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    • 3. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20060023512A1
    • 2006-02-02
    • US11193456
    • 2005-08-01
    • Hiroshi MaejimaKoji Hosono
    • Hiroshi MaejimaKoji Hosono
    • G11C11/34
    • G11C16/0483G11C16/10
    • A semiconductor memory device is disclosed, which includes a plurality of NAND cells each comprising a plurality of series-connected memory cell transistors, and a drain-side select transistor and a source-side select transistor connected to a drain-side end and a source-side end of the series-connected memory cell transistors, respectively, a source line commonly connected to the source-side select transistors in the plurality of NAND cells, a first discharge circuit which is connected between the source line and a reference potential and whose conduction/non-conduction is controlled by a first control signal, and a second discharge circuit which is connected between the source line and the reference potential and whose conduction/non-conduction is controlled by a second control signal different from the first control signal.
    • 公开了一种半导体存储器件,其包括多个NAND单元,每个NAND单元包括多个串联存储单元晶体管,漏极侧选择晶体管和源极侧选择晶体管连接到漏极侧端和源极 串联的存储单元晶体管的端部分别是与多个NAND单元中的源极侧选择晶体管共同连接的源极线,连接在源极线和参考电位之间的第一放电电路, 导通/非导通由第一控制信号控制,第二放电电路连接在源极线和参考电位之间,其导通/非导通由与第一控制信号不同的第二控制信号控制。
    • 5. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08085576B2
    • 2011-12-27
    • US12710661
    • 2010-02-23
    • Koji HosonoHiroshi Maejima
    • Koji HosonoHiroshi Maejima
    • G11C11/00
    • G11C8/14G11C13/00G11C13/0004G11C13/0011G11C13/0023G11C13/0028G11C13/0069G11C2013/0076G11C2013/0088G11C2013/009G11C2213/72
    • A semiconductor memory device comprises: a memory cell array having memory cells disposed at a crossing-point of a plurality of first lines and a plurality of second lines and a control circuit configured to apply a first voltage to selected one or more of the first lines, and to apply a second voltage having a value smaller than the first voltage to selected one of the second lines, such that a certain potential difference is applied to selected one or more of the memory cells. The control circuit adjusts the second voltage based on a position of the selected one or more of the memory cells within the memory cell array and a number of the selected one or more of the memory cells on which an operation is simultaneously executed, during application of the potential difference to the selected one or more of the memory cells.
    • 半导体存储器件包括:存储单元阵列,其具有设置在多个第一线的交叉点处的存储单元和多条第二线;以及控制电路,被配置为向所选择的一条或多条第一条线施加第一电压 并且将具有小于第一电压的值的第二电压施加到所选择的第二行中的一个,使得对所选择的一个或多个存储器单元施加一定的电位差。 控制电路根据存储单元阵列内所选择的一个或多个存储器单元的位置以及在其中同时执行操作的所选择的一个或多个存储器单元的数量来调整第二电压, 与所选择的一个或多个存储器单元的电位差。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07835181B2
    • 2010-11-16
    • US11839341
    • 2007-08-15
    • Hiroshi MaejimaKoji Hosono
    • Hiroshi MaejimaKoji Hosono
    • G11C11/34
    • G11C16/0483G11C16/10
    • A semiconductor memory device is disclosed, which includes a plurality of NAND cells each comprising a plurality of series-connected memory cell transistors, and a drain-side select transistor and a source-side select transistor connected to a drain-side end and a source-side end of the series-connected memory cell transistors, respectively, a source line commonly connected to the source-side select transistors in the plurality of NAND cells, a first discharge circuit which is connected between the source line and a reference potential and whose conduction/non-conduction is controlled by a first control signal, and a second discharge circuit which is connected between the source line and the reference potential and whose conduction/ non-conduction is controlled by a second control signal different from the first control signal.
    • 公开了一种半导体存储器件,其包括多个NAND单元,每个NAND单元包括多个串联存储单元晶体管,漏极侧选择晶体管和源极侧选择晶体管连接到漏极侧端和源极 串联的存储单元晶体管的端部分别是与多个NAND单元中的源极侧选择晶体管共同连接的源极线,连接在源极线和参考电位之间的第一放电电路, 导通/非导通由第一控制信号控制,第二放电电路连接在源极线和参考电位之间,其导通/非导通由与第一控制信号不同的第二控制信号控制。
    • 7. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME
    • 半导体存储器件及其操作方法
    • US20100208510A1
    • 2010-08-19
    • US12707298
    • 2010-02-17
    • Koji HOSONOHiroshi Maejima
    • Koji HOSONOHiroshi Maejima
    • G11C11/00G11C29/00
    • G11C13/0011G11C13/00G11C13/0004G11C13/0023G11C13/0028G11C13/0069G11C29/025G11C29/83G11C2013/009G11C2213/72
    • A semiconductor memory device comprises: a memory cell array having memory cells disposed at a crossing-point of a plurality of first lines and a plurality of second lines; and a control circuit configured to apply a first voltage to selected one of the first lines, and to apply a second voltage to selected one of the second lines. The control circuit comprises: a first isolation latch circuit configured to set the first lines to a floating state; and a second isolation latch circuit configured to set the second lines to the floating state. During a forming operation, the first and second isolation latch circuits set one of the first lines and one of the second lines to which a defective memory cell is connected to the floating state, the defective memory cell being one of the memory cells that allows a current to flow due to application of a voltage.
    • 半导体存储器件包括:存储单元阵列,具有设置在多个第一线和多条第二线的交叉点处的存储单元; 以及控制电路,被配置为将第一电压施加到所选择的第一行中的一个,并且将第二电压施加到所选择的第二行中的一个。 所述控制电路包括:第一隔离锁存电路,被配置为将所述第一线路设置为浮置状态; 以及第二隔离锁存电路,被配置为将第二线路设置为浮置状态。 在成形操作期间,第一和第二隔离锁存电路将缺陷存储单元连接到浮动状态的第一行和第二行中的一个设置为有缺陷的存储单元, 电流由于施加电压而流动。
    • 8. 发明申请
    • NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND DATA PROGRAMMING METHOD THEREOF
    • 非易失性半导体存储设备及其数据编程方法
    • US20100046275A1
    • 2010-02-25
    • US12544276
    • 2009-08-20
    • Koji HosonoHiroshi MaejimaYuri Terada
    • Koji HosonoHiroshi MaejimaYuri Terada
    • G11C7/00G11C11/00G11C5/02
    • G11C5/02G11C5/063G11C8/10
    • The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling.
    • 半导体存储装置包括:存储单元阵列,具有各自具有串联连接的整流元件和可变电阻元件的存储单元,所述存储单元配置在多个第一布线和多个第二布线的交叉部分;以及控制单元 电路被配置为控制对第一线的充电。 控制电路将连接到所选存储单元的第一线充电至第一电位,然后将第一导线设置为浮置状态。 然后,将连接到所选择的存储器单元的第一引线附近的另一个第一导线充电到第二电位。 因此,连接到所选择的存储单元的第一线的电位通过耦合而上升到第三电位。
    • 9. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07505311B2
    • 2009-03-17
    • US11840525
    • 2007-08-17
    • Hiroshi MaejimaKoji Hosono
    • Hiroshi MaejimaKoji Hosono
    • G11C11/24G11C7/12
    • G11C16/24G11C16/0483G11C16/26
    • A semiconductor memory device includes a memory cell array with electrically rewritable and non-volatile memory cells arranged therein, and a bit line control circuit connected to a bit line of the memory cell array to control and detect the bit line voltage in accordance with operation modes, wherein the bit line control circuit comprises a first transistor and a second transistor with a breakdown voltage higher than that of the first transistor, the second transistor being disposed between the first transistor and a bit line in the memory cell array to be serially connected to the first transistor, and wherein a connection node between the first and second transistors is fixed in potential at a data erase time.
    • 一种半导体存储器件包括其中布置有电可重写和非易失性存储单元的存储单元阵列,以及连接到存储单元阵列的位线的位线控制电路,以根据操作模式控制和检测位线电压 ,其中所述位线控制电路包括具有比所述第一晶体管的击穿电压高的击穿电压的第一晶体管和第二晶体管,所述第二晶体管设置在所述第一晶体管和所述存储单元阵列中的位线之间以串联连接到 第一晶体管,并且其中第一和第二晶体管之间的连接节点在数据擦除时间被固定为电位。
    • 10. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07259985B2
    • 2007-08-21
    • US11245195
    • 2005-10-07
    • Hiroshi MaejimaKoji Hosono
    • Hiroshi MaejimaKoji Hosono
    • G11C11/24G11C7/12
    • G11C16/24G11C16/0483G11C16/26
    • A semiconductor memory device includes a memory cell array with electrically rewritable and non-volatile memory cells arranged therein, and a bit line control circuit connected to a bit line of the memory cell array to control and detect the bit line voltage in accordance with operation modes, wherein the bit line control circuit comprises a first transistor and a second transistor with a breakdown voltage higher than that of the first transistor, the second transistor being disposed between the first transistor and a bit line in the memory cell array to be serially connected to the first transistor, and wherein a connection node between the first and second transistors is fixed in potential at a data erase time.
    • 一种半导体存储器件包括其中布置有电可重写和非易失性存储单元的存储单元阵列,以及连接到存储单元阵列的位线的位线控制电路,以根据操作模式控制和检测位线电压 ,其中所述位线控制电路包括具有比所述第一晶体管的击穿电压高的击穿电压的第一晶体管和第二晶体管,所述第二晶体管设置在所述第一晶体管和所述存储单元阵列中的位线之间以串联连接到 第一晶体管,并且其中第一和第二晶体管之间的连接节点在数据擦除时间被固定为电位。