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    • 4. 发明授权
    • Sputtering apparatus
    • 溅射装置
    • US06286452B1
    • 2001-09-11
    • US09450176
    • 1999-11-29
    • Shigeru NamikiHidetoshi Kawa
    • Shigeru NamikiHidetoshi Kawa
    • C23C16509
    • H01J37/32834C23C14/34C23C14/505C23C14/564H01J37/3447
    • The chamber 1 of the spattering apparatus has a gas introduction port 2 provided at one side in a direction orthogonal to the opening/closing direction of a door 11 of chamber 1, and a vacuum evacuation port 3 provided on the other side of chamber. A substrate holder 4 is fixed on door 11, and a cathode 31 is arranged on a wall face facing door 11 of chamber 1. A shield 41 is arranged in close proximity to and so as to cover the peripheral part of substrate holder 4. A hole 42 is formed in shield 41 in a location facing vacuum evacuation port 3, whereby rapid vacuum evacuation can be achieved even though shield 41 is arranged in a condition close to sealing with respect to the peripheral part of substrate holder 4.
    • 溅射装置的室1具有设置在与室1的门11的开闭方向正交的方向的一侧的气体导入口2和设置在室的另一侧的真空排气口3。 基板保持件4固定在门11上,阴极31设置在与腔室1的门11相对的壁面上。屏蔽件41靠近并覆盖基板支架4的周边部分。 孔42形成在面向真空排气口3的位置的屏蔽层41中,由此即使屏蔽层41相对于基板保持件4的周边部分密封的状态布置,也可以实现快速的真空排气。