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    • 9. 发明授权
    • Epoxy resin composition for a copper-clad laminate
    • 覆铜层压板用环氧树脂组合物
    • US4833204A
    • 1989-05-23
    • US240604
    • 1988-09-06
    • Masami YusaKatsuji ShibataYasuo Miyadera
    • Masami YusaKatsuji ShibataYasuo Miyadera
    • C08L63/02C08G59/68C08L63/00H05K1/03
    • H05K1/0326C08G59/686C08L63/00
    • An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.
    • 一种用于覆铜层压板的环氧树脂组合物,其包含在一个分子中具有至少两个环氧基的环氧树脂,在一个分子中具有至少两个官能团的酚化合物作为硬化剂,具有掩蔽的亚氨基的咪唑化合物作为 硬化促进剂和选自由式R 1 -NH-CO-NH 2表示的脲衍生物的一种或多种氮化合物,其中R 1是氢或有机基团; 酰胺化合物; 和胍衍生物,其有利地用于覆铜层压板的材料。 因此,覆铜层压板特别用于制造印刷电路板,其显着提高了其铜箔的开孔性,耐剥离性,粘合性和耐热性。 此外,该环氧树脂组合物具有优异的储存稳定性。