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1. 发明申请

US20100307712A1 PROCESS AND EQUIPMENT FOR PRODUCING COPPER ALLOY MATERIAL 有权
标题翻译：生产铜合金材料的工艺和设备
公开(公告)号：US20100307712A1
公开(公告)日：2010-12-09
申请号：US12745522
申请日：2008-11-28
申请人： Hirokazu Yoshida , Tsukasa Takazawa , Toshio Abe , Shuji Tomimatsu
发明人： Hirokazu Yoshida , Tsukasa Takazawa , Toshio Abe , Shuji Tomimatsu
IPC分类号： B22D11/18 , B22D11/10 , B22D11/126
CPC分类号： B22D21/025 , B22D11/004 , B22D11/116 , C22B15/006 , C22C9/06
摘要： A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.
摘要翻译：一种由沉淀强化型铜合金制造铜合金材料的方法，该方法包括单独进行纯铜溶解的方法和含有该铜合金的附加元素或母合金的溶解，其包括以下步骤：：同时熔化元素和/或母合金，其选自Ni，Co，Si，Ni-Cu母合金，Co-Cu母合金，Si-Cu母合金， Ni-Si-Cu母合金和Co-Si-Cu母合金，并且在产生混合热的帮助下熔化，在形成含有至少一种的Ni或Co，和Si，作为其高密度; 将Ni的含量最多形成为80质量％的高密度熔体; 并通过将熔体添加到从另一熔化炉供给的纯铜熔融金属中，形成具有预定成分和浓度的合金熔融金属。

2. 发明授权

US08176966B2 Process and equipment for producing copper alloy material 有权
标题翻译：生产铜合金材料的工艺和设备
公开(公告)号：US08176966B2
公开(公告)日：2012-05-15
申请号：US12745522
申请日：2008-11-28
申请人： Hirokazu Yoshida , Tsukasa Takazawa , Toshio Abe , Shuji Tomimatsu
发明人： Hirokazu Yoshida , Tsukasa Takazawa , Toshio Abe , Shuji Tomimatsu
IPC分类号： B22D27/00
CPC分类号： B22D21/025 , B22D11/004 , B22D11/116 , C22B15/006 , C22C9/06
摘要： A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.
摘要翻译：一种由沉淀强化型铜合金制造铜合金材料的方法，该方法包括单独进行纯铜溶解的方法和含有该铜合金的附加元素或母合金的溶解，其包括以下步骤：：同时熔化元素和/或母合金，其选自Ni，Co，Si，Ni-Cu母合金，Co-Cu母合金，Si-Cu母合金， Ni-Si-Cu母合金和Co-Si-Cu母合金，并且在产生混合热的帮助下熔化，在形成含有至少一种的Ni或Co，和Si，作为其高密度; 将Ni的含量最多形成为80质量％的高密度熔体; 并通过将熔体添加到从另一熔化炉供给的纯铜熔融金属中，形成具有预定成分和浓度的合金熔融金属。

3. 发明授权

US08201614B2 Method and an apparatus of controlling chemical composition of a molten metal during continuous casting 失效
标题翻译：在连续铸造期间控制熔融金属的化学成分的方法和装置
公开(公告)号：US08201614B2
公开(公告)日：2012-06-19
申请号：US12745518
申请日：2008-11-28
申请人： Hirokazu Yoshida , Tsukasa Takazawa , Shuji Tomimatsu
发明人： Hirokazu Yoshida , Tsukasa Takazawa , Shuji Tomimatsu
IPC分类号： B22D27/00
CPC分类号： B22D21/025 , B22D11/004 , B22D11/116 , C22B15/006 , C22C9/06
摘要： A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.
摘要翻译：一种在连铸过程中控制熔融铜或熔融铜合金的组成的方法，包括确定熔融铜或熔融铜合金的连续电阻率的步骤; 基于熔融铜或熔融铜合金的比电阻与预先理解的各成分之间的关系计算熔融铜或熔融铜合金的组成; 并根据计算出的组成控制熔融铜或熔融铜合金的组成。可以考虑溶解氧的温度或含量来计算组成。

4. 发明申请

US20100307711A1 METHOD AND AN APPARATUS OF CONTROLLING CHEMICAL COMPOSITION OF A MOLTEN METAL DURING CONTINUOUS CASTING 失效
标题翻译：在连续铸造期间控制金属化学成分的方法和装置
公开(公告)号：US20100307711A1
公开(公告)日：2010-12-09
申请号：US12745518
申请日：2008-11-28
申请人： Hirokazu Yoshida , Tsukasa Takazawa , Shuji Tomimatsu
发明人： Hirokazu Yoshida , Tsukasa Takazawa , Shuji Tomimatsu
IPC分类号： B22D11/16 , B22D46/00
CPC分类号： B22D21/025 , B22D11/004 , B22D11/116 , C22B15/006 , C22C9/06
摘要： A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.
摘要翻译：一种在连铸过程中控制熔融铜或熔融铜合金的组成的方法，包括确定熔融铜或熔融铜合金的连续电阻率的步骤; 基于熔融铜或熔融铜合金的比电阻与预先理解的各成分之间的关系计算熔融铜或熔融铜合金的组成; 并根据计算出的组成控制熔融铜或熔融铜合金的组成。可以考虑溶解氧的温度或含量来计算组成。

5. 发明授权

US08409375B2 Method of producing a copper alloy wire rod and copper alloy wire rod 失效
标题翻译：生产铜合金线材和铜合金线材的方法
公开(公告)号：US08409375B2
公开(公告)日：2013-04-02
申请号：US12325657
申请日：2008-12-01
申请人： Hirokazu Yoshida , Tsukasa Takazawa
发明人： Hirokazu Yoshida , Tsukasa Takazawa
IPC分类号： C22F1/08 , B22D11/06
CPC分类号： C22C9/06 , B22D11/004 , B22D11/0602 , B22D11/0605 , B22D11/1206 , C22C9/00 , C22C9/04 , C22F1/08
摘要： A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.
摘要翻译：一种铜合金线材的制造方法，其特征在于，包括：通过将析出强化铜合金的熔融铜浇注到带轮式或双带式可动模中获得锭的铸造工序; 以及轧制通过铸造步骤获得的锭的轧制步骤，连续进行这些步骤，其中在轧制步骤的中间阶段或刚刚在轧制步骤之后铜合金线材的中间材料被淬火。

6. 发明授权

US09596129B2 Communication system, control apparatus, communication apparatus, information-relaying method, and program 有权
标题翻译：通信系统，控制装置，通信装置，信息中继方法和程序
公开(公告)号：US09596129B2
公开(公告)日：2017-03-14
申请号：US14379991
申请日：2013-03-18
申请人： Hirokazu Yoshida , Masanori Takashima
发明人： Hirokazu Yoshida , Masanori Takashima
IPC分类号： H04L12/24 , H04Q3/66 , H04L12/701 , H04L12/717
CPC分类号： H04L41/0654 , H04L45/00 , H04L45/42 , H04Q3/66 , H04Q2213/13145 , H04Q2213/13166 , H04Q2213/13167 , H04Q2213/13178
摘要： A communication system includes a communication apparatus that processes a packet according to control information set by a control apparatus; a first control apparatus that controls the communication apparatus by setting the control information in the communication apparatus; and a second control apparatus that operates in concert with the first control apparatus. The first control apparatus transmits information necessary for interoperation between the first and second control apparatuses to the second control apparatus via the communication apparatus.
摘要翻译：通信系统包括：根据由控制装置设定的控制信息处理分组的通信装置; 第一控制装置，其通过设置通信装置中的控制信息来控制通信装置; 以及与第一控制装置协同工作的第二控制装置。第一控制装置经由通信装置向第二控制装置发送第一和第二控制装置之间的互操作所必需的信息。

7. 发明申请

US20100186615A1 SMALL GAS-GENERATING DEVICE FOR GAS ACTUATOR AND PRETENSIONER SYSTEM 有权
标题翻译：用于气体执行器和预处理器系统的小气体发生装置
公开(公告)号：US20100186615A1
公开(公告)日：2010-07-29
申请号：US12160937
申请日：2007-01-17
申请人： Ryoi Kodama , Eishi Sato , Hirokazu Yoshida
发明人： Ryoi Kodama , Eishi Sato , Hirokazu Yoshida
IPC分类号： B01J7/00 , C06D5/00
CPC分类号： B60R21/2644 , B60R22/4628 , C06B45/00 , C06D5/06 , F42B3/04 , F42B3/103
摘要： A gas generator including a cup filled with gas generant molded articles that generate gas by combustion, and an ignitor on which an ignition agent is disposed. Each gas generant molded article is formed of smokeless powders containing nitrocellulose as its major ingredient. Each gas generant molded article includes an explosive containing a fuel agent containing a guanidine derivative and/or a tetrazole derivative and an oxidizing agent containing a metal nitrate and/or perchlorate. Thus, it is possible to provide a gas generator by which the amount of CO gas generated in operation can be reduced and the combustion speed can easily be controlled, and to provide a pretensioner system provided with the gas generator.
摘要翻译：一种气体发生器，包括填充有通过燃烧产生气体的气体发生剂模制品的杯，以及设置着火剂的点火器。每个气体发生剂模制品由含有硝化纤维素作为主要成分的无烟粉末形成。每个气体发生剂模制品包括含有含有胍衍生物和/或四唑衍生物的燃料的炸药和含有硝酸金属盐和/或高氯酸盐的氧化剂。因此，可以提供一种气体发生器，通过该气体发生器可以减少在操作中产生的CO气体的量，并且可以容易地控制燃烧速度，并且提供一种具有气体发生器的预紧器系统。

8. 发明授权

US07351476B2 Two-package curing type polyurethane coating composition and coated article 有权
标题翻译：双包装固化型聚氨酯涂料组合物和涂层制品
公开(公告)号：US07351476B2
公开(公告)日：2008-04-01
申请号：US10980185
申请日：2004-11-04
申请人： Kenji Kawazu , Mika Kai , Hirokazu Yoshida , Yasuhiro Nakano
发明人： Kenji Kawazu , Mika Kai , Hirokazu Yoshida , Yasuhiro Nakano
IPC分类号： B32B27/40 , C08J3/00 , C08K3/20 , C08L75/00
CPC分类号： C08G18/62 , C09D175/04 , Y10T428/31551 , C08L2666/20 , C08L2666/28
摘要： The present invention aims to give a two package curing type polyurethane coating composition which can form a film having soft, wet and dry feelings simultaneously and which maintains general properties such as designing property, film strength, pot life, resistance to scratching and discoloration, resistance to stains with fats and oils and the like, and to provide a coated article with the coating composition. The two package curing type polyurethane coating composition comprises a resin solution containing an acrylic polyol and a curing agent solution containing a polyisocyanate. The resin solution contains urethane resin beads (A) in the amount of 25 to 50 parts by weight and an organic matting agent (B) in the amount of 3 to 10 parts by weight, and the total of (A) and (B) is at least 30 parts by weight in 100 parts by weight of solid contents of the resin solution. And the equivalent ratio of OH groups/NCO groups of the acrylic polyol and the polyisocyanate is in the range of 4.5:1 to 1.5:1.
摘要翻译：本发明的目的在于提供一种可以同时形成具有柔软，湿润和干燥感觉的膜的两包装固化型聚氨酯涂料组合物，其保持一般性能，例如设计性能，膜强度，适用期，抗划痕和变色性，耐电阻性用油脂等进行染色，并提供涂布制品与涂料组合物。两种包装固化型聚氨酯涂料组合物包含含有丙烯酸多元醇的树脂溶液和含有多异氰酸酯的固化剂溶液。树脂溶液含有25〜50重量份的聚氨酯树脂珠（A）和3〜10重量份的有机消光剂（B），（A）和（B）的总和在100重量份的树脂溶液的固体成分中为至少30重量份。丙烯酸多元醇和多异氰酸酯的OH基/ NCO基团的当量比在4.5:1至1.5:1的范围内。

9. 发明授权

US07005741B2 Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads 失效
标题翻译：液晶显示装置和/或包括凸起电极和电极垫的电路基板
公开(公告)号：US07005741B2
公开(公告)日：2006-02-28
申请号：US10283212
申请日：2002-10-30
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

10. 发明授权

US06525422B1 Semiconductor device including bump electrodes 失效
标题翻译：包括凸起电极的半导体器件
公开(公告)号：US06525422B1
公开(公告)日：2003-02-25
申请号：US08989328
申请日：1997-12-11
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

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