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1. 发明授权

US4894293A Circuit system, a composite metal material for use therein, and a method for making the material 失效
标题翻译：电路系统，其中使用的复合金属材料及其制造方法
公开(公告)号：US4894293A
公开(公告)日：1990-01-16
申请号：US166290
申请日：1988-03-10
申请人： Henry F. Breit , Karen A. Auguston , Joseph M. Gondusky
发明人： Henry F. Breit , Karen A. Auguston , Joseph M. Gondusky
IPC分类号： C22C9/00 , H01B1/02 , H01L23/14 , H01L23/373 , H05K1/05
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H05K1/05 , Y10T428/12486
摘要： A circuit system has a semiconductor device mounted on a substrate which includes a composite metal material comprising a plurality of discrete elements of ferrous metal material such as an alloy of 36 percent nickel and the balance iron having a relatively low coefficient of thermal expansion, the discrete elements being copper-coated by electroless copper plating or the like and being pressed together and heated for sintering or diffusion-bonding the copper coatings together to form a continuous copper matrix having the discrete elements secured in dispersed relation therein for providing the composite metal material with a coefficient of thermal expansion relatively much lower than that of the copper material, the heating of the coated particles for diffusion bonding thereof being regulated for forming the continuous copper matrix while leaving the copper material of the matrix substantially free of nickel, ferrous or other constituents diffused therein from the discrete elements for providing the composite material with improved thermal conductivity.

2. 发明授权

US5050040A Composite material, a heat-dissipating member using the material in a circuit system, the circuit system 失效
标题翻译：复合材料，使用电路系统中的材料的散热构件，电路系统
公开(公告)号：US5050040A
公开(公告)日：1991-09-17
申请号：US520291
申请日：1990-05-07
申请人： Joseph M. Gondusky , Henry F. Breit , Karen A. Auguston
发明人： Joseph M. Gondusky , Henry F. Breit , Karen A. Auguston
IPC分类号： H01L23/14 , H01L23/373
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/32245 , Y10T428/12486
摘要： A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together. One component formed of the novel composite material has a selected shape for compactly mounting the semiconductor device and the second component is formed of high thermal conductivity metal and has a different shape particularly adapted to receive heat from the silver paths and to facilitate heat-dissipation from the member.
摘要翻译：一种新颖的复合金属材料包括具有相对较低热膨胀性能的黑色金属和基本上不含具有相对高热导率的铁成分的银金属，以新颖的方式配合以提供对应于该复合材料的有效热膨胀系数各种硅或砷化镓半导体器件等用于可靠地安装器件，同时还提供延伸穿过复合材料的高导电性银金属的路径，以提供来自半导体器件的改进的散热。电路系统使用单独的新型复合金属材料安装半导体器件，结合到其它支撑材料，或形成为选定的形状。在一个优选实施例中，复合材料用于具有结合在一起的具有不同形状的部件的新型散热构件。由新型复合材料形成的一个部件具有用于紧凑地安装半导体器件的选定形状，并且第二部件由高导热性金属形成，并且具有不同的形状，特别适合于从银路径接收热量并促进散热会员

3. 发明授权

US5039335A Composite material for a circuit system and method of making 失效
标题翻译：电路系统的复合材料及其制造方法
公开(公告)号：US5039335A
公开(公告)日：1991-08-13
申请号：US260970
申请日：1988-10-21
申请人： Joseph M. Gondusky , Henry F. Breit , Karen A. Auguston
发明人： Joseph M. Gondusky , Henry F. Breit , Karen A. Auguston
IPC分类号： H05K7/20 , H01L23/14 , H01L23/373
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/92247 , Y10T428/12486
摘要： A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together. One component formed of the novel composite material has a selected shape for compactly mounting the semiconductor device and the second component is formed of high thermal conductivity metal and has a different shape particularly adapted to receive heat from the silver paths and to facilitate heat-dissipation from the member. Novel methods for making the member and the composite material are shown.

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