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    • 4. 发明申请
    • INFORMATION PROCESSING APPARATUS AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE
    • 信息处理设备和非易失性半导体存储设备
    • US20100220437A1
    • 2010-09-02
    • US12782601
    • 2010-05-18
    • Hisao Tsukazawa
    • Hisao Tsukazawa
    • G06F1/16
    • G06F1/203G06F1/206
    • An information processing apparatus including: a main unit; a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow; and a nonvolatile semiconductor storage device that is provided within the main unit to be used as an external storage device, the device including: a printed circuit board; a nonvolatile semiconductor memory that is mounted on the printed circuit board; a memory controller that is mounted on the printed circuit board and controls the nonvolatile semiconductor memory; and a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device, wherein the memory controller is disposed at an upstream side of the air flow and the temperature sensor is disposed at a downstream side of the air flow.
    • 一种信息处理设备,包括:主单元; 将空气吸入主机的冷却风扇,用空气流在主机内冷却; 以及设置在所述主单元内以用作外部存储装置的非易失性半导体存储装置,所述装置包括:印刷电路板; 安装在印刷电路板上的非易失性半导体存储器; 存储器控制器,其安装在印刷电路板上并控制非易失性半导体存储器; 以及温度传感器,其安装在所述印刷电路板上并检测所述非易失性半导体存储装置内的温度,其中所述存储器控制器设置在所述空气流的上游侧,并且所述温度传感器设置在所述空气流的下游侧 。
    • 7. 发明申请
    • Information Processing Apparatus and Semiconductor Storage Drive
    • 信息处理设备和半导体存储驱动器
    • US20090171513A1
    • 2009-07-02
    • US12330278
    • 2008-12-08
    • Hisao Tsukazawa
    • Hisao Tsukazawa
    • G05D23/00
    • G06F1/206G06F1/203
    • An information processing apparatus includes: a nonvolatile semiconductor storage device that is used as an external storage device, the device including: a printed circuit board; a nonvolatile semiconductor memory that is mounted on the printed circuit board; a memory controller that is mounted on the printed circuit board and controls the nonvolatile semiconductor memory; and a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device; and a main controller that performs a process to lower the temperature of the nonvolatile semiconductor storage device based on the temperature detected by the temperature sensor provided in the nonvolatile semiconductor storage device.
    • 一种信息处理装置,包括:非易失性半导体存储装置,其用作外部存储装置,所述装置包括:印刷电路板; 安装在印刷电路板上的非易失性半导体存储器; 存储器控制器,其安装在印刷电路板上并控制非易失性半导体存储器; 以及安装在印刷电路板上并检测非易失性半导体存储装置内的温度的温度传感器; 以及主控制器,其执行基于由设置在非易失性半导体存储装置中的温度传感器检测到的温度来降低非易失性半导体存储装置的温度的处理。
    • 8. 发明授权
    • Information processing apparatus and nonvolatile semiconductor storage device
    • 信息处理装置和非易失性半导体存储装置
    • US08760858B2
    • 2014-06-24
    • US13352265
    • 2012-01-17
    • Hisao Tsukazawa
    • Hisao Tsukazawa
    • G06F1/16G06F1/20
    • G06F1/203G06F1/206
    • An information processing apparatus may include a housing, a board accommodated inside the housing, a plurality of memories mounted on the board, a temperature sensor mounted on the board to be adjacent to one of the memories, and a memory controller mounted on the board to be adjacent to the temperature sensor and configured to acquire temperature information detected by the temperature sensor. The temperature sensor may be mounted on a central portion of the board so as to be positioned between one side of the memory controller and one side of the one of the memories. Other embodiments are also described.
    • 信息处理装置可以包括壳体,容纳在壳体内的板,安装在板上的多个存储器,安装在板上以与其中一个存储器相邻的温度传感器,以及安装在板上的存储器控​​制器 与温度传感器相邻并且被配置为获取由温度传感器检测到的温度信息。 温度传感器可以安装在板的中心部分上,以便位于存储器控制器的一侧和存储器之一的一侧之间。 还描述了其它实施例。
    • 9. 发明申请
    • Information Processing Apparatus and Semiconductor Storage Drive
    • 信息处理设备和半导体存储驱动器
    • US20120271482A1
    • 2012-10-25
    • US13523596
    • 2012-06-14
    • Hisao Tsukazawa
    • Hisao Tsukazawa
    • G05D23/00
    • G06F1/206G06F1/203
    • An information processing apparatus includes a case having a side wall formed with an exhaust port; a cooling fan configured to suction air inside the case and discharge the air through the exhaust port; a first circuit board on which a main processor is mounted and disposed in the case; and a second circuit board disposed in the case to align with the first circuit board along the side wall. Mounted on the second circuit board is a memory device, a memory controller that controls the memory device, and a temperature sensor. The memory controller performs a process to lower a temperature of the memory device based on a temperature detected by the temperature sensor.
    • 一种信息处理设备,包括具有形成有排气口的侧壁的壳体; 冷却风扇,其构造成吸入所述壳体内部的空气,并且排出所述空气通过所述排气口; 第一电路板,其上安装有主处理器并布置在壳体中; 以及设置在壳体中以沿着侧壁与第一电路板对准的第二电路板。 安装在第二电路板上的是存储器件,控制存储器件的存储器控​​制器和温度传感器。 存储器控制器执行基于由温度传感器检测的温度来降低存储器件的温度的处理。
    • 10. 发明授权
    • Information processing apparatus and nonvolatile semiconductor storage device
    • 信息处理装置和非易失性半导体存储装置
    • US08130492B2
    • 2012-03-06
    • US12782603
    • 2010-05-18
    • Hisao Tsukazawa
    • Hisao Tsukazawa
    • G06F1/20H05K7/20
    • G06F1/203G06F1/206
    • An information processing apparatus including: a main unit; a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow; and a nonvolatile semiconductor storage device that is provided within the main unit to be used as an external storage device, the device including: a printed circuit board; a nonvolatile semiconductor memory that is mounted on the printed circuit board; a memory controller that is mounted on the printed circuit board and controls the nonvolatile semiconductor memory; and a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device, wherein the memory controller is disposed at an upstream side of the air flow and the temperature sensor is disposed at a downstream side of the air flow.
    • 一种信息处理设备,包括:主单元; 将空气吸入主机的冷却风扇,用空气流在主机内冷却; 以及设置在所述主单元内以用作外部存储装置的非易失性半导体存储装置,所述装置包括:印刷电路板; 安装在印刷电路板上的非易失性半导体存储器; 存储器控制器,其安装在印刷电路板上并控制非易失性半导体存储器; 以及温度传感器,其安装在所述印刷电路板上并检测所述非易失性半导体存储装置内的温度,其中所述存储器控制器设置在所述空气流的上游侧,并且所述温度传感器设置在所述空气流的下游侧 。