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1. 发明申请

US20130175877A1 POWER SUPPLYING MODULE FOR CONTACTLESS POWER SUPPLYING DEVICE, METHOD FOR USING POWER SUPPLYING MODULE OF CONTACTLESS POWER SUPPLYING DEVICE, AND METHOD FOR MANUFACTURING POWER SUPPLYING MODULE OF CONTACTLESS POWER SUPPLYING DEVICE 有权
标题翻译：无接触供电装置用电源模块，无接点供电装置供电模块的使用方法以及制造无连接电源装置供电模块的方法
公开(公告)号：US20130175877A1
公开(公告)日：2013-07-11
申请号：US13823975
申请日：2012-01-11
申请人： Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
发明人： Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
IPC分类号： H04B5/00 , H05K13/04
CPC分类号： H04B5/0037 , H01F38/14 , H02J7/025 , H02J17/00 , H02J50/00 , H02J50/12 , H02J50/40 , H02J50/60 , H02J50/70 , H02J50/80 , H05K13/04 , Y10T29/4902
摘要： Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.
摘要翻译：配备有具有相同规格的初级线圈的线圈单元设置在馈电模块中。在印刷电路板上形成线圈单元相互啮合的凹槽以匹配每个线圈单元。用于与形成在线圈单元上的电极连接在一起的垫形成在每个线圈单元相互啮合的凹陷部分的底面上。通过将每个线圈单元嵌入每个线圈单元相互啮合的凹部并将它们连接在一起，可以容易地将多个线圈单元安装到印刷电路板上，这将使制造效率得以提高。

2. 发明授权

US09325386B2 Power supplying module for contactless power supplying device, method for using power supplying module of contactless power supplying device, and method for manufacturing power supplying module of contactless power supplying device 有权
标题翻译：非接触式供电装置的供电模块，非接触式供电装置的供电模块的使用方法以及非接触供电装置的供电模块的制造方法
公开(公告)号：US09325386B2
公开(公告)日：2016-04-26
申请号：US13823975
申请日：2012-01-11
申请人： Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
发明人： Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
IPC分类号： H02J17/00 , H04B5/00 , H05K13/04 , H01F38/14
CPC分类号： H04B5/0037 , H01F38/14 , H02J7/025 , H02J17/00 , H02J50/00 , H02J50/12 , H02J50/40 , H02J50/60 , H02J50/70 , H02J50/80 , H05K13/04 , Y10T29/4902
摘要： Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.
摘要翻译：配备有具有相同规格的初级线圈的线圈单元设置在馈电模块中。在印刷电路板上形成线圈单元相互啮合的凹槽以匹配每个线圈单元。用于与形成在线圈单元上的电极连接在一起的垫形成在每个线圈单元相互啮合的凹陷部分的底面上。通过将每个线圈单元嵌入每个线圈单元相互啮合的凹部并将它们连接在一起，可以容易地将多个线圈单元安装到印刷电路板上，这将使制造效率得以提高。

3. 发明申请

US20070189661A1 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly 有权
标题翻译：用于衬底安装光电路电路的材料和衬底安装光电路电路混合
公开(公告)号：US20070189661A1
公开(公告)日：2007-08-16
申请号：US11783796
申请日：2007-04-12
申请人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
发明人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , B32B15/08 , G02B6/12004 , G02B6/13 , G02B6/138 , H05K1/0274 , H05K3/386 , H05K3/4652 , H05K2201/0108 , H05K2201/0195 , Y10T428/24942
摘要： A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.
摘要翻译：用于光电路电路混合安装衬底的材料包括透光树脂层和由活化能量束照射时折射率增加（或降低）的透光树脂制成的光电路形成层，配置在与透光性树脂层相邻的位置，其中，当光电路电路的材料混合安装基板时，光电路形成层的一部分的折射率比透光性树脂层的折射率高（或更低）用激活能量束照射，使得所述部分被照射。

4. 发明授权

US06399947B2 Infrared ray receiving element and infrared ray sensor using the same 有权
标题翻译：红外线接收元件和使用其的红外线传感器
公开(公告)号：US06399947B2
公开(公告)日：2002-06-04
申请号：US09734397
申请日：2000-12-11
申请人： Hiroyuki Yagyu , Tomoaki Matsushima , Motoo Ikari , Yuji Takada , Ryo Taniguchi , Makoto Nishimura , Nobuyuki Miyagawa , Masato Kawashima
发明人： Hiroyuki Yagyu , Tomoaki Matsushima , Motoo Ikari , Yuji Takada , Ryo Taniguchi , Makoto Nishimura , Nobuyuki Miyagawa , Masato Kawashima
IPC分类号： G01J102
CPC分类号： G01J5/34
摘要： An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.
摘要翻译：一种红外线接收元件包括由热电材料制成的基片，并具有被狭缝包围的至少一个悬臂部分，其中基片中的悬臂部分的至少一部分在同一方向上均匀偏振，其余部分在衬底包括随机偏振的部分。至少一对电极分别设置在悬臂部分的顶表面和底表面上。

5. 发明申请

US20120321250A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20120321250A1
公开(公告)日：2012-12-20
申请号：US13580238
申请日：2011-02-23
申请人： Tadahiro Yamaji , Nobuyuki Asashi , Hiroyuki Yagyu , Yutaka Kinugasa , Takuya Matsumoto , Tsutomu Niiho
发明人： Tadahiro Yamaji , Nobuyuki Asashi , Hiroyuki Yagyu , Yutaka Kinugasa , Takuya Matsumoto , Tsutomu Niiho
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/3652 , G02B6/3692 , G02B6/4246
摘要： Disclosed is an optical module which improves optical coupling efficiency either when configured to receive an optical signal from an optical fiber with a light receiving element or when configured to receive an optical signal from a light emitting element with an optical fiber. The optical module includes: a substrate (1) having in the surface thereof a first groove (1a) and a second groove (1b) formed, with this second groove (1b) being configured to have a substantially V-shaped cross section formed deeper than the first groove and being formed in continuation from the first groove; and an internal waveguide (16) provided within the first groove (1a) of the substrate (1). The optical further modules a mirror portion (15) for changing an optical path, provided at the front end of the first groove (1a); an optical element (12a) mounted on the surface of the substrate (1) so as to face the mirror portion (15), and configured to emit an optical signal to a core (17) of the internal waveguide (16) via the mirror portion (15). Moreover, the optical module further includes an optical fiber (2) having a fiber cladding (22) placed within the second groove (1b) and a fiber core (21) optically connected to the core (17) of the internal waveguide (16).
摘要翻译：公开了一种当被配置为从具有光接收元件的光纤接收光信号时或当被配置为从具有光纤的发光元件接收光信号时提高光耦合效率的光模块。光学模块包括：基板（1），其表面上形成有第一凹槽（1a）和形成的第二凹槽（1b），该第二凹槽（1b）构造成具有大致V形横截面并且从第一凹槽连续形成; 以及设置在所述基板（1）的所述第一凹槽（1a）内的内部波导（16）。所述光学装置还包括设置在所述第一凹槽（1a）的前端处的用于改变光路的反射镜部分（15）。安装在所述基板（1）的表面上以与所述镜部（15）相对的光学元件（12a），并且经配置以经由所述反射镜向所述内部波导管（16）的芯部（17）发射光信号部分（15）。此外，光学模块还包括具有放置在第二凹槽（1b）内的光纤包层（22）的光纤（2）和与内部波导（16）的芯部（17）光学连接的光纤芯（21）。

6. 发明申请

US20090238963A1 PROCESS OF FORMING A DEFLECTION MIRROR IN A LIGHT WAVEGUIDE 有权
标题翻译：在光波导中形成偏光镜的过程
公开(公告)号：US20090238963A1
公开(公告)日：2009-09-24
申请号：US12479412
申请日：2009-06-05
申请人： Hiroyuki Yagyu , Tooru Nakashiba , Shinji Hashimoto
发明人： Hiroyuki Yagyu , Tooru Nakashiba , Shinji Hashimoto
IPC分类号： B29D11/00 , B26D3/06 , B05D5/06
CPC分类号： G02B6/122 , B24B13/015 , G02B6/1221 , G02B6/4214 , G02B2006/12104 , Y10T83/0304 , Y10T83/05
摘要： A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.
摘要翻译：使用具有切割端的切割刀片的平坦顶切割面和至少一个倾斜侧切割面在光波导中形成偏转镜的过程。该方法包括将光波导的表面切割到不大于平顶切割面的宽度的深度的切割步骤，从而在光波导的表面中形成凹槽。凹槽具有由倾斜的切割面形成的倾斜表面，以在波导中限定偏转镜。

7. 发明申请

US20080113168A1 MATERIAL FOR SUBSTRATE MOUNTING OPTICAL CIRCUIT-ELECTRICAL CIRCUIT MIXEDLY AND SUBSTRATE MOUNTING OPTICAL CIRCUIT-ELECTRICAL CIRCUIT MIXEDLY 审中-公开
标题翻译：基板材料安装光电路电路混合和基板安装光电路电路混合
公开(公告)号：US20080113168A1
公开(公告)日：2008-05-15
申请号：US11957121
申请日：2007-12-14
申请人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
发明人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
IPC分类号： B32B7/02
CPC分类号： G02B6/43 , B32B15/08 , G02B6/12004 , G02B6/13 , G02B6/138 , H05K1/0274 , H05K3/386 , H05K3/4652 , H05K2201/0108 , H05K2201/0195 , Y10T428/24942
摘要： A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.
摘要翻译：用于光电路电路混合安装衬底的材料包括透光树脂层和由活化能量束照射时折射率增加（或降低）的透光树脂制成的光电路形成层，配置在与透光性树脂层相邻的位置，其中，当光电路电路的材料混合安装基板时，光电路形成层的一部分的折射率比透光性树脂层的折射率高（或更低）用激活能量束照射，使得所述部分被照射。

8. 发明授权

US08575529B2 Photoelectric converter providing a waveguide along the surface of the mount substrate 有权
标题翻译：光电转换器沿着安装基板的表面提供波导
公开(公告)号：US08575529B2
公开(公告)日：2013-11-05
申请号：US12376891
申请日：2007-08-08
申请人： Nobuyuki Asahi , Makoto Nishimura , Hiroyuki Yagyu , Yutaka Kinugasa , Takuya Matsumoto
发明人： Nobuyuki Asahi , Makoto Nishimura , Hiroyuki Yagyu , Yutaka Kinugasa , Takuya Matsumoto
IPC分类号： G01J1/42
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/4232 , G02B6/4284 , G02B6/43 , G02B2006/12147 , H01L2224/16225
摘要： To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.
摘要翻译：提供能够降低器件高度的光电转换器。光电转换器包括：发光元件或光接收元件; 用于向/从发光元件或光接收元件发送/接收电信号的IC电路; 适于从发光元件发光的一侧安装在一个表面上的安装基板或光接收元件接收光的一侧; 电连接器，其适于设置在所述安装基板的一个表面或另一个表面上，并且从外部连接器被安装和拆卸; 以及适于沿着安装基板的一个表面或另一个表面设置在安装基板上并且光学耦合到发光元件或光接收元件的波导。

9. 发明申请

US20050238278A1 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly 有权
标题翻译：用于衬底安装光电路电路的材料和衬底安装光电路电路混合
公开(公告)号：US20050238278A1
公开(公告)日：2005-10-27
申请号：US10515175
申请日：2003-05-27
申请人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
发明人： Tooru Nakashiba , Kouhei Kotera , Tomoaki Matsushima , Yukio Matsushita , Hideo Nakanishi , Shinji Hashimoto , Tomoaki Nemoto , Hiroyuki Yagyu , Yuuki Kasai
IPC分类号： G02B6/12 , G02B6/122 , G02B6/13 , G02B6/138 , G02B6/42 , G02B6/43 , H05K1/02 , H05K3/38 , H05K3/46
CPC分类号： G02B6/43 , B32B15/08 , G02B6/12004 , G02B6/13 , G02B6/138 , H05K1/0274 , H05K3/386 , H05K3/4652 , H05K2201/0108 , H05K2201/0195 , Y10T428/24942
摘要： A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.
摘要翻译：用于光电路电路混合安装衬底的材料包括透光树脂层和由活化能量束照射时折射率增加（或降低）的透光树脂制成的光电路形成层，配置在与透光性树脂层相邻的位置，其中，当光电路电路的材料混合安装基板时，光电路形成层的一部分的折射率比透光性树脂层的折射率高（或更低）用激活能量束照射，使得所述部分被照射。

10. 发明授权

US6121614A Pyroelectric-type IR receiving element and IR sensor using the same 失效
标题翻译：热电型IR接收元件和使用其的IR传感器
公开(公告)号：US6121614A
公开(公告)日：2000-09-19
申请号：US837105
申请日：1997-04-14
申请人： Ryo Taniguchi , Motoo Ikari , Tomoaki Matsushima , Hiroyuki Yagyu , Yoshihiro Matsumura , Kyosuke Iribe , Toshiyuki Suzuki , Sadayuki Sumi , Kazuhiro Horiuchi , Hideki Ohashi
发明人： Ryo Taniguchi , Motoo Ikari , Tomoaki Matsushima , Hiroyuki Yagyu , Yoshihiro Matsumura , Kyosuke Iribe , Toshiyuki Suzuki , Sadayuki Sumi , Kazuhiro Horiuchi , Hideki Ohashi
IPC分类号： G01J5/34 , G01J5/02 , H01L37/02
CPC分类号： G01J5/34
摘要： A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.
摘要翻译：热电式IR接收元件包括热电衬底，其在其支撑端处固定到支撑体，并且在衬底中形成至少一个矩形贴片。贴片在其相对表面上形成有彼此重叠的第一和第二电极。基板具有由一对侧缝隙构成的U形狭缝和连接侧缝的基部狭缝。 U形狭缝连续地包围贴片的三个侧面，使得贴片以悬臂的方式由基底支撑在与基底的一个支撑端相对的悬臂端。由于当基板暴露于温度变化时施加到基板的热应力被U形狭缝吸收，所以在贴片中不会产生要考虑的应力集中。结果，可以在保持良好的红外线灵敏度的同时减少爆米花噪声的发生。

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