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1. 发明授权

US6054222A Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet 失效
标题翻译：环氧树脂组合物，使用其的树脂封装的半导体器件，环氧树脂成型材料和环氧树脂复合片剂
公开(公告)号：US6054222A
公开(公告)日：2000-04-25
申请号：US26338
申请日：1998-02-19
申请人： Hiromichi Takami , Kazutaka Matsumoto , Satoshi Takayama , Tetsuo Okuyama
发明人： Hiromichi Takami , Kazutaka Matsumoto , Satoshi Takayama , Tetsuo Okuyama
IPC分类号： C08K3/36 , C08K5/00 , H01L23/29 , B32B17/10 , B32B27/38
CPC分类号： H01L23/293 , C08K3/36 , C08K5/0008 , H01L2924/0002
摘要： An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) a cure accelerator and (d) silica powder. The silica powder (d) is composed of (d1) a first silica powder having a particle diameter ranging from 5 to 75 .mu.m, (d2) a second silica powder having a particle diameter ranging from 0.2 to 0.9 .mu.m, and (d3) a third silica powder having a particle diameter ranging from 0.01 to 0.08 .mu.m.
摘要翻译：一种环氧树脂组合物，其包含（a）环氧树脂，（b）固化剂，（c）固化促进剂和（d）二氧化硅粉末。二氧化硅粉末（d）由（d1）粒径为5〜75μm的第一二氧化硅粉末（d2），粒径为0.2〜0.9μm的第二二氧化硅粉末和（d3 ）第二二氧化硅粉末，其粒径范围为0.01至0.08μm。

2. 发明授权

US08531496B2 Image forming apparatus having a plurality of laser elements 有权
标题翻译：具有多个激光元件的图像形成装置
公开(公告)号：US08531496B2
公开(公告)日：2013-09-10
申请号：US13224419
申请日：2011-09-02
申请人： Kazutaka Matsumoto
发明人： Kazutaka Matsumoto
IPC分类号： B41J2/45
CPC分类号： G02B26/123
摘要： An image forming apparatus has a speed range showing image forming capability per unit time that is determined in advance, and is settable to either a model set at a relatively low-speed range or a model set at a relatively high-speed range. Then, the arrangement of the laser elements is differentiated between a low-speed machine and a high-speed machine each other. Even when timing of writing for the high-speed machine is applied to the arrangement of the laser elements for the low-speed machine to write in an image, the image is not able to be written successfully, and resulting in an image which is displaced vertically.
摘要翻译：图像形成装置具有表示预先确定的每单位时间的图像形成能力的速度范围，并且可设置为设定在相对低速范围的模型或设定在较高速度范围的模型。然后，激光元件的配置在低速机与高速机之间相互不同。即使将高速机的写入时间应用于低速机的激光元件的配置来写入图像，也不能成功地写入图像，并且导致图像被移位垂直。

3. 发明授权

US08022979B2 Endoscope system 有权
标题翻译：内窥镜系统
公开(公告)号：US08022979B2
公开(公告)日：2011-09-20
申请号：US11503708
申请日：2006-08-14
申请人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
发明人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
IPC分类号： A62B1/04 , A61B1/04
CPC分类号： A61B1/0052 , A61B1/00048 , A61B1/00052 , A61B1/04
摘要： The endoscope system of the present invention includes: an endoscope that has an image pickup device that picks up an observation image of a test object; an image display unit that converts image pickup signals that have been sent from the image pickup device into images and then displays these images; a first mounting portion that is provided in an operating section of the endoscope and on which the image display unit is mounted; and a second mounting portion that is provided in the operating section of the endoscope and on which the image display unit is mounted in a different position from that of the first mounting portion.
摘要翻译：本发明的内窥镜系统包括：内窥镜，其具有拾取测试对象的观察图像的图像拾取装置; 图像显示单元，其将已经从图像拾取装置发送的图像拾取信号转换成图像，然后显示这些图像; 第一安装部，其设置在所述内窥镜的操作部中，并且安装所述图像显示单元; 以及第二安装部，其设置在所述内窥镜的操作部中，并且所述图像显示单元安装在与所述第一安装部的位置不同的位置。

4. 发明授权

US4719255A Epoxy resin composition for encapsulation of semi-conductor device 失效
标题翻译：用于半导体器件封装的环氧树脂组合物
公开(公告)号：US4719255A
公开(公告)日：1988-01-12
申请号：US760770
申请日：1985-07-31
申请人： Akira Yoshizumi , Hisayuki Hirai , Kazutaka Matsumoto , Shinetsu Fujieda , Michiya Higashi
发明人： Akira Yoshizumi , Hisayuki Hirai , Kazutaka Matsumoto , Shinetsu Fujieda , Michiya Higashi
IPC分类号： C08L63/00 , H01B3/40
CPC分类号： H01B3/40 , C08L63/00
摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.
摘要翻译：用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。

5. 发明授权

US07604154B2 Thermosetting flux and solder paste 失效
标题翻译：热固性助焊剂和焊膏
公开(公告)号：US07604154B2
公开(公告)日：2009-10-20
申请号：US11756714
申请日：2007-06-01
申请人： Kazutaka Matsumoto , Masahiro Tadauchi , Izuru Komatsu
发明人： Kazutaka Matsumoto , Masahiro Tadauchi , Izuru Komatsu
IPC分类号： B23K31/02 , B23K35/34
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K2101/40 , H05K3/3489 , H05K2201/10977
摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.
摘要翻译：本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料，铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香，和丙烯酸改性松香。焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

6. 外观设计

USD549332S1 Endoscope 失效
标题翻译：内窥镜
公开(公告)号：USD549332S1
公开(公告)日：2007-08-21
申请号：US29214553
申请日：2004-06-10
申请人： Kazutaka Matsumoto , Eijiro Sato , Kaoru Tsuruoka , Masanori Yajima
设计人： Kazutaka Matsumoto , Eijiro Sato , Kaoru Tsuruoka , Masanori Yajima

7. 发明申请

US20050218525A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device 审中-公开
标题翻译：焊接材料，半导体器件，焊接方法以及制造半导体器件的方法
公开(公告)号：US20050218525A1
公开(公告)日：2005-10-06
申请号：US11058323
申请日：2005-02-16
申请人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi
发明人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi
IPC分类号： B23K1/19 , B23K1/00 , B23K35/00 , B23K35/26 , B23K101/40 , B32B15/01 , C22C5/02 , C22C5/06 , C22C13/00 , H01L21/52 , H01L21/60 , H05K3/34 , H01L21/44 , H01L29/40
CPC分类号： B23K35/262 , B23K35/007 , H01L24/29 , H01L24/80 , H01L2224/29111 , H01L2224/83101 , H01L2224/8381 , H01L2224/83825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/157 , H05K3/3463 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
摘要： The soldered material relating to the present invention comprises a first metallic material to be soldered; a second metallic material to be soldered; and a soldering layer containing tin and a high melting point metal, interposed between the first metallic material and the second metallic material to solder both metallic materials together, wherein the second metallic material is materials selected from the groups consisting of copper, gold, silver, a gold and palladium based alloy containing gold and palladium as main constituents, and a silver and palladium based alloy containing silver and palladium as main constituents, and the soldering layer has a plurality of granular intermetallic compound phase composed of constituent elements for the second metallic material and tin being dispersed in a cross-sectional microstructure.
摘要翻译：涉及本发明的焊接材料包括待焊接的第一金属材料; 待焊接的第二金属材料; 以及包含锡和高熔点金属的焊接层，插入在第一金属材料和第二金属材料之间以将两种金属材料焊接在一起，其中第二金属材料是选自由铜，金，银，以金和钯为主要成分的金和钯基合金以及以银和钯为主要成分的银和钯基合金，并且焊接层具有由第二金属材料的构成元素组成的多个颗粒状金属间化合物相锡分散在横截面微观结构中。

8. 发明授权

US6135947A Endoscope apparatus having light source movable between on and off positions 有权
标题翻译：内窥镜装置具有可在开和关位置之间移动的光源
公开(公告)号：US6135947A
公开(公告)日：2000-10-24
申请号：US152572
申请日：1998-09-14
申请人： Katsushi Watanabe , Takashi Suzuki , Kazutaka Matsumoto
发明人： Katsushi Watanabe , Takashi Suzuki , Kazutaka Matsumoto
IPC分类号： G02B23/26 , A61B1/06 , A61B1/07
CPC分类号： A61B1/00117 , A61B1/00124 , A61B1/0669 , A61B1/07
摘要： An endoscope apparatus includes an endoscope having a light guide fiber for guiding illumination light and a battery-powered light source detachably mounted on the endoscope. A lamp in the light source is switched between a turned-on state and a turned-off state by changing a relative position between the battery-powered light source and the endoscope while the battery-powered light source is mounted on the endoscope. With this arrangement, it can be easily discerned whether the lamp is turned on or off from a glance at the outside appearance of the endoscope apparatus.
摘要翻译：一种内窥镜装置，具备：内窥镜，其具有用于引导照明光的导光纤维和可拆卸地安装在内窥镜上的电池供电光源。通过在将电池供电的光源安装在内窥镜上时，通过改变电池供电的光源和内窥镜之间的相对位置，在打开状态和关闭状态之间切换光源中的灯。利用这种布置，可以容易地辨别出在内窥镜装置的外观上一瞥灯是否被打开或关闭。

9. 发明授权

US5252639A Molding resin composition and molded electronic component 失效
标题翻译：成型树脂组合物和模制电子部件
公开(公告)号：US5252639A
公开(公告)日：1993-10-12
申请号：US796896
申请日：1991-11-25
申请人： Shinetsu Fujieda , Akira Yoshizumi , Kazutaka Matsumoto , Hisayuki Hirai
发明人： Shinetsu Fujieda , Akira Yoshizumi , Kazutaka Matsumoto , Hisayuki Hirai
IPC分类号： C08K5/00 , H01L23/29 , C08K5/09
CPC分类号： H01L23/293 , C08K5/00 , C08K5/0091 , H01L2924/0002
摘要： The molding resin composition of this invention comprises a resin contained a releasing a agents formulated with a release agent and a metal chelate compound.This resin composition is improved an good adhesivity, high moisture resistivity and a good moldability.
摘要翻译：本发明的成型树脂组合物包含含有脱模剂和金属螯合物配制的试剂的树脂。该树脂组合物具有良好的粘合性，高的耐湿性和良好的成型性。

10. 发明授权

US08581971B2 Endoscope system 有权
标题翻译：内窥镜系统
公开(公告)号：US08581971B2
公开(公告)日：2013-11-12
申请号：US12895026
申请日：2010-09-30
申请人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
发明人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
IPC分类号： A62B1/04 , A61B1/04
CPC分类号： A61B1/0052 , A61B1/00048 , A61B1/00052 , A61B1/04
摘要： The endoscope system of the present invention includes: an endoscope that has an image pickup device that picks up an observation image of a test object; an image display unit that converts image pickup signals that have been sent from the image pickup device into images and then displays these images; a first mounting portion that is provided in an operating section of the endoscope and on which the image display unit is mounted; and a second mounting portion that is provided in the operating section of the endoscope and on which the image display unit is mounted in a different position from that of the first mounting portion.
摘要翻译：本发明的内窥镜系统包括：内窥镜，其具有拾取测试对象的观察图像的图像拾取装置; 图像显示单元，其将已经从图像拾取装置发送的图像拾取信号转换成图像，然后显示这些图像; 第一安装部，其设置在所述内窥镜的操作部中，并且安装所述图像显示单元; 以及第二安装部，其设置在所述内窥镜的操作部中，并且所述图像显示单元安装在与所述第一安装部的位置不同的位置。

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