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    • 4. 发明授权
    • Sulfur compound and use thereof
    • 硫化合物及其用途
    • US06570025B1
    • 2003-05-27
    • US10048002
    • 2002-01-25
    • Kenichi FujiiAtsuo OtsujiMasao ImaiKenichi SugimotoTadashi OkumaRihoko SuzukiKeisuke Takuma
    • Kenichi FujiiAtsuo OtsujiMasao ImaiKenichi SugimotoTadashi OkumaRihoko SuzukiKeisuke Takuma
    • C07D33906
    • C07D339/06C07D339/00C07D339/08C08F20/38
    • This invention provides sulfur-containing (meth)acrylic ester compounds each of which is represented by the following formula (1); wherein R1 and R2 each independently represent a hydrogen atom or an alkyl group or may be fused together to form a ring, R3 represents a hydrogen atom or a methyl group, X1 represents an oxygen atom or a sulfur atom, m stands for an integer of from 0 to 3, and n stands for an integer of from 1 to 4, polymerizable compositions comprising the sulfur-containing (meth)acrylic acids, and cured products and optical parts obtained by polymerizing the polymerizable compositions. The sulfur-containing (meth)acrylic ester compounds according to the present invention are very useful, as monomers for photocurable, polymerizable compositions, in applications such as optical materials and dental materials. The optical parts obtained by curing the polymerizable compositions are excellent in optical properties, thermal properties and mechanical properties and are also good in productivity.
    • 本发明提供了各自由下式(1)表示的含硫(甲基)丙烯酸酯化合物,其中R 1和R 2各自独立地表示氢原子或烷基,或者可以一起稠合形成环,R 3 表示氢原子或甲基,X1表示氧原子或硫原子,m表示0〜3的整数,n表示1〜4的整数,包含含硫( 甲基)丙烯酸,以及通过聚合可聚合组合物获得的固化产物和光学部件。 作为本发明的含硫(甲基)丙烯酸酯化合物,作为光固化性聚合性组合物的单体,在光学材料和牙科用材料等应用中是非常有用的。 通过固化可聚合组合物获得的光学部件的光学性能,热性能和机械性能优异,并且生产率也良好。
    • 8. 发明授权
    • Setting parameters in a communication device for network connection
    • 在通信设备中设置网络连接参数
    • US08249504B2
    • 2012-08-21
    • US11282065
    • 2005-11-16
    • Kenichi Fujii
    • Kenichi Fujii
    • H04B7/00
    • H04W12/06H04L63/0428H04L63/08H04L63/18
    • In a communication control method for wireless communication between a first communication device and a second communication device through a wireless communication unit, identification information is notified from the second communication device to the first communication device by using a communication unit other than the wireless communication unit. Wireless communication between the first and second communication devices is performed by the wireless communication unit using the first communication parameter shared in advance, and authentication processing based on identification information is performed. When authentication is acquired by this authentication processing, the second communication parameter to be set with respect to a wireless communication unit is shared by the first and second communication devices through the above wireless communication. Parameters for wireless communication between the first and second communication devices are set in the wireless communication unit by using the second communication parameter shared in this manner.
    • 在通过无线通信单元在第一通信设备和第二通信设备之间的无线通信的通信控制方法中,通过使用除了无线通信单元之外的通信单元,从第二通信设备向第一通信设备通知识别信息。 第一和第二通信设备之间的无线通信由无线通信单元使用预先共享的第一通信参数执行,并且执行基于识别信息的认证处理。 当通过该认证处理获取认证时,将通过上述无线通信由第一和第二通信设备共享关于无线通信单元设置的第二通信参数。 通过使用以这种方式共享的第二通信参数,在无线通信单元中设置第一和第二通信设备之间的无线通信的参数。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20110215473A1
    • 2011-09-08
    • US12886133
    • 2010-09-20
    • Mitsuhiko NodaMitsuhiro NoguchiKenichi FujiiFumitaka Arai
    • Mitsuhiko NodaMitsuhiro NoguchiKenichi FujiiFumitaka Arai
    • H01L23/532H01L21/768
    • H01L21/768H01L23/532H01L2924/0002H01L2924/00
    • According to one embodiment, a semiconductor device includes a first contact, a second contact, and an intermediate interconnection. The first contact is made of a first conductive material. The second contact is made of a second conductive material. A lower end portion of the second contact is connected to an upper end portion of the first contact. The intermediate interconnection is made of a third conductive material and isolated from the first contact and the second contact. A lower face of the intermediate interconnection is positioned higher than a lower face of the first contact. An upper face of the intermediate interconnection is positioned lower than an upper face of the second contact. A diffusion coefficient of the first conductive material with respect to the second conductive material is lower than a diffusion coefficient of the third conductive material with respect to the second conductive material.
    • 根据一个实施例,半导体器件包括第一触点,第二触点和中间互连。 第一接触由第一导电材料制成。 第二接触由第二导电材料制成。 第二触点的下端部连接到第一触点的上端部。 中间互连由第三导电材料制成并且与第一接触和第二接触隔离。 中间互连的下表面定位成高于第一触点的下表面。 中间互连的上表面定位成低于第二触点的上表面。 第一导电材料相对于第二导电材料的扩散系数低于第三导电材料相对于第二导电材料的扩散系数。