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    • 2. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20080220570A1
    • 2008-09-11
    • US12073618
    • 2008-03-07
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • H01L21/84
    • H01L29/78696H01L21/0237H01L21/02675H01L21/02691H01L27/1281
    • A semiconductor device having a highly responsive thin film transistor (TFT) with low subthreshold swing and suppressed decrease in the on-state current and a manufacturing method thereof are demonstrated. The THF of the present invention is characterized by its semiconductor layer where the thickness of the source region or the drain region is larger than that of the channel formation region. Manufacture of the TFT is readily achieved by the formation of an amorphous semiconductor layer on a projection portion and a depression portion, which is followed by subjecting the melting process of the semiconductor layer, resulting in the formation of a crystalline semiconductor layer having different thicknesses. Selective addition of impurity to the thick portion of the semiconductor layer provides a semiconductor layer in which the channel formation region is thinner than the source or drain region.
    • 示出了具有低亚阈值摆动和抑制导通电流下降的高响应性薄膜晶体管(TFT)的半导体器件及其制造方法。 本发明的THF的特征在于其源区域或漏极区域的厚度大于沟道形成区域的厚度的半导体层。 通过在突起部分和凹陷部分上形成非晶半导体层来容易地实现TFT的制造,随后对半导体层进行熔化处理,形成具有不同厚度的晶体半导体层。 选择性地向半导体层的厚部分添加杂质提供了沟道形成区域比源区或漏区更薄的半导体层。
    • 3. 发明授权
    • TFT device with channel region above convex insulator portions and source/drain in concave between convex insulator portions
    • TFT器件,其沟槽区域位于凸形绝缘体部分之上,并且在凸形绝缘体部分之间的凹陷中的源极/漏极
    • US08143118B2
    • 2012-03-27
    • US12073618
    • 2008-03-07
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • H01L21/84
    • H01L29/78696H01L21/0237H01L21/02675H01L21/02691H01L27/1281
    • A semiconductor device having a highly responsive thin film transistor (TFT) with low subthreshold swing and suppressed decrease in the on-state current and a manufacturing method thereof are demonstrated. The TFT of the present invention is characterized by its semiconductor layer where the thickness of the source region or the drain region is larger than that of the channel formation region. Manufacture of the TFT is readily achieved by the formation of an amorphous semiconductor layer on a projection portion and a depression portion, which is followed by subjecting the melting process of the semiconductor layer, resulting in the formation of a crystalline semiconductor layer having different thicknesses. Selective addition of impurity to the thick portion of the semiconductor layer provides a semiconductor layer in which the channel formation region is thinner than the source or drain region.
    • 示出了具有低亚阈值摆动和抑制导通电流下降的高响应性薄膜晶体管(TFT)的半导体器件及其制造方法。 本发明的TFT的特征在于其源极区域或漏极区域的厚度大于沟道形成区域的厚度的半导体层。 通过在突起部分和凹陷部分上形成非晶半导体层来容易地实现TFT的制造,随后对半导体层进行熔化处理,形成具有不同厚度的晶体半导体层。 选择性地向半导体层的厚部分添加杂质提供了沟道形成区域比源区或漏区更薄的半导体层。
    • 7. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07692194B2
    • 2010-04-06
    • US12015362
    • 2008-01-16
    • Shunpei YamazakiAtsuo IsobeHiromichi Godo
    • Shunpei YamazakiAtsuo IsobeHiromichi Godo
    • H01L29/04H01L31/036H01L31/0376H01L31/20
    • H01L29/78621H01L29/42384H01L29/4908H01L29/66757H01L29/78618H01L2924/0002H01L2924/00
    • A semiconductor device having a novel structure by which the operating characteristics and reliability are improved and a manufacturing method thereof. An island-shaped semiconductor layer provided over a substrate, including a channel formation region provided between a pair of impurity regions; a first insulating layer provided so as to be in contact with the side surface of the semiconductor layer; a gate electrode provided over the channel formation region so as to get across the semiconductor layer; and a second insulating layer provided between the channel formation region and the gate electrode are included. The semiconductor layer is locally thinned, the channel formation region is provided in the thinned region, and the second insulating layer covers the first insulating layer provided on the side surface of the semiconductor layer at least in the region which overlaps with the gate electrode.
    • 具有改善其操作特性和可靠性的新颖结构的半导体器件及其制造方法。 一种岛状半导体层,设置在衬底上,包括设置在一对杂质区之间的沟道形成区; 设置成与半导体层的侧表面接触的第一绝缘层; 栅电极,设置在所述沟道形成区上方以穿过所述半导体层; 并且包括设置在沟道形成区域和栅电极之间的第二绝缘层。 半导体层被局部变薄,沟道形成区域设置在减薄区域中,并且第二绝缘层至少在与栅电极重叠的区域中覆盖设置在半导体层的侧表面上的第一绝缘层。
    • 10. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US08530333B2
    • 2013-09-10
    • US12721298
    • 2010-03-10
    • Atsuo IsobeHiromichi GodoSatoshi Shinohara
    • Atsuo IsobeHiromichi GodoSatoshi Shinohara
    • H01L21/46
    • H01L21/76254H01L21/02532H01L21/02675H01L27/1218H01L29/66772
    • An object is to provide a semiconductor device which solves a problem that can occur when a substrate having an insulating surface is used. The semiconductor device includes a base substrate having an insulating surface; a conductive layer over the insulating surface; an insulating layer over the conductive layer; a semiconductor layer having a channel formation region, a first impurity region, a second impurity region, and a third impurity region provided between the channel formation region and the second impurity region over the insulating layer; a gate insulating layer configured to cover the semiconductor layer; a gate electrode over the gate insulating layer; a first electrode electrically connected to the first impurity region; and a second electrode electrically connected to the second impurity region. The conductive layer is held at a given potential.
    • 本发明的目的是提供一种半导体器件,其解决了当使用具有绝缘表面的衬底时可能发生的问题。 半导体器件包括具有绝缘表面的基底衬底; 绝缘表面上的导电层; 导电层上的绝缘层; 绝缘层上设置有沟道形成区域和第二杂质区域之间的具有沟道形成区域,第一杂质区域,第二杂质区域和第三杂质区域的半导体层; 构造成覆盖半导体层的栅极绝缘层; 栅绝缘层上的栅电极; 电连接到第一杂质区的第一电极; 和与第二杂质区电连接的第二电极。 导电层保持在给定的电位。