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    • 4. 发明申请
    • Methods Of Forming Integrated Circuit Devices Using Composite Spacer Structures
    • 使用复合间隔结构形成集成电路器件的方法
    • US20080171406A1
    • 2008-07-17
    • US12014689
    • 2008-01-15
    • Takashi OrimotoGeorge MatamisJames KaiTuan PhamMasaaki HigashitaniHenry Chien
    • Takashi OrimotoGeorge MatamisJames KaiTuan PhamMasaaki HigashitaniHenry Chien
    • H01L21/8247
    • H01L27/115G11C16/0483H01L27/11521
    • Methods of fabricating integrated circuit devices are provided using composite spacer formation processes. A composite spacer structure is used to pattern and etch the layer stack when forming select features of the devices. A composite storage structure includes a first spacer formed from a first layer of spacer material and second and third spacers formed from a second layer of spacer material. The process is suitable for making devices with line and space sizes at less then the minimum resolvable feature size of the photolithographic processes being used. Moreover, equal line and space sizes at less than the minimum feature size. In one embodiment, an array of dual control gate non-volatile flash memory storage elements is formed using composite spacer structures. When forming the active areas of the substrate, with overlying strips of a layer stack and isolation regions therebetween, a composite spacer structure facilitates equal lengths of the strips and isolation regions therebetween.
    • 使用复合间隔物形成工艺提供制造集成电路器件的方法。 当形成设备的选择特征时,使用复合间隔物结构来图案化和蚀刻层堆叠。 复合存储结构包括由第一隔离物材料层形成的第一间隔物和由第二隔离物材料层形成的第二和第三间隔物。 该方法适用于制造具有小于所使用的光刻工艺的最小可分辨特征尺寸的线和空间尺寸的装置。 此外,等于线和空间大小小于最小特征尺寸。 在一个实施例中,使用复合间隔结构形成双控制非易失性闪存存储元件阵列。 当形成衬底的活性区域时,具有叠层的叠层和隔离区之间的复合间隔结构有利于条之间的等长长度和隔离区。