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    • 3. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20110316069A1
    • 2011-12-29
    • US12886010
    • 2010-09-20
    • Hiroyasu TANAKARyota KATSUMATA
    • Hiroyasu TANAKARyota KATSUMATA
    • H01L29/792
    • H01L27/11551H01L27/11526H01L27/11548H01L27/11556H01L29/66825H01L29/7889
    • According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a non-memory unit. The memory unit includes a stacked structure including electrode films stacked in a first direction, and a interelectrode insulating film provided between the electrode films, a select gate electrode stacked with the stacked structure along the first direction, a semiconductor pillar piercing the stacked structure and the select gate electrode along the first direction and a pillar portion memory layer provided between the electrode films and the semiconductor pillar. The non-memory unit includes a dummy conductive film including a portion in a layer being identical to at least one of the electrode films, a dummy select gate electrode in a layer being identical to the select gate electrode, a first non-memory unit contact electrode electrically connected to the dummy conductive and a second non-memory unit contact electrode electrically connected to the dummy select gate.
    • 根据一个实施例,非易失性半导体存储器件包括存储器单元和非存储器单元。 存储单元包括堆叠结构,其包括在第一方向上堆叠的电极膜,以及设置在电极膜之间的电极间绝缘膜,沿着第一方向堆叠层叠结构的选择栅电极,穿过层叠结构的半导体柱和 沿着第一方向选择栅电极和设置在电极膜和半导体柱之间的柱部存储层。 非存储单元包括虚拟导电膜,其包括与至少一个电极膜相同的层中的部分,与选择栅电极相同的层中的虚拟选择栅电极,第一非存储单元触点 电连接到虚拟导电体的电极和与虚拟选择栅极电连接的第二非存储单元接触电极。
    • 10. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20120135593A1
    • 2012-05-31
    • US13366509
    • 2012-02-06
    • Masaru KITOYoshiaki FUKUZUMIRyota KATSUMATAMasaru KIDOHHiroyasu TANAKAMegumi ISHIDUKIYosuke KOMORIHideaki AOCHI
    • Masaru KITOYoshiaki FUKUZUMIRyota KATSUMATAMasaru KIDOHHiroyasu TANAKAMegumi ISHIDUKIYosuke KOMORIHideaki AOCHI
    • H01L21/336
    • H01L27/11578H01L27/11582H01L29/66833H01L29/792H01L29/7926
    • A nonvolatile semiconductor memory device includes a plurality of memory strings, each of which has a plurality of electrically rewritable memory cells connected in series; and select transistors, one of which is connected to each of ends of each of the memory strings. Each of the memory strings is provided with a first semiconductor layer having a pair of columnar portions extending in a perpendicular direction with respect to a substrate, and a joining portion formed so as to join lower ends of the pair of columnar portions; a charge storage layer formed so as to surround a side surface of the columnar portions; and a first conductive layer formed so as to surround the side surface of the columnar portions and the charge storage layer, and configured to function as a control electrode of the memory cells. Each of the select transistors is provided with a second semiconductor layer extending upwardly from an upper surface of the columnar portions; and a second conductive layer formed so as to surround a side surface of the second semiconductor layer with a gap interposed, and configured to function as a control electrode of the select transistors.
    • 非易失性半导体存储器件包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元; 并选择晶体管,其中一个连接到每个存储器串的每一端。 每个存储器串都具有第一半导体层,该第一半导体层具有相对于基板在垂直方向上延伸的一对柱状部分,以及形成为连接该一对柱状部分的下端的接合部分; 形成为围绕所述柱状部的侧面的电荷存储层; 以及形成为围绕柱状部分的侧面和电荷存储层的第一导电层,并且被配置为用作存储单元的控制电极。 每个选择晶体管设置有从柱状部分的上表面向上延伸的第二半导体层; 以及第二导电层,其被形成为以间隔开的方式围绕所述第二半导体层的侧表面,并且被配置为用作所述选择晶体管的控制电极。