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1. 发明授权

US08650797B2 DLC-coated fishing lure 有权
标题翻译： DLC涂层捕鱼诱饵
公开(公告)号：US08650797B2
公开(公告)日：2014-02-18
申请号：US12690527
申请日：2010-01-20
申请人： Hiroaki Sugita , Mitsuyoshi Hikosaka , Toshihiro Itoh
发明人： Hiroaki Sugita , Mitsuyoshi Hikosaka , Toshihiro Itoh
IPC分类号： A01K85/01 , A01K85/14 , A01K85/00
CPC分类号： A01K85/01 , A01K85/14
摘要： A DLC-coated fishing lure includes a fishing lure base material made of metal and having a predetermined shape; an intermediate layer made of one selected from a first group, a second group and a third group, the first group consisting of at least one kind of metal selected from the IIIb group, the IVa group, the Va group and the VIa group in the periodic table of elements, the second group consisting of at least one of a carbide, a nitride and a carbonitride of the at least one kind of metal, and the third group consisting of a mutual solid solution made of at least one selected from the first group and the second group, the intermediate layer being formed on a surface of the fishing lure base material; and a DLC layer having a thickness ranging from about 0.05 μm to about 0.55 μm and formed on the intermediate layer, the DLC layer presenting an appearance of a interference color.
摘要翻译： DLC涂层钓鱼诱饵包括由金属制成并具有预定形状的钓鱼诱饵基材; 由选自第一组，第二组和第三组中的一个制成的中间层，第一组由选自IIIb组，IVa组，Va组和VIa组中的至少一种金属组成，元素周期表，第二组由至少一种金属的碳化物，氮化物和碳氮化物中的至少一种组成，第三组由相互固溶体组成，所述第三组由选自第一组和第二组，中间层形成在钓鱼诱饵基材的表面上; 以及形成在中间层上的约0.05μm至约0.55μm厚度的DLC层，DLC层具有干涉色的外观。

2. 发明申请

US20060043552A1 Semiconductor device and process for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060043552A1
公开(公告)日：2006-03-02
申请号：US11213882
申请日：2005-08-30
申请人： Tadatomo Suga , Toshihiro Itoh
发明人： Tadatomo Suga , Toshihiro Itoh
IPC分类号： H01L23/02
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/49811 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/1319 , H01L2224/16 , H01L2224/7901 , H01L2224/81011 , H01L2224/81012 , H01L2224/81075 , H01L2224/81192 , H01L2224/81801 , H01L2224/81894 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
摘要翻译：半导体装置技术领域本发明涉及一种半导体装置，其中形成在半导体芯片上的电极和形成在布线板上的电极通过突出的弹性电极电连接，还涉及一种降低施加到形成在基板上的电极的压力的安装方法，当半导体芯片和布线板接合时的底部布线。

3. 发明授权

US07319339B2 Inspection apparatus to break the oxide of an electrode by fritting phenomenon 有权
标题翻译：检查装置通过烧结现象破坏电极的氧化物
公开(公告)号：US07319339B2
公开(公告)日：2008-01-15
申请号：US11759816
申请日：2007-06-07
申请人： Shinji Iino , Kiyoshi Takekoshi , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shinji Iino , Kiyoshi Takekoshi , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/067 , G01R1/06794 , G01R3/00 , G01R31/2886
摘要： Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要翻译：公开了一种通过使检查探针与检查电极电接触来检查装置的电气特性的检查方法。通过利用烧结现象使形成在检查电极表面上的绝缘膜破裂，从而使检查电极与检查电极电接触。

4. 发明申请

US20060145716A1 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object 有权
标题翻译：检查对象电气特性检查方法和检查装置
公开(公告)号：US20060145716A1
公开(公告)日：2006-07-06
申请号：US11296482
申请日：2005-12-08
申请人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
摘要翻译：形成在台的安装面上的至少一对电极与形成在检查对象物的第一面上的导电层接触，通过烧结现象在两者之间形成电路。

5. 发明授权

US06777967B2 Inspection method and inspection apparatus 失效
标题翻译：检验方法和检验仪器
公开(公告)号：US06777967B2
公开(公告)日：2004-08-17
申请号：US09931888
申请日：2001-08-20
申请人： Shinji Iino , Kiyoshi Takekoshi , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shinji Iino , Kiyoshi Takekoshi , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R3102
CPC分类号： G01R31/2891 , G01R1/067 , G01R1/06794 , G01R3/00 , G01R31/2886
摘要： Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要翻译：公开了一种通过使检查探针与检查电极电接触来检查装置的电气特性的检查方法。通过利用烧结现象使形成在检查电极表面上的绝缘膜破裂，从而使检查电极与检查电极电接触。

6. 发明授权

US07776735B2 Semiconductor device and process for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07776735B2
公开(公告)日：2010-08-17
申请号：US11889100
申请日：2007-08-09
申请人： Tadatomo Suga , Toshihiro Itoh
发明人： Tadatomo Suga , Toshihiro Itoh
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/49811 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/1319 , H01L2224/16 , H01L2224/7901 , H01L2224/81011 , H01L2224/81012 , H01L2224/81075 , H01L2224/81192 , H01L2224/81801 , H01L2224/81894 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
摘要翻译：半导体装置技术领域本发明涉及一种半导体装置，其中形成在半导体芯片上的电极和形成在布线板上的电极通过突出的弹性电极电连接，还涉及一种降低施加到形成在基板上的电极的压力的安装方法，当半导体芯片和布线板接合时的底部布线。

7. 发明申请

US20080174325A1 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object 失效
标题翻译：检查对象电气特性检查方法和检查装置
公开(公告)号：US20080174325A1
公开(公告)日：2008-07-24
申请号：US12007403
申请日：2008-01-10
申请人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
摘要翻译：形成在台的安装面上的至少一对电极与形成在检查对象物的第一面上的导电层接触，通过烧结现象在两者之间形成电路。

8. 发明授权

US07262613B2 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object 有权
公开(公告)号：US07262613B2
公开(公告)日：2007-08-28
申请号：US11296482
申请日：2005-12-08
申请人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

9. 发明授权

US07688088B2 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object 失效
标题翻译：检查对象电气特性检查方法和检查装置
公开(公告)号：US07688088B2
公开(公告)日：2010-03-30
申请号：US12007403
申请日：2008-01-10
申请人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
发明人： Shigekazu Komatsu , Tadatomo Suga , Toshihiro Itoh , Kenichi Kataoka
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
摘要翻译：形成在台的安装面上的至少一对电极与形成在检查对象物的第一面上的导电层接触，通过烧结现象在两者之间形成电路。

10. 发明授权

US07301243B2 High-reliable semiconductor device using hermetic sealing of electrodes 有权
标题翻译：使用气密密封电极的高可靠性半导体器件
公开(公告)号：US07301243B2
公开(公告)日：2007-11-27
申请号：US11212912
申请日：2005-08-29
申请人： Tadatomo Suga , Toshihiro Itoh
发明人： Tadatomo Suga , Toshihiro Itoh
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/10 , H01L21/50 , H01L23/20 , H01L24/11 , H01L24/13 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13111 , H01L2224/1319 , H01L2224/16225 , H01L2224/29111 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/157 , H01L2924/3025 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.
摘要翻译：本发明涉及一种高可靠性半导体器件，其中通过用框架元件密封电极而不是密封材料来防止形成在基板上的电极劣化。本发明的框架部件围绕形成在基板上的电极。框架构件的内部是空泡的或填充有不与诸如惰性气体的电极反应的气体，从而通过氧气或水分的发生防止电极劣化。

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