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    • 1. 发明授权
    • Dielectric slab antennas
    • 介质板天线
    • US4835543A
    • 1989-05-30
    • US801533
    • 1985-11-27
    • Hermann B. Sequeira
    • Hermann B. Sequeira
    • G02B6/12H01P1/10H01P1/32H01P1/36H01P1/38H01P3/02H01P3/08H01P3/16H01P5/08H01Q13/20H01Q13/24H01Q13/28H03C7/00
    • H01P3/082H01P1/10H01P1/32H01P3/16H01Q13/20
    • A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention is directed to antenna structures formed from this type of multi-layer dielectric slab structure.
    • 一种包括多层电介质板结构的传输线,包括:具有厚度ds和介电常数ε的电介质基底层(30); 介电基片层(30)的底表面上的导电接地层(31); 电介质引导层(32),其具有附着到电介质基底层(30)的顶表面的厚度h和介电常数εg,其中εg>ε; 具有宽度W,厚度d1和介电常数ε1的至少一个细长且相对较窄的电介质加载带层,其中ε1>ε1附着到电介质引导层(32)的顶表面; 以及在介电加载带层(32)的顶表面上的导电涂层(34)。 这种结构允许在相对宽的频带上进行单模传播。 进一步降低了由于期望的模式与衬底模式和导体的耦合而导致的辐射损耗,并且主要模式的极化使得所述结构对于不同接口之间的平行度的小偏差相对不敏感。 本发明涉及由这种类型的多层介质板结构形成的天线结构。
    • 3. 发明授权
    • Dielectric slab signal isolators
    • 介质板式信号隔离器
    • US4689585A
    • 1987-08-25
    • US801534
    • 1985-11-27
    • Hermann B. Sequeira
    • Hermann B. Sequeira
    • G02B6/12H01P1/10H01P1/32H01P1/36H01P1/38H01P3/02H01P3/08H01P3/16H01P5/08H01Q13/20H01Q13/24H01Q13/28H03C7/00H01P1/37
    • H01P3/082H01P1/10H01P1/32H01P3/16H01Q13/20
    • A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention is directed to multi-layer dielectric slab structures implemented in the form of a signal isolator.
    • 一种包括多层电介质板结构的传输线,包括:具有厚度ds和介电常数ε的电介质基底层(30); 介电基片层(30)的底表面上的导电接地层(31); 电介质引导层(32),其具有附着到电介质基底层(30)的顶表面的厚度h和介电常数εg,其中εg>ε; 具有宽度W,厚度d1和介电常数ε1的至少一个细长且相对较窄的电介质加载带层,其中ε1>ε1附着到电介质引导层(32)的顶表面; 以及在介电加载带层(32)的顶表面上的导电涂层(34)。 这种结构允许在相对宽的频带上进行单模传播。 进一步降低了由于期望的模式与衬底模式和导体的耦合而导致的辐射损耗,并且主要模式的极化使得所述结构对于不同接口之间的平行度的小偏差相对不敏感。 本发明涉及以信号隔离器形式实现的多层电介质平板结构。
    • 6. 发明授权
    • Dielectric slab optically controlled devices
    • 介质板光学控制装置
    • US4835500A
    • 1989-05-30
    • US801537
    • 1985-11-27
    • Hermann B. Sequeira
    • Hermann B. Sequeira
    • G02B6/12H01P1/10H01P1/32H01P1/36H01P1/38H01P3/02H01P3/08H01P3/16H01P5/08H01Q13/20H01Q13/24H01Q13/28H03C7/00
    • H01P3/082H01P1/10H01P1/32H01P3/16H01Q13/20
    • A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.l, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention concerns itself with a microslab structure comprised of optically controlled switches and phase shifters.
    • 一种包括多层电介质板结构的传输线,包括:具有厚度ds和介电常数ε的电介质基底层(30); 介电基片层(30)的底表面上的导电接地层(31); 电介质引导层(32),其具有附着到电介质基底层(30)的顶表面的厚度h和介电常数εg,其中εg>ε; 具有宽度W,厚度d1和介电常数ε1的至少一个细长且相对较窄的电介质负载带层(33),其中附加到电介质引导层(32)的顶表面上的ε1>ε1; 以及在介电加载带层(32)的顶表面上的导电涂层(34)。 这种结构允许在相对宽的频带上进行单模传播。 进一步降低了由于期望的模式与衬底模式和导体的耦合而导致的辐射损耗,并且主要模式的极化使得所述结构对于不同接口之间的平行度的小偏差相对不敏感。 本发明涉及由光控开关和移相器组成的微尺度结构。
    • 7. 发明授权
    • Dielectric slab transistions and power couplers
    • 介质板转移和功率耦合器
    • US4843353A
    • 1989-06-27
    • US801535
    • 1985-11-27
    • Hermann B. Sequeira
    • Hermann B. Sequeira
    • G02B6/12H01P1/10H01P1/32H01P1/36H01P1/38H01P3/02H01P3/08H01P3/16H01P5/08H01Q13/20H01Q13/24H01Q13/28H03C7/00
    • H01P3/082H01P1/10H01P1/32H01P3/16H01Q13/20
    • A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention is directed to transitions and power couplers implemented in such a multi-layer dielectric slab structure.
    • 一种包括多层电介质板结构的传输线,包括:具有厚度ds和介电常数ε的电介质基底层(30); 介电基片层(30)的底表面上的导电接地层(31); 电介质引导层(32),其具有附着到电介质基底层(30)的顶表面的厚度h和介电常数εg,其中εg>ε; 具有宽度W,厚度d1和介电常数ε1的至少一个细长且相对较窄的电介质加载带层,其中ε1>ε1附着到电介质引导层(32)的顶表面; 以及在介电加载带层(32)的顶表面上的导电涂层(34)。 这种结构允许在相对宽的频带上进行单模传播。 进一步降低了由于期望的模式与衬底模式和导体的耦合而导致的辐射损耗,并且主要模式的极化使得所述结构对于不同接口之间的平行度的小偏差相对不敏感。 本发明涉及在这种多层介质板结构中实现的过渡和功率耦合器。
    • 8. 发明授权
    • Dielectric slab circulators
    • 介质板循环器
    • US4689584A
    • 1987-08-25
    • US801536
    • 1985-11-27
    • Hermann B. Sequeira
    • Hermann B. Sequeira
    • G02B6/12H01P1/10H01P1/32H01P1/36H01P1/38H01P3/02H01P3/08H01P3/16H01P5/08H01Q13/20H01Q13/24H01Q13/28H03C7/00
    • H01P3/082H01P1/10H01P1/32H01P3/16H01Q13/20
    • A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention is directed to circulator devices implemented in such a multi-layer dielectric slab structure.
    • 一种包括多层电介质板结构的传输线,包括:具有厚度ds和介电常数ε的电介质基底层(30); 介电基片层(30)的底表面上的导电接地层(31); 电介质引导层(32),其具有附着到电介质基底层(30)的顶表面的厚度h和介电常数εg,其中εg>ε; 具有宽度W,厚度d1和介电常数ε1的至少一个细长且相对较窄的电介质加载带层,其中ε1>ε1附着到电介质引导层(32)的顶表面; 以及在介电加载带层(32)的顶表面上的导电涂层(34)。 这种结构允许在相对宽的频带上进行单模传播。 进一步降低了由于期望的模式与衬底模式和导体的耦合而导致的辐射损耗,并且主要模式的极化使得所述结构对于不同接口之间的平行度的小偏差相对不敏感。 本发明涉及在这种多层介质板结构中实现的循环器件。