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    • 4. 发明授权
    • Photosemiconductor device and epoxy resin composition for use in molding
photosemiconductor
    • 光半导体器件和用于成型光半导体的环氧树脂组合物
    • US5107327A
    • 1992-04-21
    • US553284
    • 1990-07-17
    • Syuuji NishimoriTadaaki HaradaYasuhiko YamamotoNobuyuki HiromoriYasumori YoshimuraKatsuya MuramatsuKatsumi Shimada
    • Syuuji NishimoriTadaaki HaradaYasuhiko YamamotoNobuyuki HiromoriYasumori YoshimuraKatsuya MuramatsuKatsumi Shimada
    • C08G59/24C08G59/42C08L63/00H01L31/0203H01L31/0232
    • H01L31/0232C08G59/245C08G59/4215C08L63/00H01L31/0203H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265
    • A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):(A) the refractive index difference X between refractive index values (b) and (c), which respectively are lower and higher than refractive index value (a) corresponding to the maximum peak of the refractive index distribution curve and respectively correspond to those points on the refractive index distribution curve which have a relative height of 20 with the height of the maximum peak being taken as 100, is 0.0018 or less;(B) the refractive index difference Y, which is the larger one of the difference between the refractive index values (a) and (b) and the difference between the refractive index values (a) and (c), is 0.0012 or less; and(C) in the case where the refractive index distribution curve has other peak or peaks than the maximum peak corresponding to the refractive index value (a), the refractive index difference Z, which is the largest one of the differences between the refractive index value (a) and refractive index values (d, . . . d.sub.n) corresponding to the other peak or peaks, is 0.0010 or less.
    • 一种光半导体装置和用于模制用于光半导体装置的光半导体的环氧树脂组合物,该光半导体装置包括用固化的透明环氧树脂组合物模制的光半导体元件,该固化的透明环氧树脂组合物具有折射率分布曲线,其特征在于 (A),(B)和(C):(A)折射率值(b)和(c)之间的折射率差X分别低于和高于对应于 折射率分布曲线的最大峰值分别对应于折射率分布曲线上具有相对高度为20,最大峰值的高度为100的那些点为0.0018或更小; (B)折射率值(a)和(b)之差大于折射率值(a)和(c)之差的折射率差Y为0.0012以下; 和(C)在折射率分布曲线具有与折射率值(a)对应的最大峰值以外的其它峰值或峰值的情况下,折射率差Z是折射率 对应于其他峰或峰的值(a)和折射率值(d,...,dn)为0.0010以下。