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1. 发明授权

US06270880B1 Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board 有权
标题翻译：晶体玻璃组合物用于电路板，烧结晶体玻璃，绝缘体组合物绝缘膏和厚膜电路板
公开(公告)号：US06270880B1
公开(公告)日：2001-08-07
申请号：US09418926
申请日：1999-10-15
申请人： Hiromichi Kawakami , Hirofumi Sunahara , Toshiki Tanaka , Shizuharu Watanabe , Hiroshi Takagi
发明人： Hiromichi Kawakami , Hirofumi Sunahara , Toshiki Tanaka , Shizuharu Watanabe , Hiroshi Takagi
IPC分类号： B32B300
CPC分类号： C03C10/0009 , H01L23/15 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , Y10T428/24926 , H01L2924/00
摘要： Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100° C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as ½ and a thermal expansion coefficient of as high as 12 ppm/° C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO2, MgO and CaO, the composition ratio of SiO2, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.
摘要翻译：本发明提供一种用于电路板的结晶玻璃组合物，其可以在1100℃的温度下烧结并具有良好的特性，例如相对介电常数低至1/2，热膨胀系数高达 12ppm /℃作为用于电路板的电绝缘绝缘体。结晶玻璃组合物含有SiO 2，MgO和CaO，SiO 2，MgO和CaO的组成比以重量百分比落入由连接点A（25,45,30），B（25,0， 75），C（44，0，56），D（44,22,34），E（40,19,41）和F（29,40,31），其中至少一种黄铁矿，或通过热处理该组合物沉积硅酸钙结晶相。有时在包含玻璃组合物的粉末中加入热膨胀系数约为6.0ppm /℃以上的陶瓷粉末。

2. 发明授权

US06534161B1 Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same 失效
标题翻译：结晶玻璃组合物，烧结结晶玻璃组合物和使用其的电路基板
公开(公告)号：US06534161B1
公开(公告)日：2003-03-18
申请号：US09614438
申请日：2000-07-12
申请人： Hiromichi Kawakami , Toshiki Tanaka , Shizuharu Watanabe , Hiroshi Takagi
发明人： Hiromichi Kawakami , Toshiki Tanaka , Shizuharu Watanabe , Hiroshi Takagi
IPC分类号： B32B300
CPC分类号： C03C3/064 , C03C3/091 , C03C4/0028 , H05K1/0306 , Y10T428/24926
摘要： A crystallized glass composition contains a principal ingredient comprising SiO2, MgO and Al2O3 and contains about 2 to 20 parts by weight of B2O3 relative to 100 parts by weight of the principal ingredient. In a ternary diagram, the weight ratio (SiO2, MgO, Al2O3) lies within a region surrounded by point A (44.0, 55.0, 1.0), point B (34.5, 64.5, 1.0), point C (35.0, 30.0, 35.0) and point D (44.5, 30.0, 25.5).
摘要翻译：结晶玻璃组合物含有主要成分包含SiO 2，MgO和Al 2 O 3，并且相对于100重量份的主要成分含有约2至20重量份的B 2 O 3。在三元图中，重量比（SiO 2，MgO，Al 2 O 3）位于由点A（44.0,55.0,1.0），点B（34.5,64.5,1.0），点C（35.0,30.0,35.0）包围的区域内，和D点（44.5,30.0,25.5）。

3. 发明授权

US06444598B1 Insulator composition, insulator paste and laminated electronic part 失效
标题翻译：绝缘子组合物，绝缘子糊和层压电子部件
公开(公告)号：US06444598B1
公开(公告)日：2002-09-03
申请号：US09656362
申请日：2000-09-06
申请人： Hiromichi Kawakami , Toshiki Tanaka
发明人： Hiromichi Kawakami , Toshiki Tanaka
IPC分类号： C03C3062
CPC分类号： C03C3/062 , C03C3/078 , C03C3/087 , C03C3/091 , C03C4/16 , C03C8/22 , C03C10/00 , C03C12/00 , C03C14/006 , H05K1/0306
摘要： An insulator composition which can be sintered at a relatively low temperature and which exhibits a low dielectric constant and a thermal expansion coefficient suitable for forming an insulator layer of a laminated electronic part contains a crystallized glass composition containing SiO2, MgO and CaO as main components, and Al2O3, an amorphous silicate glass composition, and a ceramic composition. The composition ratio by weight % (SiO2, MgO, CaO) of the main components of the crystallized glass composition lies in a region surrounded by point A (30, 25, 45), point B (30, 5, 65), point C (45, 5, 50) and point D (45, 25, 30) shown in a ternary composition diagram thereof. The thermal expansion coefficient of the insulator composition after sintering can easily be changed by changing the content ratio of the crystallized glass composition, the amorphous silicate glass composition and the ceramic composition.
摘要翻译：可以在比较低的温度下烧结并且表现出低介电常数和适于形成层压电子部件的绝缘体层的热膨胀系数的绝缘体组合物含有以SiO 2，MgO和CaO为主要成分的结晶玻璃组合物，和Al 2 O 3，无定形硅酸盐玻璃组合物和陶瓷组合物。结晶玻璃组合物的主要组分的组成比（SiO 2，MgO，CaO）位于由点A（30,25,45），点B（30,5,65），点C （45,5,50）和点D（45,25,30），其三元组成图示出。通过改变结晶玻璃组合物，无定形硅酸盐玻璃组合物和陶瓷组合物的含量比，容易地改变烧结后的绝缘体组合物的热膨胀系数。

4. 发明授权

US06596382B2 Multilayered board and method for fabricating the same 有权
公开(公告)号：US06596382B2
公开(公告)日：2003-07-22
申请号：US09906016
申请日：2001-07-11
申请人： Hiromichi Kawakami
发明人： Hiromichi Kawakami
IPC分类号： B32B300
CPC分类号： H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/38 , H05K3/4629 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof. The glass-containing insulating layer is formed by firing a layer containing 60% by volume or less of a glass component before firing, a portion of the glass component is segregated in the surface region of the glass-containing insulating layer by firing, and the electrode is bonded to the surface of the glass-containing insulating layer by means of the segregated glass component. A method for fabricating a multilayered board is also disclosed.

5. 发明授权

US06403694B1 Photosensitive insulating paste and thick film multi-layer circuit substrate 有权
标题翻译：感光绝缘膏和厚膜多层电路基板
公开(公告)号：US06403694B1
公开(公告)日：2002-06-11
申请号：US09496159
申请日：2000-02-01
申请人： Makoto Tose , Hiromichi Kawakami , Shizuharu Watanabe
发明人： Makoto Tose , Hiromichi Kawakami , Shizuharu Watanabe
IPC分类号： C08K334
CPC分类号： C03C8/14 , C03C8/16 , G03F7/0047 , H05K1/0306 , H05K3/0023 , H05K3/4667 , Y10T428/24926 , Y10T428/252 , Y10T428/259
摘要： A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.
摘要翻译：感光绝缘膏含有硼硅酸盐玻璃粉末和结晶SiO 2粉末，其中粉末分散在光敏有机载体中，糊状物含有约3-40重量％的结晶SiO 2组分。％烧结后。包括绝缘基板的厚膜多层电路基板（例如，芯片电感器），其上形成有绝缘层，其中在施加感光绝缘膏之后，通过曝光，显影和烧结形成绝缘层。

6. 发明授权

US5814571A Dielectric paste and thick-film capacitor using same 失效
公开(公告)号：US5814571A
公开(公告)日：1998-09-29
申请号：US638951
申请日：1996-04-24
申请人： Hiromichi Kawakami , Hiroji Tani
发明人： Hiromichi Kawakami , Hiroji Tani
IPC分类号： C04B35/00 , C03C3/108 , C03C8/10 , C03C8/14 , C03C8/16 , H01B3/02 , H01G4/08 , H01G4/12 , H01G4/33
CPC分类号： C03C8/16 , C03C8/10 , C03C8/14 , H01G4/1218
摘要： A dielectric paste used for fabrication of a capacitor which permits manufacture of a small-sized ceramic oscillator by being incorporated in the oscillator. The dielectric paste comprises powdered glass, dielectric powder, and an organic vehicle. The dielectric powder is a lead-based perovskite compound. The powdered glass includes a main component given by xSiO.sub.2 --yB.sub.2 O.sub.3 --zPbO (where x, y, and z are expressed in mole percent). The x, y, and z lie within a region defined by connecting points A (x=70, y=0, and z=30), B (x=70, y=15, and z=15), C (x=10, y=75, and z=15), and D (x=10, y=0, and z=90). Preferably, at least one member selected from the group consisting of Al.sub.2 O.sub.3, CaO, TiO.sub.2, ZrO.sub.2, BaO and MgO is used as an additive. Preferably, glass frit accounts for about 35-95% by weight of the mixture of the powdered glass and the dielectric powder, and the dielectric powder accounts for about 5-65% by weight.

7. 发明授权

US07569177B2 Method of producing ceramic multilayer substrates, and green composite laminate 有权
标题翻译：陶瓷多层基板的制造方法以及绿色复合层叠体
公开(公告)号：US07569177B2
公开(公告)日：2009-08-04
申请号：US11274501
申请日：2005-11-16
申请人： Yoshifumi Saitoh , Hiromichi Kawakami
发明人： Yoshifumi Saitoh , Hiromichi Kawakami
IPC分类号： B28B5/00
CPC分类号： C04B35/6264 , B28B11/243 , B28B17/0018 , B32B18/00 , B32B37/0046 , B32B2311/12 , C04B35/638 , C04B2235/3206 , C04B2235/3208 , C04B2235/3217 , C04B2235/3244 , C04B2235/3409 , C04B2235/3418 , C04B2235/3463 , C04B2235/3481 , C04B2235/365 , C04B2235/5445 , C04B2235/6025 , C04B2237/407 , C04B2237/56 , C04B2237/562 , C04B2237/565 , C04B2237/568 , C04B2237/64 , C04B2237/66 , C04B2237/702 , C04B2237/704 , H01L21/4807 , H01L21/481 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/0052 , H05K3/4611 , H05K3/4629 , H05K2201/09036 , H05K2201/0909 , H05K2203/308 , Y02P40/63 , H01L2924/00
摘要： A method of producing a ceramic multilayer substrate involves producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substrate 12 having a plurality of ceramic green layers 17 containing ceramic powder, the shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first grooves 16 extending from the first shrink-suppressing layer 13 side into a part of the multilayer mother substrate 12; firing the composite laminate 11; removing the first and second shrink-suppressing layers 13 and 14 and taking out the sintered multilayer mother substrate 11; and dividing the multilayer mother substrate 12 along the grooves 16, and obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.
摘要翻译：制造陶瓷多层基板的方法包括制备含有形成在具有多个包含陶瓷粉末的多个陶瓷生坯层17的绿色多层母基板12的主表面上的第一和第二收缩抑制层的生坯复合层压体11，在陶瓷粉末的烧结条件下，含有基本上不能烧结的烧结困难粉末的抑制层; 形成从第一收缩抑制层13侧延伸到多层母基板12的一部分的第一槽16; 烧制复合层压板11; 去除第一和第二收缩抑制层13和14并取出烧结的多层母体基板11; 并且沿着凹槽16分割多层母体基板12，并获得多个陶瓷多层基板。由此，能够抑制烧成时的平面方向的收缩。因此，可以以高生产效率制造具有高尺寸精度和高可靠性的陶瓷多层基板。

8. 发明授权

US06602946B2 Photosensitive insulating paste and thick film multi-layer circuit substrate 有权
公开(公告)号：US06602946B2
公开(公告)日：2003-08-05
申请号：US09915704
申请日：2001-07-26
申请人： Makoto Tose , Hiromichi Kawakami , Shizuharu Watanabe
发明人： Makoto Tose , Hiromichi Kawakami , Shizuharu Watanabe
IPC分类号： C08K334
CPC分类号： C03C8/14 , C03C8/16 , G03F7/0047 , H05K1/0306 , H05K3/0023 , H05K3/4667 , Y10T428/24926 , Y10T428/252 , Y10T428/259
摘要： A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

9. 发明授权

US6007900A Dielectric paste and thick-film capacitor using same 失效
标题翻译：电介质浆料和厚膜电容器使用相同
公开(公告)号：US6007900A
公开(公告)日：1999-12-28
申请号：US3478
申请日：1998-01-06
申请人： Hiromichi Kawakami , Hiroji Tani
发明人： Hiromichi Kawakami , Hiroji Tani
IPC分类号： C03C8/14 , H01G4/12 , B32B9/00 , H01G4/06
CPC分类号： C03C8/14 , H01G4/1218 , Y10T428/24926
摘要： A dielectric paste used for fabrication of a capacitor which permits manufacture of a small-sized ceramic oscillator by being incorporated in the oscillator. The dielectric paste comprises powdered glass, dielectric powder, and an organic vehicle. The dielectric powder is a lead-based perovskite compound. The powdered glass includes a main component given by xSiO.sub.2 --yB.sub.2 O.sub.3 --zPbO (where x, y, and z are expressed in mole percent). The x, y, and z lie within a region defined by connecting points A (x=70, y=0, and z=30), B (x=70, y=15, and z=15), C (x=10, y=75, and z=15), and D (x=10, y=0, and z=90). Preferably, at least one member selected from the group consisting of Al.sub.2 O.sub.3, CaO, TiO.sub.2, ZrO.sub.2, BaO and MgO is used as an additive. Preferably, glass frit accounts for about 35-95% by weight of the mixture of the powdered glass and the dielectric powder, and the dielectric powder accounts for about 5-65% by weight.
摘要翻译：用于制造电容器的电介质浆料，其允许通过结合在振荡器中制造小型陶瓷振荡器。电介质浆料包括粉末状玻璃，电介质粉末和有机载体。电介质粉末是铅基钙钛矿化合物。粉末玻璃包括由xSiO 2 -yB 2 O 3 -zPbO（其中x，y和z以摩尔百分数表示）给出的主要成分。 x，y和z位于连接点A（x = 70，y = 0和z = 30），B（x = 70，y = 15和z = 15），C = 10，y = 75，z = 15），D（x = 10，y = 0，z = 90）。优选使用选自Al 2 O 3，CaO，TiO 2，ZrO 2，BaO和MgO中的至少一种作为添加剂。优选玻璃料占粉末状玻璃和电介质粉末的混合物的约35-95重量％，并且介电粉末占约5-65重量％。

10. 发明申请

US20110091686A1 LOW TEMPERATURE CO-FIRED CERAMIC MATERIAL, LOW TEMPERATURE CO-FIRED CERAMIC BODY, AND MULTILAYER CERAMIC SUBSTRATE 有权
标题翻译：低温共烧陶瓷材料，低温共烧陶瓷体和多层陶瓷基体
公开(公告)号：US20110091686A1
公开(公告)日：2011-04-21
申请号：US12906336
申请日：2010-10-18
申请人： Tomoya Yokoyama , Yuzo Kawada , Akira Baba , Hiromichi Kawakami , Isao Kato
发明人： Tomoya Yokoyama , Yuzo Kawada , Akira Baba , Hiromichi Kawakami , Isao Kato
IPC分类号： B32B3/00 , C04B35/48
CPC分类号： H05K3/4629 , B32B18/00 , C04B35/195 , C04B35/6262 , C04B35/62685 , C04B2235/3215 , C04B2235/3244 , C04B2235/3272 , C04B2235/5436 , C04B2235/6025 , C04B2235/656 , C04B2235/77 , C04B2235/96 , C04B2237/341 , C04B2237/66 , C04B2237/704 , H01L23/15 , H01L2224/16225 , H01L2924/15192 , H01L2924/19105 , Y10T428/24355 , Y10T428/24926
摘要： A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.
摘要翻译：低温共烧陶瓷材料包括基于SiO2-BaO-Al2O3的初级组分，并且作为次要组分，以Fe 2 O 3计的铁为0.044〜0.077重量份，以锆为0.30〜0.55重量份的锆 ZrO 2相对于100重量份的SiO 2 -BAO-Al 2 O 3基主成分。作为SiO 2-BaO-Al 2 O 3的一次成分，优选包含47重量％〜60重量％的SiO 2，20重量％〜42重量％的BaO，5重量％〜30重量％的Al 2 O 3。

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