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    • 4. 发明授权
    • Metal-polishing liquid and chemical-mechanical polishing method using the same
    • 金属抛光液和化学机械抛光方法使用相同
    • US08034252B2
    • 2011-10-11
    • US11701403
    • 2007-02-02
    • Katsuhiro Yamashita
    • Katsuhiro Yamashita
    • H01L21/461
    • H01L21/3212C09G1/02C09K3/1463C23F3/06
    • A metal-polishing liquid includes colloidal silica and a compound represented by Formula (I) or a compound represented by Formula (II). The colloidal silica is substituted by aluminum atoms at least one portion of the silicon atoms on the surfaces thereof. In Formula (I), R1 represents an alkyl group, alkynyl group, alkenyl group, allyl group or aryl group; R2 represents hydrogen atom, an alkyl group, alkynyl group, alkenyl group, allyl group or aryl group; m represents an integer from 0 to 6. In Formula (II), R3 represents an alkyl group or aryl group; n represents an integer from 1 to 30. R1—OOC—(CH2)m—COO—R2  Formula (I) R3—O—(CH2CH2O)n—SO3H  Formula (II)
    • 金属抛光液包括胶体二氧化硅和由式(I)表示的化合物或由式(II)表示的化合物。 胶体二氧化硅被铝原子的至少一部分硅表面的硅原子取代。 在式(I)中,R 1表示烷基,炔基,烯基,烯丙基或芳基; R2表示氢原子,烷基,炔基,烯基,烯丙基或芳基; m表示0至6的整数。在式(II)中,R 3表示烷基或芳基; n表示1〜30的整数。R1-OOC-(CH2)m -COO-R2式(Ⅰ)R3-O-(CH2CH2O)n-SO3H式(Ⅱ)
    • 5. 发明授权
    • Positive resist composition and pattern forming method using the same
    • 正型抗蚀剂组合物和使用其的图案形成方法
    • US08017299B2
    • 2011-09-13
    • US12257646
    • 2008-10-24
    • Katsuhiro Yamashita
    • Katsuhiro Yamashita
    • G03F7/004G03F7/30
    • G03F7/0392G03F7/0395G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition for electron beam, X-ray or EUV exposure, including (A) a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developer; and (B) a compound capable of generating a sulfonic acid upon irradiation with an actinic ray or radiation, wherein the resin (A) is a resin having a phenolic hydroxyl group and having a weight average molecular weight of 1,500 to 3,500, the positive resist composition has a property of decomposing by the action of an acid and causing the dissolution rate in an aqueous 2.38 wt % tetramethylammonium hydroxide solution at 23° C. under normal pressure to increase in a range of 200 to 5,000 times, and the positive resist composition has a solid content concentration of from 2.5 to 4.5 mass %.
    • 一种用于电子束,X射线或EUV曝光的正型抗蚀剂组合物,包括(A)能够通过酸的作用分解以提高在碱性显影剂中的溶解度的树脂; 和(B)能够在用光化射线或辐射照射时能够产生磺酸的化合物,其中树脂(A)是具有酚羟基并且重均分子量为1,500至3,500的树脂,正性抗蚀剂 组合物具有通过酸的作用分解的性质,并且在常压下在23℃下使2.38重量%四甲基氢氧化铵水溶液中的溶解速率增加到200-5000倍的范围,并且正性抗蚀剂组合物 固体成分浓度为2.5〜4.5质量%。
    • 6. 发明授权
    • Method for processing organic solvent-containing air
    • 加工含有机溶剂的空气的方法
    • US07582139B2
    • 2009-09-01
    • US11678712
    • 2007-02-26
    • Masaji KurosawaKatsuhiro YamashitaTomohiro Deguchi
    • Masaji KurosawaKatsuhiro YamashitaTomohiro Deguchi
    • B01D53/06B01D53/86F23G7/07
    • B01D53/04B01D53/261B01D53/8668B01D2257/704Y02A50/2328
    • A method for processing an organic solvent-containing air capable of being operated in spite of a rapid fluctuation of the concentration of organic solvents in the air to be processed and capable of using a combustion furnace exhaust gas as an air for regenerating dehumidifying member is provided. The method comprises carrying out simultaneously and continuously a dehumidification step (a), an adsorption-removing step (b), an adsorbing member-regeneration step (c), a combustion step (d), and a dehumidifying member-regeneration step (e) comprising mixing the adsorption-treated air produced in the adsorbing-removing step (b) with a combustion furnace exhaust gas produced in the combustion step (d) to obtain a mixed gas, decomposing the organic solvents in the mixed gas by oxidation, and causing the resulting purified gas to flow through the dehumidifying member which has adsorbed moisture, thereby regenerating the dehumidifying member.
    • 提供一种处理有机溶剂的空气的方法,即使在待处理的空气中的有机溶剂的浓度迅速变动并且能够使用燃烧炉废气作为用于再生除湿构件的空气的空气中, 。 该方法包括同时且连续地进行除湿步骤(a),吸附除去步骤(b),吸附部件再生步骤(c),燃烧步骤(d)和除湿部件再生步骤(e )包括将吸附去除步骤(b)中产生的吸附处理的空气与在燃烧步骤(d)中产生的燃烧炉废气混合以获得混合气体,通过氧化分解混合气体中的有机溶剂,以及 使得所得净化气体流过已吸收水分的除湿构件,从而再生除湿构件。
    • 7. 发明申请
    • POSITIVE RESIST COMPOSITION FOR USE WITH ELECTRON BEAM, X-RAY OR EUV AND PATTERN FORMING METHOD USING THE SAME
    • 使用电子束,X射线或EUV的正电阻组合物及其形成方法
    • US20090202946A1
    • 2009-08-13
    • US12370368
    • 2009-02-12
    • Katsuhiro Yamashita
    • Katsuhiro Yamashita
    • G03F7/004G03F7/20
    • G03F7/039G03F7/0045
    • A positive resist composition for use with electron beam, X-ray or EUV and a pattern forming method using the positive resist composition are provided, the positive resist composition including: (A) a resin capable of decomposing under an action of an acid to increase a dissolution rate in an aqueous alkali solution; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a basic compound; and (D) an organic solvent, wherein the entire solid content concentration in the resist composition is from 1.0 to 4.5 mass % and a ratio of (B) the compound capable of generating an acid upon irradiation with actinic rays or radiation is from 10 to 50 mass % based on the entire solid content.
    • 提供了用于电子束,X射线或EUV的正型抗蚀剂组合物和使用正性抗蚀剂组合物的图案形成方法,正性抗蚀剂组合物包括:(A)能够在酸的作用下分解以增加的树脂 在碱性水溶液中的溶解速率; (B)能够在用光化射线或辐射照射时能够产生酸的化合物; (C)碱性化合物; 和(D)有机溶剂,其中抗蚀剂组合物中的全部固体成分浓度为1.0〜4.5质量%,(B)在光化射线或辐射照射时能够产生酸的化合物的比例为10〜 基于整体固体含量为50质量%。