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    • 5. 发明申请
    • Apparatus and Method for Cleaning a Board Terminal
    • 清洁电路板端子的装置和方法
    • US20090065029A1
    • 2009-03-12
    • US11887459
    • 2006-03-30
    • Masaya WatanabeShinjiro TsujiKeiji FujiwaraRyouichirou Katano
    • Masaya WatanabeShinjiro TsujiKeiji FujiwaraRyouichirou Katano
    • B08B7/04B08B1/02
    • B08B1/008G02F1/1303G02F1/13458G02F2001/1316
    • A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.
    • 一种用于通过使清洁构件与基板的端子部分接触来清洁端子部分的板端子清洁装置包括:将清洁构件支撑在第一位置的第一支撑构件,将清洁构件支撑在第一位置的第二支撑构件 第二位置,通过使所述部件与所述基板的所述端子部接触来对被支撑在所述第一位置和所述第二位置之间的所述清洁部件的一部分进行加压的清洁头,使所述第一支撑部件移动的支撑部件移动部件, 支撑构件沿着端子部分的方向,以及清洁头移动单元,其以沿着第一支撑构件和第二支撑构件的第一移动速度的第二移动速度沿着端子部分的方向移动清洁头, 支撑构件移动单元。
    • 6. 发明授权
    • Apparatus and method for cleaning a board terminal
    • 清洁电路板端子的装置和方法
    • US07799142B2
    • 2010-09-21
    • US11887459
    • 2006-03-30
    • Masaya WatanabeShinjiro TsujiKeiji FujiwaraRyouichirou Katano
    • Masaya WatanabeShinjiro TsujiKeiji FujiwaraRyouichirou Katano
    • B08B1/04
    • B08B1/008G02F1/1303G02F1/13458G02F2001/1316
    • A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.
    • 一种用于通过使清洁构件与基板的端子部分接触来清洁端子部分的板端子清洁装置包括:将清洁构件支撑在第一位置的第一支撑构件,将清洁构件支撑在第一位置的第二支撑构件 第二位置,通过使所述部件与所述基板的所述端子部接触来对被支撑在所述第一位置和所述第二位置之间的所述清洁部件的一部分进行加压的清洁头,使所述第一支撑部件移动的支撑部件移动部件, 支撑构件沿着端子部分的方向,以及清洁头移动单元,其以沿着第一支撑构件和第二支撑构件的第一移动速度的第二移动速度沿着端子部分的方向移动清洁头, 支撑构件移动单元。
    • 8. 发明授权
    • Method for transferring a substrate
    • 转移基材的方法
    • US07716818B2
    • 2010-05-18
    • US11884036
    • 2006-02-01
    • Shinjiro TsujiTakahiko MurataKeiji FujiwaraKozo Odawara
    • Shinjiro TsujiTakahiko MurataKeiji FujiwaraKozo Odawara
    • B23P19/00
    • H05K13/0061G02F1/1333G02F2001/133354Y10T29/4913Y10T29/49133Y10T29/53178Y10T29/53191
    • A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.
    • 一种用于转印衬底的方法包括使彼此相对的第一和第二衬底保持部分移动,移动保持衬底的第一衬底台,以设置在第一和第二衬底保持部之间,将衬底从第一衬底平台输送到 第一和第二基板保持部分,通过由第一基板台释放基板的保持并且通过第一和第二基板保持部分保持基板,将第一和第二基板保持部分从第一基板接收位置移动到第二基板保持部分 移动第二基板台以便在第二基板接收位置处设置在第一和第二基板保持部之间的间隔中,并且通过释放基板将基板输送到第二基板台,以及 通过第二衬底台保持衬底。