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1. 发明申请

US20100304551A1 PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD USING THE PROTECTIVE FILM AGENT 审中-公开
标题翻译：使用保护膜代理的激光剥离保护膜和波浪加工方法
公开(公告)号：US20100304551A1
公开(公告)日：2010-12-02
申请号：US12707102
申请日：2010-02-17
申请人： Hiroshi TAKANASHI , Atsushi KAWAKAMI , Toshiyuki YOSHIKAWA , Nobuyasu KITAHARA
发明人： Hiroshi TAKANASHI , Atsushi KAWAKAMI , Toshiyuki YOSHIKAWA , Nobuyasu KITAHARA
IPC分类号： H01L21/78 , C08K5/09
CPC分类号： C09D5/32 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
摘要翻译：根据本发明的用于激光切割的保护膜剂包括溶解在其中的水溶性树脂和至少一种选自水溶性染料，水溶性着色剂，和水溶性紫外线吸收剂。将保护膜剂涂布在待加工的晶片的表面上，然后干燥以形成保护膜。通过保护膜的激光切割从晶片产生芯片。结果，可以在芯片的整个表面（包括它们的周缘部分）上有效地防止碎屑沉积。

2. 发明申请

US20090215246A1 METHOD FOR BREAKING ADHESIVE FILM MOUNTED ON BACK OF WAFER 有权
标题翻译：打破胶片背面的胶片的方法
公开(公告)号：US20090215246A1
公开(公告)日：2009-08-27
申请号：US12390024
申请日：2009-02-20
申请人： Nobuyasu KITAHARA , Yuki OGAWA
发明人： Nobuyasu KITAHARA , Yuki OGAWA
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , B23K26/0624 , B23K2103/42 , B23K2103/50 , C09J5/06 , C09J2203/326 , C09J2205/302 , C09J2463/00 , H01L21/78
摘要： A method for breaking an adhesive film mounted on the back of a wafer having a plurality of streets formed in a lattice pattern on the face of the wafer, and having devices formed in a plurality of regions demarcated by the plurality of streets, the devices being divided individually, is adapted to break the adhesive film along the outer peripheral edges of the individual devices, with the adhesive film being stuck to the surface of a dicing tape mounted on an annular frame. The method comprises: a laser processing step of projecting a laser beam with a pulse width of 100 picoseconds or less onto the adhesive film through gaps between the individually divided devices to form deteriorated layers in the adhesive film along the outer peripheral edges of the individual devices; and an adhesive film breaking step of exerting external force on the adhesive film having the deteriorated layers formed therein, to break the adhesive film along the deteriorated layers.
摘要翻译：一种用于破坏安装在晶片背面上的粘合膜的方法，所述粘合膜具有形成在所述晶片表面上的格子图案中的多个街道，并且具有形成在由所述多个街道划分的多个区域中的装置，所述装置是单独地分割，适于沿着各个装置的外围边缘破坏粘合剂膜，粘合剂膜粘附到安装在环形框架上的切割带的表面。该方法包括：激光加工步骤，通过各个分割装置之间的间隙，将具有100皮秒脉冲宽度的激光束投射到粘合剂膜上，以沿着各个装置的外围边缘形成粘合膜中的劣化层 ; 以及在其上形成有劣化层的粘合剂膜上施加外力的粘合膜断裂步骤，以沿着劣化层破坏粘合膜。

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