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1. 发明申请

US20050179023A1 Method and apparatus for removing thin metal films 失效
标题翻译：去除薄金属薄膜的方法和装置
公开(公告)号：US20050179023A1
公开(公告)日：2005-08-18
申请号：US11103182
申请日：2005-04-11
申请人： Hiroyuki Daiku , Hidehiko Maehata , Masanori Tsukahara , Shogo Hamada , Tetsuya Inoue , Hiroshi Hamasaki
发明人： Hiroyuki Daiku , Hidehiko Maehata , Masanori Tsukahara , Shogo Hamada , Tetsuya Inoue , Hiroshi Hamasaki
IPC分类号： C25F5/00 , C25F7/00 , H01L29/00
CPC分类号： C25F7/00 , C25F5/00
摘要： A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.
摘要翻译：公开了一种用于去除薄金属膜的系统。该系统包括用于引导向下电解质流的倾斜金属板电极，设置在金属板电极的上游或下游侧的辅助电极，使得辅助电极的一部分浸入电解质中，以及用于向两个电极施加直流电压。该系统用于通过使电解液从金属板电极向下流动冲击金属薄膜，同时向金属板电极和辅助电极施加直流电压，从而去除绝缘体表面上的金属薄膜。

2. 发明授权

US07544283B2 Method and apparatus for removing thin metal films 失效
标题翻译：去除薄金属薄膜的方法和装置
公开(公告)号：US07544283B2
公开(公告)日：2009-06-09
申请号：US11103182
申请日：2005-04-11
申请人： Hiroyuki Daiku , Hidehiko Maehata , Masanori Tsukahara , Shogo Hamada , Tetsuya Inoue , Hiroshi Hamasaki
发明人： Hiroyuki Daiku , Hidehiko Maehata , Masanori Tsukahara , Shogo Hamada , Tetsuya Inoue , Hiroshi Hamasaki
IPC分类号： B23H7/26 , C25F3/14 , B23H3/00 , C25B15/00
CPC分类号： C25F7/00 , C25F5/00
摘要： A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.
摘要翻译：公开了一种用于去除薄金属膜的系统。该系统包括用于引导向下电解质流的倾斜金属板电极，设置在金属板电极的上游或下游侧的辅助电极，使得辅助电极的一部分浸入电解质中，以及用于向两个电极施加直流电压。该系统用于通过使电解液从金属板电极向下流动冲击金属薄膜，同时向金属板电极和辅助电极施加直流电压，从而去除绝缘体表面上的金属薄膜。

3. 发明申请

US20120153344A1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：制造半导体发光器件的方法
公开(公告)号：US20120153344A1
公开(公告)日：2012-06-21
申请号：US13406840
申请日：2012-02-28
申请人： Hiroshi Hamasaki , Akihiro Kojima , Yoshiaki Sugizaki
发明人： Hiroshi Hamasaki , Akihiro Kojima , Yoshiaki Sugizaki
IPC分类号： H01L33/36
CPC分类号： H01L33/62 , H01L33/0008 , H01L33/0016 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/56 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , Y10S438/94
摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer; a p-side electrode provided on the second surface of the semiconductor layer in a region including the light emitting layer; an n-side electrode provided on the second surface of the semiconductor layer in a region not including the light emitting layer; an insulating film being more flexible than the semiconductor layer, the insulating film provided on the second surface and a side surface of the semiconductor layer, and the insulating film having a first opening reaching the p-side electrode and a second opening reaching the n-side electrode; a p-side interconnection layer provided on the insulating film and connected to the p-side electrode; and an n-side interconnection layer provided on the insulating film and connected to the n-side electrode.
摘要翻译：根据一个实施例，半导体发光器件包括半导体层，包括第一表面，与第一表面相对的第二表面和发光层; p侧电极，设置在包括发光层的区域中的半导体层的第二表面上; 在不包括发光层的区域中设置在半导体层的第二表面上的n侧电极; 绝缘膜比半导体层更柔性，设置在第二表面上的绝缘膜和半导体层的侧表面，绝缘膜具有到达p侧电极的第一开口和到达p侧电极的第二开口，侧电极; p侧互连层，设置在绝缘膜上并连接到p侧电极; 以及设置在绝缘膜上并连接到n侧电极的n侧互连层。

4. 发明授权

US07667982B2 LSI package with interface module and interface module 失效
标题翻译： LSI封装带接口模块和接口模块
公开(公告)号：US07667982B2
公开(公告)日：2010-02-23
申请号：US12187853
申请日：2008-08-07
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/222 , G02B6/4284 , H05K2201/09063 , H05K2201/10356 , H05K2203/167
摘要： An LSI package includes an interface module having first and second surfaces and including a wiring board having a first through hole, a driver selectively provided on the second surface, a transmission line connected to the driver, and a first terminal formed on the second surface and connected to the driver, an interposer having a third surface facing the second surface and a fourth surface, and including a signal processor and a second terminal provided on the third surface, a third terminal provided on the fourth surface and a second through hole, the third surface facing the second surface except a region where the driver portion is provided. The interposer is arranged so that the first through hole matches with the second through hole, and a movable guide pin is inserted into the first and second through holes to position the interface module and the interposer.
摘要翻译： LSI封装包括具有第一表面和第二表面的接口模块，并且包括具有第一通孔的布线板，选择性地设置在第二表面上的驱动器，连接到驱动器的传输线，以及形成在第二表面上的第一端子，连接到驱动器的插入器，具有面向第二表面的第三表面和第四表面的插入器，并且包括设置在第三表面上的信号处理器和第二端子，设置在第四表面上的第三端子和第二通孔，第三表面面对除了设置有驱动器部分的区域之外的第二表面。插入器布置成使得第一通孔与第二通孔匹配，并且可移动引导销插入到第一和第二通孔中以定位接口模块和插入器。

5. 发明授权

US07411282B2 LSI package provided with interface module, and transmission line header employed in the package 失效
标题翻译： LSI封装提供接口模块，并在封装中采用传输线头
公开(公告)号：US07411282B2
公开(公告)日：2008-08-12
申请号：US11081617
申请日：2005-03-17
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/02
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

6. 发明授权

US07255493B2 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US07255493B2
公开(公告)日：2007-08-14
申请号：US11442276
申请日：2006-05-30
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

7. 发明授权

US07187048B2 Semiconductor light-receiving device 失效
标题翻译：半导体光接收装置
公开(公告)号：US07187048B2
公开(公告)日：2007-03-06
申请号：US09813827
申请日：2001-03-22
申请人： Hiroshi Hamasaki
发明人： Hiroshi Hamasaki
IPC分类号： H01L27/14
CPC分类号： H01L31/103
摘要： A semiconductor light-receiving device includes a plurality of first conductive type second semiconductor layers formed on a first surface of a first conductive type semiconductor substrate apart from each other. Each of the first conductive type second semiconductor layers is surrounded by a second conductive type third semiconductor layer with a first semiconductor layer therebetween. The first semiconductor layer has a lower impurity concentration than the second semiconductor layers. By completely depleting the first semiconductor layer occupying a large area within the light-receiving surface, the light entering the light-receiving surface is enabled to contribute to a photoelectric current while reducing the light absorption in the second semiconductor layers, so that the sensitivity characteristics of the semiconductor light-receiving device can be made superior and the production cost can be lowered.
摘要翻译：半导体光接收装置包括形成在第一导电型半导体基板的彼此分离的第一表面上的多个第一导电类型的第二半导体层。第一导电型第二半导体层中的每一个被其间具有第一半导体层的第二导电型第三半导体层包围。第一半导体层的杂质浓度比第二半导体层低。通过完全耗尽在光接收表面内占据大面积的第一半导体层，进入光接收表面的光能够有助于光电流，同时减少第二半导体层中的光吸收，使得灵敏度特性可以使半导体光接收装置更好，并且可以降低生产成本。

8. 发明申请

US20060291783A1 Member holding optical transmission line and optical module 失效
标题翻译：会员持有光传输线和光模块
公开(公告)号：US20060291783A1
公开(公告)日：2006-12-28
申请号：US11472367
申请日：2006-06-22
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36
CPC分类号： G02B6/4212 , G02B6/4249
摘要： In an optical module, a member has a hole and a mounting surface in which the hole is open and electric wiring is formed. A recess is formed in the mounting surface. The electric wiring is formed in the recess and is continuously extended to an outside the recess. The electric wiring is provided with a connecting portion on a bottom surface of the recess. An optical transmission line is inserted into the hole and its optical input or optical output end is faced to the optical semiconductor device so as to be optically coupled to the optical transmission line. The semiconductor device is mounted on the mounting surface and electrically connected to the connecting portion. The gap between the optical semiconductor device and the opening end face of the optical transmission line is filled with an adhesive.
摘要翻译：在光学模块中，构件具有孔和安装表面，孔中打开孔并形成电布线。在安装面上形成凹部。电气配线形成在凹部中，并且连续地延伸到凹部的外侧。电气配线在凹部的底面设置有连接部。光传输线插入孔中，其光输入或光输出端面对光半导体器件，以光耦合到光传输线。半导体器件安装在安装表面上并电连接到连接部分。光学半导体器件与光传输线的开口端面之间的间隙填充有粘合剂。

9. 发明申请

US20060215969A1 Optical semiconductor module and its manufacturing method 有权
公开(公告)号：US20060215969A1
公开(公告)日：2006-09-28
申请号：US11442276
申请日：2006-05-30
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

10. 发明申请

US20060045434A1 Optical semiconductor module and semiconductor device including the same 失效
标题翻译：光半导体模块及其半导体装置
公开(公告)号：US20060045434A1
公开(公告)日：2006-03-02
申请号：US11200045
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/4201 , G02B6/4253 , G02B6/4255 , G02B6/428 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1305 , H01L2924/15311 , H05K1/0274 , H01L2924/00 , H01L2224/0401
摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one. end face of the optical transmission line, and is electrically connected to the wiring layer.
摘要翻译：光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层安装面。光学半导体元件安装在引导件的光学半导体安装表面上，其发光表面或其光接收表面面向一个。并且与导线层电连接。

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