会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • CLEANING COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
    • 清洁组合物和生产半导体器件的方法
    • US20100029085A1
    • 2010-02-04
    • US12530766
    • 2008-03-06
    • Hiroshi MatsunagaMasaru OhtoHideo KashiwagiHiroshi Yoshida
    • Hiroshi MatsunagaMasaru OhtoHideo KashiwagiHiroshi Yoshida
    • H01L21/306H01L21/308G03F7/42
    • H01L21/31133C11D3/3947C11D7/06C11D7/36C11D11/0047G03F7/423G03F7/425H01L21/02063
    • A cleaning composition of a semiconductor device for laminating an organosiloxane-based thin film and a photoresist layer in this order on a substrate having a low dielectric interlayer insulation film and a copper wiring or a copper alloy wiring, then applying selective exposure and development treatments to the subject photoresist layer to form a photoresist pattern, subsequently applying a dry etching treatment to the organosiloxane-based thin film and the low dielectric interlayer insulation film while using this resist pattern as a mask and then removing the organosiloxane-based thin film, a residue generated by the dry etching treatment, a modified photoresist having been modified by the dry etching treatment and an unmodified photoresist layer located in a lower layer than the modified photoresist, the cleaning composition containing from 15 to 20% by mass of hydrogen peroxide, from 0.0001 to 0.003% by mass of an amino polymethylene phosphonic acid, from 0.02 to 0.5% by mass of potassium hydroxide and water and having a pH of from 7.5 to 8.5, is provided. Also, a method for manufacturing a semiconductor device using the subject cleaning composition is provided.
    • 一种用于在具有低介电层间绝缘膜和铜布线或铜合金布线的基板上依次层叠有机硅氧烷类薄膜和光致抗蚀剂层的半导体装置的清洗组合物,然后对其进行选择性曝光和显影处理 该主体光致抗蚀剂层形成光致抗蚀剂图案,随后在使用该抗蚀剂图案作为掩模的同时对有机硅氧烷类薄膜和低介电层间绝缘膜进行干蚀刻处理,然后除去有机硅氧烷类薄膜,残留物 通过干蚀刻处理产生的改性光致抗蚀剂,通过干蚀刻处理改性的改性光致抗蚀剂和位于比改性光致抗蚀剂低的层中的未改性光致抗蚀剂层,清洗组合物含有15〜20质量%的过氧化氢,0.0001 至0.003质量%的氨基聚亚甲基膦酸,为0.02〜0.5质量% 氢氧化钾和水,pH为7.5至8.5。 另外,提供了使用该被检体组合物的半导体装置的制造方法。
    • 3. 发明授权
    • Cleaning composition and process for producing semiconductor device
    • 清洁组合物和半导体器件制造工艺
    • US07977292B2
    • 2011-07-12
    • US12530766
    • 2008-03-06
    • Hiroshi MatsunagaMasaru OhtoHideo KashiwagiHiroshi Yoshida
    • Hiroshi MatsunagaMasaru OhtoHideo KashiwagiHiroshi Yoshida
    • C11D7/18
    • H01L21/31133C11D3/3947C11D7/06C11D7/36C11D11/0047G03F7/423G03F7/425H01L21/02063
    • A cleaning composition of a semiconductor device for laminating an organosiloxane-based thin film and a photoresist layer in this order on a substrate having a low dielectric interlayer insulation film and a copper wiring or a copper alloy wiring, then applying selective exposure and development treatments to the subject photoresist layer to form a photoresist pattern, subsequently applying a dry etching treatment to the organosiloxane-based thin film and the low dielectric interlayer insulation film while using this resist pattern as a mask and then removing the organosiloxane-based thin film, a residue generated by the dry etching treatment, a modified photoresist having been modified by the dry etching treatment and an unmodified photoresist layer located in a lower layer than the modified photoresist, the cleaning composition containing from 15 to 20% by mass of hydrogen peroxide, from 0.0001 to 0.003% by mass of an amino polymethylene phosphonic acid, from 0.02 to 0.5% by mass of potassium hydroxide and water and having a pH of from 7.5 to 8.5, is provided. Also, a method for manufacturing a semiconductor device using the subject cleaning composition is provided.
    • 一种用于在具有低介电层间绝缘膜和铜布线或铜合金布线的基板上依次层叠有机硅氧烷类薄膜和光致抗蚀剂层的半导体装置的清洗组合物,然后对其进行选择性曝光和显影处理 该主体光致抗蚀剂层形成光致抗蚀剂图案,随后在使用该抗蚀剂图案作为掩模的同时对有机硅氧烷类薄膜和低介电层间绝缘膜进行干蚀刻处理,然后除去有机硅氧烷类薄膜,残留物 通过干蚀刻处理产生的改性光致抗蚀剂,通过干蚀刻处理改性的改性光致抗蚀剂和位于比改性光致抗蚀剂低的层中的未改性光致抗蚀剂层,清洗组合物含有15〜20质量%的过氧化氢,0.0001 至0.003质量%的氨基聚亚甲基膦酸,为0.02〜0.5质量% 氢氧化钾和水,pH为7.5至8.5。 另外,提供了使用该被检体组合物的半导体装置的制造方法。
    • 8. 发明授权
    • Transmission system, transmission device, and clock synchronization method
    • 传输系统,传输设备和时钟同步方法
    • US08867681B2
    • 2014-10-21
    • US13248215
    • 2011-09-29
    • Hiroshi Yoshida
    • Hiroshi Yoshida
    • H04L7/00G06F1/12H04J3/06
    • G06F1/12H04J3/0685
    • A transmission system which couples a plurality of transmission devices to a control device includes a first transmission device which is one of the plurality of transmission devices; a first calculation circuit which calculates a first difference value indicating a frequency difference value between a common clock supplied from the control device and a first clock as a clock used in the first transmission device; and a transmitter which reports the first difference value to a second transmission device other than the first transmission device, wherein the second transmission device comprises: a second calculation circuit which calculates a second difference value indicating a frequency difference value between the common clock and a second clock used in the second transmission device, and a frequency controller which controls an oscillator generating the second clock so that the second difference value approaches the first difference value reported from the first transmission device.
    • 将多个传输设备耦合到控制设备的传输系统包括作为多个传输设备之一的第一传输设备; 第一计算电路,其计算指示从所述控制装置提供的公共时钟与所述第一时钟之间的频率差值作为所述第一发送装置中使用的时钟的第一差值; 以及向所述第一发送装置以外的第二发送装置报告所述第一差分值的发送机,其中,所述第二发送装置包括:第二计算电路,其计算表示所述公共时钟与第二发送装置之间的频率差值的第二差分值 在第二发送装置中使用的时钟,以及频率控制器,其控制产生第二时钟的振荡器,使得第二差值接近从第一发送装置报告的第一差值。