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    • 6. 发明授权
    • Interconnect structure for coupling semiconductor regions and method for
making
    • 用于耦合半导体区域的互连结构和制造方法
    • US5280180A
    • 1994-01-18
    • US932116
    • 1992-08-19
    • Herbert GoronkinJun ShenSaied TehraniRaymond K. TsuiX. Theodore Zhu
    • Herbert GoronkinJun ShenSaied TehraniRaymond K. TsuiX. Theodore Zhu
    • H01L21/20H01L23/535H01L29/06H01L29/80H01L29/161H01L29/205
    • H01L23/535H01L2924/0002
    • A semiconductor device having a lateral interconnect or via formed by quantum well comprising a semiconductor material is provided. The lateral interconnect (17, 18, 19) formed by a quantum well comprising a first semiconductor material composition. A first semiconductor region (11, 12, 13) comprising a second material type is formed adjacent to the lateral interconnect (17, 18, 19). A second semiconductor region (23, 24, 26) comprising the second material type is adjacent to the lateral interconnect (17, 18, 19) so that the lateral interconnect (17, 18, 19) separates the first (11, 12, 13) and second (23, 24, 26) semiconductor regions. The first (17, 18, 19) and second (23, 24, 26) semiconductor regions have a first quantized energy level that is substantially equal. The lateral interconnect (17, 18, 19) has a first quantized energy level capable of alignment with the quantized energy levels of the first (11, 12, 13) and second (23, 24, 26) semiconductor regions.
    • 提供了具有由包括半导体材料的量子阱形成的横向互连或通孔的半导体器件。 由包括第一半导体材料组合物的量子阱形成的横向互连(17,18,19)。 包括第二材料类型的第一半导体区域(11,12,13)形成为与横向互连(17,18,19)相邻。 包括第二材料类型的第二半导体区域(23,24,26)与横向互连(17,18,19)相邻,使得横向互连(17,18,19)将第一(11,12,13) )和第二(23,24,26)个半导体区域。 第一(17,18,19)和第二(23,24,26)半导体区域具有基本相等的第一量化能级。 横向互连(17,18,19)具有能够与第一(11,12,13)和第二(23,24,26)半导体区域的量化能级对准的第一量化能级。
    • 8. 发明授权
    • Bipolar doped semiconductor structure and method for making
    • 双极掺杂半导体结构及其制造方法
    • US5326985A
    • 1994-07-05
    • US951994
    • 1992-09-28
    • Herbert GoronkinJun ShenSaied N. Tehrani
    • Herbert GoronkinJun ShenSaied N. Tehrani
    • H01L29/778H01L29/161H01L29/205
    • H01L29/7783
    • A semiconductor structure that provides both N-type and P-type doping from a single dopant source is provided. A first doping region (13) comprising a first material composition includes holes and electrons in a doping energy level (E.sub.D)- A first undoped spacer region (12) comprising the first material composition covers the doping region (13). An undoped channel (11,14) comprising a second material composition covers the first spacer region (12) and a second undoped spacer region (12) comprising the first material composition covers the undoped channel (11,14). The first material composition has a wider bandgap than the second material composition and the doping energy level (E.sub.D) is selected to provide electrons to the undoped channel (11,14) when the second material composition has a conduction band minimum less than the doping energy level (E.sub.D) and to provide holes to the first undoped channel (11,14) when the second material composition has a valence band maximum greater than the doping energy level (E.sub.D).
    • 提供了从单个掺杂剂源提供N型和P型掺杂的半导体结构。 包括第一材料组合物的第一掺杂区域(13)包括掺杂能级(ED)的空穴和电子 - 包含第一材料组合物的第一未掺杂间隔区域(12)覆盖掺杂区域(13)。 包括第二材料组合物的未掺杂通道(11,14)覆盖第一间隔区域(12),并且包括第一材料组合物的第二未掺杂间隔区域(12)覆盖未掺杂沟道(11,14)。 第一材料组合物具有比第二材料组成更宽的带隙,并且当第二材料组合物具有小于掺杂能量的导带最小值时,选择掺杂能级(ED)以向未掺杂沟道(11,14)提供电子 (ED),并且当第二材料组合物具有大于掺杂能级(ED)的价带最大值时,向第一未掺杂通道(11,14)提供孔。