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1. 发明授权

US5262922A Heat radiation structure for semiconductor device 失效
标题翻译：半导体器件的散热结构
公开(公告)号：US5262922A
公开(公告)日：1993-11-16
申请号：US842331
申请日：1992-03-26
申请人： Hiroshi Yamaji , Takashi Kanno , Takashi Sato , Riichi Magome , Tomoyuki Hongho
发明人： Hiroshi Yamaji , Takashi Kanno , Takashi Sato , Riichi Magome , Tomoyuki Hongho
IPC分类号： H01L23/40 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/40 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H05K2201/083 , H05K2201/10409 , H05K2201/10416 , H05K2201/10689
摘要： A heat radiation structure is provided for a semiconductor device, by which a mounting height of the semiconductor device can be lowered to increase an accommodation density in a shelf, and the mounting/dismounting is easily carried out. In a heat-radiation structure for a semiconductor device, in which a semiconductor device (2) is mounted on a printed circuit board (1) so that the bottom surface thereof confronts an opening (1a) formed in the printed circuit board, a heat-conductive member (3, 11) is brought into tight contact with the bottom surface of the semiconductor device and the opposite end surface of thereof is protruded through the opening (1a) from the back side of the printed circuit board while in tight contact with a heat-radiation plate (4) disposed at that position, so that heat generated from the semiconductor device is transmitted to the heat-radiation plate (4) via the heat-conductive member (3, 11) and radiated from the outer surface thereof into air. At least one of the semiconductor device (2) and the heat-radiation plate (4) is made of a magnetic substance so that the two members are brought into tight contact with the heat-conductive member by the attraction force of a permanent magnet (3, 10) disposed between the two members.
摘要翻译： PCT No.PCT / JP91 / 01006 Sec。 371日期：1992年3月26日 102（e）1992年3月26日PCT PCT 1991年7月26日PCT公布。出版物WO92 / 02117 日本1992年2月6日。为半导体器件提供散热结构，通过该辐射结构可以降低半导体器件的安装高度以增加搁板中的调节密度，并且容易进行安装/拆卸。在半导体器件的散热结构中，其中将半导体器件（2）安装在印刷电路板（1）上，使得其底表面面对形成在印刷电路板中的开口（1a），热量导电构件（3,11）与半导体器件的底表面紧密接触，并且其相对端表面从印刷电路板的背面突出穿过开口（1a），同时与设置在该位置处的散热板（4），使得从半导体器件产生的热量经由导热部件（3,11）传递到散热板（4），并从其外表面辐射进入空气半导体器件（2）和散热板（4）中的至少一个由磁性物质制成，使得两个部件通过永磁体的吸引力与导热部件紧密接触（ 3,10）设置在两个构件之间。

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