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1. 发明申请

US20170303387A1 DIELECTRIC TAPE COMPOSITIONS 审中-公开
公开(公告)号：US20170303387A1
公开(公告)日：2017-10-19
申请号：US15511841
申请日：2016-04-05
申请人： Heraeus Precious Metals North America Conshohocken LLC
发明人： Samson SHAHBAZI , Steven GRABEY , Mark CHALLINGSWORTH , Ryan PERSONS
IPC分类号： H05K1/02 , C03C3/076 , C03C4/16 , H05K3/46 , H05K1/05 , C03C8/20 , C03C8/16 , C09K5/14 , C03C3/062 , C03C8/02 , C03B19/00
CPC分类号： H05K1/0204 , C03B19/00 , C03C3/062 , C03C3/076 , C03C4/16 , C03C8/02 , C03C8/16 , C03C8/20 , C03C2204/00 , C03C2205/00 , C09K5/14 , H05K1/0209 , H05K1/0271 , H05K1/0373 , H05K1/05 , H05K1/056 , H05K3/4608 , H05K2201/0209 , H05K2201/068
摘要： A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

2. 发明申请

US20140178573A1 LOW FIRING TEMPERATURE COPPER COMPOSITION 有权
标题翻译：低温度铜组合物
公开(公告)号：US20140178573A1
公开(公告)日：2014-06-26
申请号：US14022641
申请日：2013-09-10
申请人： Heraeus Precious Metals North America Conshohocken LLC
发明人： Samson SHAHBAZI , Mark CHALLINGSWORTH , Steve GRABEY , Ryan PERSONS
IPC分类号： H05K1/09 , H05K3/12
CPC分类号： H05K1/092 , C03C8/14 , C09D5/24 , H01B1/22 , H05K3/12 , H05K3/1291
摘要： An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.
摘要翻译：一种导电浆料，其包含比表面积约0.15-1.0m2 / g的第一铜颗粒，比表面积约0.5-2.5m2 / g的第二铜颗粒，玻璃料和有机载体。根据本发明的另一个实施方案，第一铜颗粒是约60-80wt。％的糊料，而第二铜颗粒的含量高达约20wt。％的粘贴。根据另一个实施方案，玻璃料是无铅的，为约1-10wt。％的粘贴。优选地，玻璃料包含硼 - 锌 - 氧化钡玻璃料。根据另一个实施方案，糊料还包含氧化铜。本发明的另一个实施方案涉及包含约60-95wt。％铜成分，硼 - 锌 - 氧化钡玻璃料和有机载体。

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