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    • 4. 发明授权
    • Ceramic substrate and a method for producing the same
    • 陶瓷基板及其制造方法
    • US5498580A
    • 1996-03-12
    • US219549
    • 1994-03-29
    • Yoshiaki YamadeYoichi Moriya
    • Yoshiaki YamadeYoichi Moriya
    • C03C10/00C03C10/08C03C10/10C03C14/00
    • C03C10/0045C03C14/004C03C2214/20
    • The ceramic substrate comprising a glass and a crystal is characterized by the glass comprising a MgO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O-base glass(R:alkali metal) and containing a 2MgO.2Al.sub.2 O.sub.3.5SiO.sub.2 crystal (cordierire) as the crystal. Due to the composition, the softening point of the glass becomes less than 720.degree. C. and the porosity decreases, so that the substrate can be dense. As a result, the coefficient of thermal expansion thereof can be close to silicon, the specific inductive capacity thereof can be small and the substrate can be excellent in transverse strength, moisture resistance, water resistance, etc. And, due to the lowered softening point, a ceramic substrate having the above characteristics can be produced even by sintering at between 800.degree. C. and 1000.degree. C., and ceramic substrate having an inner circuit interconnection made of Ag or Cu, etc. can be produced.
    • 包含玻璃和晶体的陶瓷衬底的特征在于包含MgO-Al 2 O 3 -SiO 2 -B 2 O 3 -R 2 O基玻璃(R:碱金属)并含有2MgO.2Al2O3.5SiO2晶体(堇青尔)作为晶体的玻璃 。 由于组成,玻璃的软化点变得小于720℃,并且孔隙率降低,使得底物可以是致密的。 结果,其热膨胀系数可以接近硅,其感应能力可以很小,并且基板的横向强度,耐湿性,耐水性等可以优异。由于软化点降低 具有上述特性的陶瓷基板即使在800℃〜1000℃下进行烧结,也可以制造出具有由Ag,Cu等构成的内部电路布线的陶瓷基板。