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1. 发明授权

US07876030B2 Ultrasonic transducer which is either crimped or welded during assembly 有权
标题翻译：超声波换能器在组装时被压接或焊接
公开(公告)号：US07876030B2
公开(公告)日：2011-01-25
申请号：US12207539
申请日：2008-09-10
申请人： Hideaki Taki , Wataru Kimura , Noritaka Yoshida , Naohito Sato , Mitsugu Onoda , Hiroyuki Kawaji
发明人： Hideaki Taki , Wataru Kimura , Noritaka Yoshida , Naohito Sato , Mitsugu Onoda , Hiroyuki Kawaji
IPC分类号： H01L41/04 , H01L41/08
CPC分类号： B06B1/0607 , A61B17/320068 , G10K11/004
摘要： An ultrasonic transducer includes: piezoelectric elements; a pair of clamping members which clamp said piezoelectric elements; and a cover member which is crimped to at least one of said pair of clamping members in a state where said cover member cooperates with said pair of clamping members to surround said piezoelectric elements.
摘要翻译：超声换能器包括：压电元件; 夹紧所述压电元件的一对夹紧构件; 以及盖构件，其在所述盖构件与所述一对夹紧构件配合以包围所述压电元件的状态下卷曲到所述一对夹紧构件中的至少一个。

2. 发明授权

US07847468B2 Ultrasonic transducer and ultrasonic apparatus having the same 有权
标题翻译：超声波换能器和具有相同功能的超声波装置
公开(公告)号：US07847468B2
公开(公告)日：2010-12-07
申请号：US12057546
申请日：2008-03-28
申请人： Wataru Kimura , Hideaki Taki
发明人： Wataru Kimura , Hideaki Taki
IPC分类号： H01L41/053
CPC分类号： B06B1/0618 , H01L41/0472 , H01L41/0474 , H01L41/0536 , H01L41/0838
摘要： An ultrasonic transducer (101, 102, 103) includes: a front member (1, 1a) having a front side on which an ultrasonic radiating surface (11) is provided and a back side which is opposite to the front side; a side member (2, 2a); a backing member (3, 3a); and a piezoelectric ceramic body (4), which are provided axially integrally, wherein one end side of the side member (2, 2a) is fitted to the back side of the front member (1, 1a), one end side of the backing member (3, 3a) is fitted to another end side of the side member (2, 2a), and the piezoelectric ceramic body (4) is interposed between the front member (1, 1a) and the backing member (3, 3a).
摘要翻译：超声波换能器（101,102,103）包括：具有前侧的前部件（1,1a），其上设置有超声波辐射表面（11）和与前侧相对的后侧; 侧构件（2,2a）; 背衬构件（3,3a）; 以及轴向一体地设置的压电陶瓷体（4），其中所述侧构件（2,2a）的一端侧嵌合在所述前构件（1,1a）的后侧，所述背衬的一端侧构件（3,3a）安装在侧构件（2,2a）的另一端侧，并且压电陶瓷体（4）插入在前构件（1,1a）和背衬构件（3,3a）之间，。

3. 发明授权

US06844796B2 Dielectric filter having increased bandwidth 失效
标题翻译：介质滤波器具有增加的带宽
公开(公告)号：US06844796B2
公开(公告)日：2005-01-18
申请号：US10395303
申请日：2003-03-25
申请人： Hideaki Taki , Kazuto Fuzisaka
发明人： Hideaki Taki , Kazuto Fuzisaka
IPC分类号： H01P1/205 , H01P7/10 , H01P1/213 , H03K5/00
CPC分类号： H01P7/10 , H01P1/205
摘要： A dielectric filter includes a plurality of resonators provided in a dielectric block in parallel to each other. Each resonator is formed through providing an inner conductor on a wall surface of a through-hole extending between first and second end surfaces of the block. An outer conductor is provided on end and side surfaces of the block except for the first end surface. The inner conductor and the outer conductor are connected together so that the second end surface serves as a short circuit end surface, and the first end surface serves as an open end surface. A pair of input-output terminals are provided on a side surface of the block so that the input-output terminals are located adjacent to the open end surface at respective positions corresponding to open ends of two of the resonators. Insulating sections on the side surface isolate corresponding input-output terminals from the outer conductor formed on the side surface of the block. A section without a conductor thereon is used in controlling filter characteristics. This section is provided on the side surface between the input-output terminals and extends for a predetermined distance along the insulating sections from an edge between the side surface and the open end surface.
摘要翻译：介质滤波器包括彼此平行地设置在介质块中的多个谐振器。每个谐振器通过在块的第一和第二端面之间延伸的通孔的壁表面上提供内导体而形成。外部导体设置在除了第一端面之外的块的端部和侧表面上。内导体和外导体连接在一起，使得第二端面用作短路端面，第一端面用作开口端面。一对输入输出端子设置在块的侧表面上，使得输入输出端子位于与两个谐振器的开路端对应的各个位置处邻近开口端表面。侧面的绝缘部分将相应的输入输出端子与形成在块体的侧表面上的外部导体隔离。在其上没有导体的部分用于控制滤波器特性。该部分设置在输入 - 输出端子之间的侧表面上，并且沿着绝缘部分从侧表面和开口端表面之间的边缘延伸预定距离。

4. 发明授权

US07034404B1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device 失效
标题翻译：用于半导体封装的树脂组合物，由其获得的半导体器件，以及用于制造半导体器件的工艺
公开(公告)号：US07034404B1
公开(公告)日：2006-04-25
申请号：US09914363
申请日：2000-02-21
申请人： Tadaaki Harada , Hideaki Taki , Toshitsugu Hosokawa
发明人： Tadaaki Harada , Hideaki Taki , Toshitsugu Hosokawa
IPC分类号： H01L23/29
CPC分类号： H01L23/293 , C08G59/62 , C08L61/04 , C08L63/00 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25° C. and 5,000 poise or less at 80° C.
摘要翻译：本发明提供了一种半导体封装用树脂组合物，其耐湿性和储存稳定性以及放电性和涂布性都具有优异的可靠性。用于半导体封装的树脂组合物包括：（A）环氧树脂; （B）酚醛树脂; （C）潜伏性固化促进剂; 和D）无机填料，并且在25℃下具有7000泊或更高的粘度，在80℃下具有5,000泊或更低的粘度

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