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1. 发明授权

US5608280A Commutator type rotary electric machine 失效
标题翻译：换向式旋转电机
公开(公告)号：US5608280A
公开(公告)日：1997-03-04
申请号：US535958
申请日：1995-09-28
申请人： Hiroaki Tamemoto , Yasuhiro Nagao , Masami Niimi
发明人： Hiroaki Tamemoto , Yasuhiro Nagao , Masami Niimi
IPC分类号： H01R39/06 , H02K5/14 , H02K9/28 , H02K13/00 , H02K5/18 , H02K13/04
CPC分类号： H02K5/148 , H01R39/06 , H02K9/28
摘要： Disclosed is a commutator type rotary electric machine which is designed to simplify the structure through reduction of number of component parts and allows to significantly enhance heat radiation from a brush. Both end bracket supports a rotary shaft and cylindrical brush holder are made of metal. The cylindrical brush holder is secured to the end bracket. The surface of internal periphery of brush holder is covered by an electrical insulator. Since it is sufficient for the electrical insulator to have a thickness effective to electrically insulate the brush from the cylindrical brush holder, heat generating from brush is effectively conducted to the end bracket and radiated from it. Since the end cylindrical brush holder is made of metals, it is strong, cheap and can be machined easily and both the cylindrical brush holder and the end bracket can be combined and secured easily and, since they can be molded as an integral component, the rigidity can be enhanced, manufacturing processes can be simplified and number of component parts can be reduced.
摘要翻译：公开了一种换向器型旋转电机，其设计为通过减少部件数量来简化结构，并允许显着增强来自刷子的热辐射。两端支架支撑旋转轴，圆柱形电刷架由金属制成。圆柱形刷架固定在端托架上。电刷架的内周表面被电绝缘体覆盖。由于电绝缘体具有有效使电刷与圆筒形电刷架电绝缘的厚度就足够了，所以从电刷产生的热量有效地传导到端支架并从其辐射。由于端圆柱形电刷架由金属制成，它坚固，便宜，并且可以容易地加工，圆柱形电刷架和端支架可以容易地组合和固定，并且由于它们可以被模制为一体的组件，可以提高刚性，可以简化制造工艺，并且可以减少部件数量。

2. 发明授权

US5428330A Magnet switch 失效
标题翻译：磁铁开关
公开(公告)号：US5428330A
公开(公告)日：1995-06-27
申请号：US320789
申请日：1994-10-11
申请人： Hiroaki Tamemoto
发明人： Hiroaki Tamemoto
IPC分类号： H01H50/16 , H01H50/36 , H01H51/06 , H01F7/10
CPC分类号： H01H51/065 , H01H50/36
摘要： A magnet switch for a starter device includes a plunger on which a sufficient pull force can be exerted. The plunger drives a movable contact, and is guided by a sleeve so as to move therealong. An excited coil wound on a bobbin is provided around an outer periphery of the sleeve. The exciting coil is covered by a cylindrical frame of a magnetic material, and a bottom plate portion of the frame has an opening fitted on the outer periphery of the sleeve. A cushion spring is interposed between the bottom plate portion of the frame and the bobbin to hold the exciting coil in a predetermined position. The cushion spring has an annular portion disposed in contact with the bottom plate portion and the outer periphery of the sleeve, and a magnetic path can be formed between the annular portion and the plunger.
摘要翻译：用于起动器装置的磁体开关包括其上可以施加足够的拉力的柱塞。柱塞驱动可动触头，并由套筒引导以便沿着其移动。缠绕在筒管上的激励线圈设置在套筒的外周周围。励磁线圈由磁性材料的圆柱形框架覆盖，框架的底板部分具有装配在套筒外周上的开口。缓冲弹簧插入在框架的底板部分和筒管之间，以将励磁线圈保持在预定位置。缓冲弹簧具有设置成与底板部分和套筒的外周接触的环形部分，并且可以在环形部分和柱塞之间形成磁路。

3. 发明申请

US20110298084A1 METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT 有权
标题翻译：制造半导体元件的方法
公开(公告)号：US20110298084A1
公开(公告)日：2011-12-08
申请号：US13202027
申请日：2010-02-04
申请人： Hiroaki Tamemoto
发明人： Hiroaki Tamemoto
IPC分类号： H01L21/78 , H01L27/12
CPC分类号： H01L29/0657 , B23K26/0006 , B23K26/3568 , B23K26/53 , B23K2101/40 , B23K2103/56 , B28D5/0011 , H01L21/78 , H01L33/0095
摘要： A method for manufacturing a semiconductor element of the present invention, has: a laser irradiation step of focusing a pulsed laser beam inside of a substrate constituting a wafer, thereby forming a plurality of isolated processed portions along an intended dividing line inside of the substrate, and creating a fissure that runs from the processed portions at least to the surface of the substrate and links adjacent processed portions; and a wafer division step of dividing the wafer along the intended dividing line.
摘要翻译：本发明的半导体元件的制造方法具有：将构成晶片的基板内的脉冲激光束聚焦的激光照射工序，从而沿着基板内的目标分割线形成多个隔离处理部，以及产生从所述加工部分至少到所述基板的表面延伸并且连接相邻处理部分的裂缝; 以及沿着所述分割线分割晶片的晶片划分步骤。

4. 发明授权

US08728916B2 Method for manufacturing semiconductor element 有权
标题翻译：半导体元件的制造方法
公开(公告)号：US08728916B2
公开(公告)日：2014-05-20
申请号：US13202027
申请日：2010-02-04
申请人： Hiroaki Tamemoto
发明人： Hiroaki Tamemoto
IPC分类号： H01L21/00
CPC分类号： H01L29/0657 , B23K26/0006 , B23K26/3568 , B23K26/53 , B23K2101/40 , B23K2103/56 , B28D5/0011 , H01L21/78 , H01L33/0095
摘要： A method for manufacturing a semiconductor element of the present invention, has: a laser irradiation step of focusing a pulsed laser beam inside of a substrate constituting a wafer, thereby forming a plurality of isolated processed portions along an intended dividing line inside of the substrate, and creating a fissure that runs from the processed portions at least to the surface of the substrate and links adjacent processed portions; and a wafer division step of dividing the wafer along the intended dividing line.
摘要翻译：本发明的半导体元件的制造方法具有：将构成晶片的基板内的脉冲激光束聚焦的激光照射工序，从而沿着基板内的目标分割线形成多个隔离处理部，以及产生从所述加工部分至少到所述基板的表面延伸并且连接相邻处理部分的裂缝; 以及沿着所述分割线分割晶片的晶片划分步骤。

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