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    • 5. 发明授权
    • Apparatus and method for chemical/mechanical polishing
    • 化学/机械抛光的装置和方法
    • US06191038B1
    • 2001-02-20
    • US09145126
    • 1998-09-01
    • Hideaki YoshidaMasashi Hamanaka
    • Hideaki YoshidaMasashi Hamanaka
    • H01L21302
    • B24B53/017B24B37/04B24B49/16H01L21/30625
    • A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.
    • 抛光垫固定在安装成可旋转的抛光台上。 磨料供应管将磨料供应到抛光垫上。 衬底保持器安装成能够在抛光垫上方旋转,保持要抛光的衬底并将衬底压靠在抛光垫上,从而抛光衬底。 修整器被安装成可以在抛光垫上方旋转,并且打磨抛光垫。 扭矩检测器检测研磨台板的旋转扭矩或基板保持器的旋转扭矩。 如果由转矩检测器检测到的转动转矩等于或小于预定值,则修整器控制器使修整器穿着抛光垫。
    • 6. 发明授权
    • Method for forming buried interconnect
    • 掩埋互连的形成方法
    • US06737348B2
    • 2004-05-18
    • US10120385
    • 2002-04-12
    • Mitsunari SatakeMasashi HamanakaHideaki Yoshida
    • Mitsunari SatakeMasashi HamanakaHideaki Yoshida
    • H01L21461
    • H01L21/7684H01L21/31053H01L21/3212H01L21/76819
    • Holes are formed in a first insulating film deposited on a substrate. After depositing a first conducting film over the first insulating film including the holes, the first conducting film is subjected to first CMP, so as to form plugs from the first conducting film. Next, the first insulating film is subjected to second CMP with a polishing rate of the first insulating film higher than a polishing rate of the first conducting film, so as to planarize the first insulating film by eliminating erosion caused in a region of the first insulating film where the plugs are densely formed. After depositing a second insulating film on the planarized first insulating film, interconnect grooves are formed in the second insulating film. After depositing a second conducting film over the second insulating film including the interconnect grooves, the second conducting film is subjected to third CMP, so as to form buried interconnects from the second conducting film.
    • 在沉积在基板上的第一绝缘膜中形成孔。 在包括孔的第一绝缘膜上沉积第一导电膜之后,对第一导电膜进行第一CMP,以形成来自第一导电膜的插塞。 接下来,对第一绝缘膜进行第二CMP,其中第一绝缘膜的抛光速率高于第一导电膜的抛光速率,以便通过消除在第一绝缘膜的区域中引起的侵蚀而使第一绝缘膜平坦化 胶片密集地形成。 在平坦化的第一绝缘膜上沉积第二绝缘膜之后,在第二绝缘膜中形成互连槽。 在包括互连槽的第二绝缘膜上沉积第二导电膜之后,对第二导电膜进行第三CMP,以形成来自第二导电膜的掩埋互连。
    • 7. 发明授权
    • Apparatus and method for chemical/mechanical polishing
    • 化学/机械抛光的装置和方法
    • US06416617B2
    • 2002-07-09
    • US09725844
    • 2000-11-30
    • Hideaki YoshidaMasashi Hamanaka
    • Hideaki YoshidaMasashi Hamanaka
    • B24B4900
    • B24B53/017B24B37/04B24B49/16H01L21/30625
    • A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.
    • 抛光垫固定在安装成可旋转的抛光台上。 磨料供应管将磨料供应到抛光垫上。 衬底保持器安装成能够在抛光垫上方旋转,保持要抛光的衬底并将衬底压靠在抛光垫上,从而抛光衬底。 修整器被安装成可以在抛光垫上方旋转,并且打磨抛光垫。 扭矩检测器检测研磨台板的旋转扭矩或基板保持器的旋转扭矩。 如果由转矩检测器检测到的转动转矩等于或小于预定值,则修整器控制器使修整器穿着抛光垫。