C08G77/08
CPC分类号： B29D11/00365 , C08G77/12 , C08G77/16 , C08G77/20 , C08L83/04 , C09D183/04 , H01L23/296 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： The present invention relates to a thermosetting silicone resin composition including a condensation reactable substituent group-containing silicon compound and an addition reactable substituent group-containing silicon compound; a silicone resin; a silicone resin sheet obtained from the thermosetting silicone resin composition or the silicone resin, and a use thereof.
摘要翻译：本发明涉及含有可缩合反应性的含取代基的硅化合物和含可加成反应的含取代基的硅化合物的热固性有机硅树脂组合物; 硅树脂; 由热固性硅树脂组合物或有机硅树脂得到的有机硅树脂片及其用途。

2. 发明申请

US20110260209A1 COMPOSITION FOR SILICONE RESIN 有权
标题翻译：硅树脂组合物
公开(公告)号：US20110260209A1
公开(公告)日：2011-10-27
申请号：US13091743
申请日：2011-04-21
申请人： Hiroyuki KATAYAMA
发明人： Hiroyuki KATAYAMA
IPC分类号： H01L33/52 , C08L83/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： The present invention relates to a composition for a silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an organopolysiloxane having at least one alkenylsilyl group and at least two hydrosilyl groups in one molecule thereof; (3) a condensation catalyst; and (4) a hydrosilylation catalyst.
摘要翻译：本发明涉及一种有机硅树脂组合物，包括：（1）一端具有硅烷醇基的有机聚硅氧烷; （2）一分子中具有至少一个烯基甲硅烷基和至少两个氢化硅烷基的有机聚硅氧烷; （3）缩合催化剂; 和（4）氢化硅烷化催化剂。

3. 发明申请

US20090134426A1 RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME 有权
标题翻译：光学半导体元件封装和光子半导体器件获得的树脂
公开(公告)号：US20090134426A1
公开(公告)日：2009-05-28
申请号：US12277930
申请日：2008-11-25
申请人： Hiroyuki KATAYAMA , Asami KUBO
发明人： Hiroyuki KATAYAMA , Asami KUBO
IPC分类号： H01L33/00 , C08G77/14
CPC分类号： C08G77/58 , C08G77/56 , H01L23/293 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a resin for optical-semiconductor-element encapsulation obtained by reacting a silicon compound with a boron compound or an aluminum compound, wherein the silicon compound is represented by the following formula (I): wherein R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250, and an optical semiconductor device obtained with the resin.
摘要翻译：本发明涉及通过使硅化合物与硼化合物或铝化合物反应获得的光学半导体元件封装用树脂，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，并且多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250，由树脂制成的光半导体装置。

4. 发明申请

US20090014750A1 RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE 审中-公开
标题翻译：含有聚硅氧烷的光学半导体元件的树脂
公开(公告)号：US20090014750A1
公开(公告)日：2009-01-15
申请号：US12171028
申请日：2008-07-11
申请人： Hiroyuki KATAYAMA , Kouji AKAZAWA
发明人： Hiroyuki KATAYAMA , Kouji AKAZAWA
IPC分类号： H01L33/00 , C08G77/04
CPC分类号： C08G77/56 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a resin for optical semiconductor element encapsulation containing a polyborosiloxane obtained by reacting a silicon compound with a boron compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the invention exhibits an excellent advantage that it is excellent in all of heat resistance, transparency, and light resistance.
摘要翻译：本发明涉及一种用于光学半导体元件封装的树脂，其包含通过使硅化合物与硼化合物反应获得的聚硼硅氧烷; 以及包含树脂的光学半导体器件和用树脂封装的光学半导体元件。根据本发明的用于光学半导体元件封装的树脂具有优异的全部耐热性，透明性和耐光性的优点。

5. 发明申请

US20120028388A1 METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE 有权
标题翻译：用于生产发光二极管器件的方法
公开(公告)号：US20120028388A1
公开(公告)日：2012-02-02
申请号：US13180727
申请日：2011-07-12
申请人： Hiroyuki KATAYAMA
发明人： Hiroyuki KATAYAMA
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0041 , H01L2933/005 , H01L2924/00014
摘要： A method for producing a light-emitting diode device includes a step of preparing a sealing layer by sealing in a light-emitting diode with a sealing material; a step of preparing a fluorescent layer by allowing a phosphor-containing resin composition containing phosphor and silicone resin to reach its B-stage; and a step of bonding the fluorescent layer to the surface of the sealing layer.
摘要翻译：一种发光二极管器件的制造方法，其特征在于，包括：利用密封材料将发光二极管密封而形成密封层的工序; 通过使含有荧光体和有机硅树脂的含磷光体的树脂组合物达到B阶段来制备荧光层的步骤; 以及将荧光层接合到密封层的表面的步骤。

6. 发明申请

US20110301276A1 COMPOSITION FOR THERMOSETTING SILICONE RESIN 失效
标题翻译：热固性硅树脂组合物
公开(公告)号：US20110301276A1
公开(公告)日：2011-12-08
申请号：US13151366
申请日：2011-06-02
申请人： Hiroyuki KATAYAMA , Takashi KONDO , Hirokazu MATSUDA , Ryuichi KIMURA
发明人： Hiroyuki KATAYAMA , Takashi KONDO , Hirokazu MATSUDA , Ryuichi KIMURA
IPC分类号： C08K3/36
CPC分类号： C08J3/243 , C08G77/12 , C08G77/16 , C08G77/20 , C08J2383/04 , C08K3/36 , C08K5/5425 , C08K5/5435 , C08L83/04 , C09D183/04 , Y10T428/2995 , Y10T428/31663 , C08L83/00
摘要： The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less.
摘要翻译：本发明涉及一种热固性硅树脂组合物，包括：（1）一端具有硅烷醇基的有机聚硅氧烷; （2）含烯基的硅化合物; （3）含环氧基的硅化合物; （4）有机氢硅氧烷; （5）缩合催化剂; （6）氢化硅烷化催化剂; 和（7）二氧化硅粒子，其中，（7）二氧化硅粒子的体积累积直径为50〜50μm，粒径为1μm以下的粒子的含量为15个数量％以下粒径为60μm以上的粒子的含量为15数量％以下。

7. 发明申请

US20110248312A1 SILICONE RESIN SHEET 审中-公开
标题翻译：硅胶树脂片
公开(公告)号：US20110248312A1
公开(公告)日：2011-10-13
申请号：US13082446
申请日：2011-04-08
申请人： Hiroyuki KATAYAMA
发明人： Hiroyuki KATAYAMA
IPC分类号： H01L33/52 , C08G77/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L2205/02 , H01L33/56 , H01L51/0096 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： The present invention relates to a silicone resin sheet obtained by semi-curing a composition for a silicone resin, the composition including: (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule thereof; (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule thereof; (3) a hydrosilylation catalyst; and (4) a curing retardant.
摘要翻译：本发明涉及通过半固化有机硅树脂组合物获得的有机硅树脂片，该组合物包括：（1）一分子中具有至少两个烯基甲硅烷基的有机聚硅氧烷; （2）在其一个分子中具有至少两个氢化甲硅烷基的有机聚硅氧烷; （3）氢化硅烷化催化剂; 和（4）固化剂。

8. 发明申请

US20100225010A1 COMPOSITION FOR THERMOSETTING SILICONE RESIN 有权
标题翻译：热固性硅树脂组合物
公开(公告)号：US20100225010A1
公开(公告)日：2010-09-09
申请号：US12717161
申请日：2010-03-04
申请人： Hiroyuki KATAYAMA
发明人： Hiroyuki KATAYAMA
IPC分类号： H01L23/29 , C08L83/06
CPC分类号： H01L23/296 , C08G77/045 , C08G77/12 , C08G77/20 , C08L83/04 , H01L2924/0002 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： The present invention relates to a composition for a thermosetting silicone resin, the composition including: (A) an organohydrogenpolysiloxane; (B) an alkenyl group-containing epoxy compound; (C) an alkenyl group-containing cyclic siloxane; and (D) a hydrosilylation catalyst, a thermosetting silicone resin composition obtained by reacting the composition and a production method thereof, a photosemiconductor element-encapsulating material including the thermosetting silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the resin composition or the photosemiconductor element-encapsulating material.
摘要翻译：本发明涉及一种热固性硅树脂组合物，该组合物包括：（A）有机氢聚硅氧烷; （B）含链烯基的环氧化合物; （C）含烯基的环状硅氧烷; 和（D）氢化硅烷化催化剂，通过使组合物及其制备方法反应得到的热固性有机硅树脂组合物，包含该热固性有机硅树脂组合物的光半导体元件封装材料和包含用该树脂组合物包封的光半导体元件的光半导体装置或光半导体元件封装材料。

9. 发明申请

US20090227757A1 MODIFIED POLYALUMINOSILOXANE 有权
标题翻译：改性聚氨酯硅氧烷
公开(公告)号：US20090227757A1
公开(公告)日：2009-09-10
申请号：US12364731
申请日：2009-02-03
申请人： Hiroyuki KATAYAMA , Kouji Akazawa
发明人： Hiroyuki KATAYAMA , Kouji Akazawa
IPC分类号： C08G77/22
CPC分类号： C08G77/58 , C09D183/14
摘要： A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).
摘要翻译：通过用式（I）表示的硅烷偶联剂处理聚铝硅氧烷获得的改性聚铝硅氧烷：其中R1，R2和R3各自独立地为烷基或烷氧基; X是甲基丙烯酰氧基，缩水甘油氧基，氨基，乙烯基或巯基，条件是R 1，R 2和R 3中的至少两个是烷氧基。本发明的光半导体元件封装材料适合用于例如安装有蓝色或白色LED元件的光半导体器件（液晶显示器的背光灯，交通灯，户外大显示器，广告牌等）。

10. 发明申请

US20130099395A1 SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE 有权
标题翻译：硅胶树脂组合物，包封层，反射器和光学半导体器件
公开(公告)号：US20130099395A1
公开(公告)日：2013-04-25
申请号：US13653813
申请日：2012-10-17
申请人： Haruka ONA , Hiroyuki KATAYAMA
发明人： Haruka ONA , Hiroyuki KATAYAMA
IPC分类号： C08L83/05 , H01L23/29 , C09D183/05
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , H01L23/296 , H01L33/56 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. (where, in formula, R1 represents a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. R2 represents hydrogen or a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. The molar ratio of the monovalent hydrocarbon group:hydrogen in R2 in the cage octasilsesquioxane as a whole is, as an average value, in the range of 6.5:1.5 to 5.5:2.5.)
摘要翻译：硅氧烷树脂组合物含有具有下式（1）表示的基团的保持基倍半硅氧烷，含有在笼式八倍半硅氧烷中的含有大于氢化甲硅烷基的摩尔数的链烯基的含烯基的聚硅氧烷，氢化硅烷化催化剂，和有机氢聚硅氧烷。（式中，R1表示选自饱和烃基和芳香族烃基的一价烃基，R2表示氢或选自饱和烃基和芳香族烃基的一价烃基，单价烃基：笼中八氢倍半硅氧烷中的R2中的氢作为平均值在6.5:1.5至5.5:2.5的范围内。）

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