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1. 发明申请

US20070205417A1 LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, LIGHTING DEVICE, AND ELECTRONIC APPLIANCE 审中-公开
标题翻译：发光元件，发光装置，照明装置和电子设备
公开(公告)号：US20070205417A1
公开(公告)日：2007-09-06
申请号：US11679466
申请日：2007-02-27
申请人： Hiroki Ohara , Junichiro Sakata , Yasuo Nakamura
发明人： Hiroki Ohara , Junichiro Sakata , Yasuo Nakamura
IPC分类号： H01L33/00
CPC分类号： C09K11/612 , H01L51/5012 , H05B33/145
摘要： The light-emitting layer contains a light-emitting base including a chalcogenide compound, and a light-emitting center including two kinds of halogen compounds. The chalcogenide compound contains a chalcogen element and an element selected from elements belonging to Group 2 to Group 13 of the periodic table, and the halogen compound contains a halogen element and an element selected from typical metal elements, transition metal elements, or rare earth elements.
摘要翻译：发光层含有包含硫属化合物的发光基质和包含两种卤素化合物的发光中心。硫族化合物含有硫属元素和选自元素周期表第2族至第13族的元素的元素，卤素化合物含有卤素元素和选自典型金属元素，过渡金属元素或稀土元素的元素。

2. 发明授权

US08492756B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08492756B2
公开(公告)日：2013-07-23
申请号：US12683695
申请日：2010-01-07
申请人： Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
发明人： Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
IPC分类号： H01L29/24 , H01L29/22 , H01L21/34
CPC分类号： H01L29/16 , H01L21/02554 , H01L21/02565 , H01L27/1225 , H01L29/78618 , H01L29/7869
摘要： An object is to provide a semiconductor device including a thin film transistor which includes an oxide semiconductor layer and has high electric characteristics. An oxide semiconductor layer including SiOx is used in a channel formation region, and in order to reduce contact resistance with source and drain electrode layers formed using a metal material with low electric resistance, source and drain regions are provided between the source and drain electrode layers and the oxide semiconductor layer including SiOx. The source and drain regions are formed using an oxide semiconductor layer which does not include SiOx or an oxynitride film.
摘要翻译：本发明的目的是提供一种包括具有氧化物半导体层并具有高电特性的薄膜晶体管的半导体器件。在沟道形成区域中使用包含SiO x的氧化物半导体层，为了降低与使用具有低电阻的金属材料形成的源极和漏极电极层的接触电阻，源极和漏极电极层之间提供源极和漏极区域和包含SiOx的氧化物半导体层。源极和漏极区域使用不包括SiO x或氮氧化物膜的氧化物半导体层形成。

3. 发明授权

US08394671B2 Method for manufacturing semiconductor device 有权
公开(公告)号：US08394671B2
公开(公告)日：2013-03-12
申请号：US13495481
申请日：2012-06-13
申请人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
发明人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
IPC分类号： H01L21/00
CPC分类号： H01L29/66969 , H01L27/1225 , H01L27/124 , H01L29/24 , H01L29/42356 , H01L29/42384 , H01L29/66742 , H01L29/78606 , H01L29/78618 , H01L29/7869 , H01L29/78696
摘要： It is an object to provide a highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics. It is another object to manufacture a highly reliable semiconductor device at lower cost with high productivity. In a method for manufacturing a semiconductor device which includes a thin film transistor where a semiconductor layer having a channel formation region, a source region, and a drain region are formed using an oxide semiconductor layer, heat treatment (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor layer and reduce impurities such as moisture. Moreover, the oxide semiconductor layer subjected to the heat treatment is slowly cooled under an oxygen atmosphere.

4. 发明申请

US20100148204A1 Light-Emitting Element and Display Device 有权
标题翻译：发光元件和显示设备
公开(公告)号：US20100148204A1
公开(公告)日：2010-06-17
申请号：US12706012
申请日：2010-02-16
申请人： Hisao Ikeda , Hiroki Ohara , Makoto Hosoba , Junichiro Sakata , Shunichi Ito
发明人： Hisao Ikeda , Hiroki Ohara , Makoto Hosoba , Junichiro Sakata , Shunichi Ito
IPC分类号： H01L33/00
CPC分类号： H01L51/5253 , G09G3/3291 , G09G2300/0842 , G09G2310/0251 , G09G2320/043 , H01L27/3211 , H01L27/322 , H01L27/3246 , H01L27/3272 , H01L51/5012 , H01L51/5203 , H01L51/5206 , H01L51/5234 , H01L51/5237 , H01L51/5246 , H01L51/525 , H01L51/5262 , H01L51/5275 , H01L51/5284 , H01L2251/301 , H01L2251/5315 , H01L2251/5323 , H01L2251/5338 , H01L2251/5361
摘要： There has been a problem that difference in refractive index between an opposite substrate or a moisture barrier layer (passivation film) such as SiN provided thereover, and air is maintained large, and light extraction efficiency is low. Further, there has been a problem that peeling or cracking due to the moisture barrier layer is easily generated, which leads to deteriorate the reliability and lifetime of a light-emitting element. According to the present invention, a light-emitting element comprises a pixel electrode, an electroluminescent layer, a transparent electrode, a passivation film, a stress relieving layer, and a low refractive index layer, all of which are stacked sequentially. The stress relieving layer serves to prevent peeling of the passivation film. The low refractive index layer serves to reduce reflectivity of light generated in the electroluminescent layer in emitting to air. Therefore, a light-emitting element with high reliability and long lifetime and a display device using the light-emitting element can be provided.
摘要翻译：存在如下问题：相对基板或其间设置的诸如SiN之类的防潮层（钝化膜）之间的折射率差异大，空气保持较大，光提取效率低。此外，存在容易产生由于防潮层而产生剥离或破裂的问题，导致发光元件的可靠性和寿命恶化。根据本发明，发光元件包括依次堆叠的像素电极，电致发光层，透明电极，钝化膜，应力消除层和低折射率层。应力消除层用于防止钝化膜的剥离。低折射率层用于降低发射到空气中的电致发光层中产生的光的反射率。因此，可以提供具有高可靠性和长寿命的发光元件和使用该发光元件的显示装置。

5. 发明授权

US08629432B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US08629432B2
公开(公告)日：2014-01-14
申请号：US12683681
申请日：2010-01-07
申请人： Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
发明人： Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
IPC分类号： H01L29/786 , H01L21/36
CPC分类号： H01L29/78696 , C23C14/086 , H01L21/02554 , H01L21/02565 , H01L21/02573 , H01L21/02592 , H01L21/02631 , H01L27/1225 , H01L29/7869 , H01L29/78693 , H04M1/0266
摘要： A semiconductor device including a thin film transistor which includes an oxide semiconductor layer and has high electric characteristics and reliability. Film deposition is performed using an oxide semiconductor target containing an insulator (an insulating oxide, an insulating nitride, silicon oxynitride, aluminum oxynitride, or the like), typically SiO2, so that the semiconductor device in which the Si-element concentration in the thickness direction of the oxide semiconductor layer has a gradient which increases in accordance with an increase in a distance from a gate electrode is realized.

6. 发明授权

US08389326B2 Method for manufacturing semiconductor device 有权
公开(公告)号：US08389326B2
公开(公告)日：2013-03-05
申请号：US13495432
申请日：2012-06-13
申请人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
发明人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
IPC分类号： H01L21/00
CPC分类号： H01L21/477 , H01L21/02565 , H01L21/02664 , H01L21/383 , H01L21/46 , H01L27/1225 , H01L29/66969 , H01L29/7869 , H01L29/78693
摘要： An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.

7. 发明授权

US08207014B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08207014B2
公开(公告)日：2012-06-26
申请号：US12826021
申请日：2010-06-29
申请人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
发明人： Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
IPC分类号： H01L21/00
CPC分类号： H01L21/477 , H01L21/02565 , H01L21/02664 , H01L21/383 , H01L21/46 , H01L27/1225 , H01L29/66969 , H01L29/7869 , H01L29/78693
摘要： An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.
摘要翻译：本发明的目的是制造具有稳定电特性的薄膜晶体管的高度可靠的半导体器件。在包括使用氧化物半导体膜用于包括沟道形成区域的半导体层的薄膜晶体管的半导体器件的制造方法中，进行热处理（脱水或脱氢）以提高氧化物半导体膜的纯度并减少杂质，包括水分等。之后，在氧气氛下进行缓慢冷却。除了在氧化物半导体膜中排出的含有水分等的杂质以外，热处理会导致在栅极绝缘层中退出的杂质，包括氧化物半导体膜和膜之间的界面中的杂质，氧化物半导体膜和氧化物之间和之下的界面半导体并与其接触。

8. 发明授权

US08957414B2 Semiconductor device comprising both amorphous and crystalline semiconductor oxide 有权
标题翻译：包括无定形和结晶半导体氧化物的半导体器件
公开(公告)号：US08957414B2
公开(公告)日：2015-02-17
申请号：US13399375
申请日：2012-02-17
申请人： Shunpei Yamazaki , Junichiro Sakata , Hiroki Ohara
发明人： Shunpei Yamazaki , Junichiro Sakata , Hiroki Ohara
IPC分类号： H01L29/12 , H01L21/324 , H01L21/28 , H01L29/04 , H01L29/66 , H01L29/786
CPC分类号： H01L21/465 , H01L21/02565 , H01L21/28176 , H01L21/324 , H01L21/477 , H01L29/04 , H01L29/045 , H01L29/66742 , H01L29/66969 , H01L29/78603 , H01L29/78606 , H01L29/78618 , H01L29/78642 , H01L29/78648 , H01L29/7869 , H01L29/78696
摘要： A semiconductor device for high power application in which a novel semiconductor material having high mass productivity is provided. An oxide semiconductor film is formed, and then, first heat treatment is performed on the exposed oxide semiconductor film in order to reduce impurities such as moisture or hydrogen in the oxide semiconductor film. Next, in order to further reduce impurities such as moisture or hydrogen in the oxide semiconductor film, oxygen is added to the oxide semiconductor film by an ion implantation method, an ion doping method, or the like, and after that, second heat treatment is performed on the exposed oxide semiconductor film.
摘要翻译：一种用于大功率应用的半导体器件，其中提供了具有高质量生产率的新型半导体材料。形成氧化物半导体膜，然后对暴露的氧化物半导体膜进行第一热处理，以便减少氧化物半导体膜中的杂质如水分或氢。接下来，为了进一步减少氧化物半导体膜中的杂质，例如水分或氢气，通过离子注入法，离子掺杂法等将氧添加到氧化物半导体膜中，之后，第二热处理为在暴露的氧化物半导体膜上进行。

9. 发明授权

US08900916B2 Method for manufacturing semiconductor device including oxide semiconductor film 有权
标题翻译：包括氧化物半导体膜的半导体器件的制造方法
公开(公告)号：US08900916B2
公开(公告)日：2014-12-02
申请号：US12832329
申请日：2010-07-08
申请人： Shunpei Yamazaki , Miyuki Hosoba , Kosei Noda , Hiroki Ohara , Toshinari Sasaki , Junichiro Sakata
发明人： Shunpei Yamazaki , Miyuki Hosoba , Kosei Noda , Hiroki Ohara , Toshinari Sasaki , Junichiro Sakata
IPC分类号： H01L21/00
CPC分类号： H01L29/66969 , H01L21/477 , H01L27/1225 , H01L29/7869
摘要： A highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics, and a manufacturing method thereof. In the manufacturing method of the semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region is an oxide semiconductor layer, heat treatment which reduces impurities such as moisture to improve the purity of the oxide semiconductor layer and oxidize the oxide semiconductor layer (heat treatment for dehydration or dehydrogenation) is performed. Not only impurities such as moisture in the oxide semiconductor layer but also those existing in a gate insulating layer are reduced, and impurities such as moisture existing in interfaces between the oxide semiconductor layer and films provided over and under and in contact with the oxide semiconductor layer are reduced.
摘要翻译：一种高度可靠的半导体器件及其制造方法，其包括具有稳定电特性的薄膜晶体管。在包括具有沟道形成区域的半导体层是氧化物半导体层的薄膜晶体管的半导体器件的制造方法中，减少诸如水分的杂质的热处理以提高氧化物半导体层的纯度并氧化氧化物进行半导体层（脱水或脱氢的热处理）。氧化物半导体层中的水分等杂质，以及存在于栅极绝缘层中的杂质都会降低，氧化物半导体层和氧化物半导体层之间的界面中存在的水分等杂质与氧化物半导体层减少了

10. 发明授权

US08450144B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08450144B2
公开(公告)日：2013-05-28
申请号：US12722795
申请日：2010-03-12
申请人： Junichiro Sakata , Hideyuki Kishida , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
发明人： Junichiro Sakata , Hideyuki Kishida , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
IPC分类号： H01L21/00
CPC分类号： H01L29/7869 , G09G3/3258 , G09G3/3275 , G09G2300/0842 , G09G2300/0861 , G09G2310/0248 , G09G2310/0297 , H01L21/02554 , H01L21/02565 , H01L21/02592 , H01L21/02631 , H01L27/12 , H01L27/1225 , H01L27/1288 , H01L27/3262 , H01L27/3276 , H01L29/66969 , H01L29/78618
摘要： An object of an embodiment of the present invention is to provide a semiconductor device provided with a thin film transistor which includes an oxide semiconductor layer and has high electric characteristics. The semiconductor device includes a gate electrode over an insulating surface, an oxide semiconductor layer including silicon oxide, an insulating layer between the gate electrode and the oxide semiconductor layer, and source and drain regions between the oxide semiconductor layer including silicon oxide and source and drain electrode layers. The source and drain regions are formed using a degenerate oxide semiconductor material or a degenerate oxynitride material.
摘要翻译：本发明的一个实施例的目的是提供一种具有薄膜晶体管的半导体器件，该薄膜晶体管包括氧化物半导体层并具有高电特性。半导体器件包括绝缘表面上的栅电极，包括氧化硅的氧化物半导体层，栅电极和氧化物半导体层之间的绝缘层，以及包括氧化硅的氧化物半导体层和源极和漏极之间的源极和漏极区电极层。源区和漏区使用简并氧化物半导体材料或简并氧氮化物材料形成。

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