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1. 发明申请

US20100212198A1 SURFACE EMITTER AND INTERNALLY ILLUMINATED SIGN INCORPORATING THE SAME 审中-公开
标题翻译：表面发射体和内部发光符号
公开(公告)号：US20100212198A1
公开(公告)日：2010-08-26
申请号：US12734096
申请日：2008-03-25
申请人： Hideto Matsunaga , Masaru Tsukamoto , Nobuyuki Koizumi , Daisuke Ikeda
发明人： Hideto Matsunaga , Masaru Tsukamoto , Nobuyuki Koizumi , Daisuke Ikeda
IPC分类号： G09F13/04 , H01L33/62
CPC分类号： G09F9/33 , F21V33/006 , F21Y2115/10 , G09F13/22 , G09F19/22 , G09F19/226
摘要： To provide a novel surface emitter incorporating an LED element improved in waterproofness or other practical functionality to enable the surface emitter to be used not only for a sign but also for other various applications, in appearance and in workability, and an internally illuminated sign incorporating the same surface emitter. A surface emitter 1 according to the present invention has a flexible substrate 11 having electric wiring 12, a plurality of LED elements 13 disposed substantially regularly on the substrate 11, and a top film 14 disposed on the LED elements 13 in a stretched manner. When the top film 14 is disposed on the substrate 11 in a stretched manner, the top film 14 is applied to the substrate 11 to come into close contact with projections and depressions formed by the LED elements 13. More specifically, a vacuum pressure bonding process is used in which a space between the LED elements 13 and the top film 14 is evacuated, and the top film 14 is heated and pressure-bonded to the surface of the LED elements 13.
摘要翻译：提供一种新颖的表面发射器，其结合了改进了防水性或其他实用功能的LED元件，以使表面发射器不仅可用于符号，而且用于其它各种应用，外观和可加工性，以及内置照明标志相同的表面发射器。根据本发明的表面发射器1具有柔性基板11，其具有电布线12，基本上大致规则地设置在基板11上的多个LED元件13和以拉伸方式设置在LED元件13上的顶部膜14。当顶片14以拉伸的方式设置在基板11上时，顶片14被施加到基板11上以与由LED元件13形成的突起和凹陷紧密接触。更具体地，真空压接工艺使用LED元件13和顶部膜14之间的空间来抽真空，并且将顶部膜14加热并压接到LED元件13的表面。

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