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1. 发明授权

US07224052B2 IC card with controller and memory chips 有权
标题翻译： IC卡带控制器和内存芯片
公开(公告)号：US07224052B2
公开(公告)日：2007-05-29
申请号：US10408256
申请日：2003-04-08
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02 , H01L23/52 , H01L23/538 , H01L23/58 , G06K19/07
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定的外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

2. 发明申请

US20070102530A1 IC CARD 有权
公开(公告)号：US20070102530A1
公开(公告)日：2007-05-10
申请号：US11619129
申请日：2007-01-02
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/06 , H01L23/02
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

3. 发明授权

US06431456B1 IC card 有权
公开(公告)号：US06431456B1
公开(公告)日：2002-08-13
申请号：US09810509
申请日：2001-03-19
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K1906
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

4. 发明授权

US07768110B2 Nonvolatile memory apparatus 有权
标题翻译：非易失存储器
公开(公告)号：US07768110B2
公开(公告)日：2010-08-03
申请号：US11865721
申请日：2007-10-01
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/067 , H01L23/48
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定的外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

5. 发明授权

US07547961B2 IC card with bonding wire connections of different lengths 失效
标题翻译：具有不同长度的接合线连接的IC卡
公开(公告)号：US07547961B2
公开(公告)日：2009-06-16
申请号：US11619135
申请日：2007-01-02
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02 , H01L23/52 , H01L23/538 , H01L23/58 , G06K19/07 , H01L23/62
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

6. 发明授权

US07267287B2 IC card 有权
标题翻译： IC卡
公开(公告)号：US07267287B2
公开(公告)日：2007-09-11
申请号：US11619129
申请日：2007-01-02
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/06 , G06K7/06
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

7. 发明授权

US06573567B1 IC card 有权
公开(公告)号：US06573567B1
公开(公告)日：2003-06-03
申请号：US09689663
申请日：2000-10-13
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L2362
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

8. 发明授权

US08018038B2 IC card with terminals for direct access to internal components 有权
标题翻译：带有终端的IC卡，用于直接访问内部组件
公开(公告)号：US08018038B2
公开(公告)日：2011-09-13
申请号：US12835847
申请日：2010-07-14
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02 , H01L23/52 , H01L23/538 , H01L23/58 , G06K19/07
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

9. 发明申请

US20080023562A1 IC CARD 有权
标题翻译： IC卡
公开(公告)号：US20080023562A1
公开(公告)日：2008-01-31
申请号：US11865721
申请日：2007-10-01
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/067
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定的外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

10. 发明申请

US20070102799A1 IC CARD 失效
标题翻译： IC卡
公开(公告)号：US20070102799A1
公开(公告)日：2007-05-10
申请号：US11619135
申请日：2007-01-02
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

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