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    • 1. 发明申请
    • Information-recording medium
    • 信息记录介质
    • US20080260985A1
    • 2008-10-23
    • US12068531
    • 2008-02-07
    • Hiroshi ShiraiKazuyoshi AdachiOsamu IshizakiTsuyoshi Onuma
    • Hiroshi ShiraiKazuyoshi AdachiOsamu IshizakiTsuyoshi Onuma
    • G11B7/24
    • G11B7/24038G11B2007/24312G11B2007/24314G11B2007/24316
    • An information-recording medium includes first and second recording layers each of which is formed of a phase-change material containing Bi, Ge, and Te, wherein the first recording layer is arranged nearer to a light-incident side of the laser beam than the second recording layer; a composition of Bi, Ge, and Te contained in the second recording layer is within a composition range surrounded by composition points B2, C2, D2, D6, C6, and B6 on a triangular composition diagram of Bi, Ge, and Te; and a difference (α−δ) between a composition α of Bi in the first recording layer and a composition δ of Bi in the second recording layer is −1.0 to 3.0 at. %. Thus, there is provided a two-layered information-recording medium with high recording-data reliability and excellent repeated-data recording durability.
    • 信息记录介质包括第一和第二记录层,每个记录层由包含Bi,Ge和Te的相变材料形成,其中第一记录层被布置成比激光束的光入射侧更靠近激光束的光入射侧 第二记录层; 包含在第二记录层中的Bi,Ge和Te的组成在组成点B 2,C 2,D 2,D 6,C 6和B 6的组成范围内,Bi的三角形组成图上, Ge,Te; 并且第一记录层中Bi的组成α和第二记录层中Bi的组成δ之差(α-δ)为-1.0至3.0at。 %。 因此,提供了具有高记录数据可靠性和优异的重复数据记录耐久性的双层信息记录介质。
    • 4. 发明申请
    • Electrical connector
    • 电连接器
    • US20060003607A1
    • 2006-01-05
    • US11218877
    • 2005-09-02
    • Hiroshi ShiraiShinichi Hashimoto
    • Hiroshi ShiraiShinichi Hashimoto
    • H01R12/00
    • H05K7/1069H01R12/714H01R13/24
    • The electrical connector of the present invention has an insulative housing having a first face across from a first electrical circuit and a second face across from a second electrical circuit. A plurality of contacts are mounted in the insulative housing, each of which contacts a contact point of the first electrical circuit at the first face, and contacts a contact point of the second electrical circuit at the second face, thereby interconnecting the first and second circuits. Each of the contacts has one portion of the contact supported by the insulative housing so as to be capable of pivoting in response to the displacement of the first contact portion and the second contact portion.
    • 本发明的电连接器具有绝缘壳体,其具有与第一电路相对的第一面和跨越第二电路的第二面。 多个触点安装在绝缘壳体中,每个触点接触第一面处的第一电路的接触点,并且在第二面处接触第二电路的接触点,从而将第一和第二电路 。 每个触点具有由绝缘壳体支撑的触点的一部分,以便能够响应于第一接触部分和第二接触部分的位移而枢转。
    • 5. 发明授权
    • LGA socket contact
    • LGA插座触点
    • US06976888B2
    • 2005-12-20
    • US10662006
    • 2003-09-12
    • Hiroshi ShiraiShinichi HashimotoHidenori Taguchi
    • Hiroshi ShiraiShinichi HashimotoHidenori Taguchi
    • H01R33/76H01R4/48H01R13/24H05K7/10
    • H01R13/2442H01R12/52H01R12/714H05K7/1069
    • A land grid array socket contact has a resilient contact that extends parallel to a base plate and is attached to at least one side walls of the base plate by a curved section angled approximately 180 degrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board. In another embodiment, the land grid array socket contact has a resilient contact extending from an upper end of a base plate. The resilient contact has an elongated slit substantially in a center of the resilient contact with respect to a direction of width and a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.
    • 平面栅格阵列插座接触件具有平行于基板延伸的弹性接触件,并且通过与所述至少一个侧壁成大约180度的弯曲部分附接到所述基板的至少一个侧壁。 弹性接触件具有用于接触接触垫的自由端。 板端子从基板的下端延伸以连接到电路板。 在另一个实施例中,焊盘格栅阵列插座接触件具有从基板的上端延伸的弹性接触。 弹性接触件具有相对于宽度方向基本上位于弹性接触件的中心的细长狭缝和用于接触接触垫的自由端。 板端子从基板的下端延伸以连接到电路板。
    • 6. 发明授权
    • Wafer defect measuring method and apparatus
    • 晶圆缺陷测量方法和装置
    • US06734960B1
    • 2004-05-11
    • US09589087
    • 2000-06-08
    • Hiroyuki GotoHiroyuki SaitoMakiko FujinamiHiroshi Shirai
    • Hiroyuki GotoHiroyuki SaitoMakiko FujinamiHiroshi Shirai
    • G01N2100
    • C30B29/06G01N21/95G01N21/956G01N25/00H01L22/12
    • The depth and a relative dimensional factor of a defect present in the interior of a silicon wafer are measured, and the number of such defects is calculated. A laser beam having a larger energy than the band gap of silicon is radiated obliquely to the semiconductor wafer and a scattered beam from a defect present in a subsurface layer of the wafer is detected by an image pick-up device. The temperature of the wafer is changed to at least two temperatures of T1 and T2 or to any one of plural temperatures by means of a heater and the intensity of a scattered beam is measured. It is taken into account that the light absorbance of silicon and the penetration depth of light in silicon vary depending on temperature, to determine the depth and a relative dimensional factor of an internal defect which causes scattering of light, as well as the number of such crystal defects.
    • 测量存在于硅晶片内部的缺陷的深度和相对尺寸因子,并计算出这些缺陷的数量。 具有比硅的带隙大的能量的激光束被倾斜地辐射到半导体晶片,并且由图像拾取装置检测来自晶片的地下层中存在的缺陷的散射光束。 通过加热器将晶片的温度改变为T1和T2的至少两个温度或多个温度中的任何一个,并测量散射光束的强度。 考虑到硅的吸光度和硅中的光的穿透深度根据温度而变化,以确定导致光散射的内部缺陷的深度和相对尺寸因子,以及其数量 晶体缺陷。