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    • 1. 发明申请
    • CURABLE RESINS FOR LED ENCAPSULATION
    • LED封装的可固化树脂
    • US20130190446A1
    • 2013-07-25
    • US13796096
    • 2013-03-12
    • Henkel (China) Company Limited
    • Wenjuan TanZhiming Pasing LiWentao Thomas XingLiwei ZhangYong Zhang
    • C09D183/06
    • C09D183/06C08G77/045C08G77/12C08G77/20C08K5/5425C08K5/56C08L83/00C08L83/04H01L23/296H01L33/56H01L2924/0002Y10T428/31663H01L2924/00
    • The present invention relates to a curable organopolysiloxane composition, which comprises:(A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4;(B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)m.(R4R5SiO2/2)D.(R6SiO3/2)T.(SiO4/2)Q  (II) wherein R1 to R5 are identical or different groups selected from organic groups and hydrogen atom, and at least one of R1 to R5 is a hydrogen atom directly bonded to a silicon atom, and on average at least two hydrogen atoms directly bonded to silicon atoms are contained in one hydrosilicone resin molecule, R6 is an organic group identical to or different from R1 to R5, as organic groups R1 to R6 may independently be linear/branched alkyl or alkenyl groups having 1-20 carbon atoms or halides thereof; cycloalkyl groups or cycloalkenyl groups having 5-25 carbon atoms or halides thereof;M, T and Q each represents a number ranging from 0 to less than 1, 0 0; and(C) platinum-based catalysts.
    • 本发明涉及可固化的有机基聚硅氧烷组合物,其包含:(A)具有烯基的有机环氧硅氧烷,其由n = 3或4的下式(I)表示; (R 2 SiO 3/2)D(R 6 SiO 3/2)T(SiO 4/2)Q(II)其中R 1至R 5为相同或不同的基团(II)的氢硅氧烷树脂(R1R2R3SiO1 / 2) 选自有机基团和氢原子,并且R 1至R 5中的至少一个为与硅原子直接键合的氢原子,并且平均至少两个与硅原子键合的氢原子包含在一个氢硅氧烷树脂分子中,R6为 有机基团R 1至R 6可以独立地为具有1-20个碳原子的直链/支链烷基或烯基或其卤化物; 具有5-25个碳原子的环烷基或环烯基或其卤化物; M,T和Q各自表示0至小于1,0 0的数字; 和(C)铂基催化剂。
    • 2. 发明授权
    • Curable resins for LED encapsulation
    • 用于LED封装的可固化树脂
    • US08668991B2
    • 2014-03-11
    • US13796096
    • 2013-03-12
    • Henkel (China) Company Limited
    • Wenjuan TanZhiming Pasing LiWentao Thomas XingLiwei ZhangYong Zhang
    • C08G77/12B32B9/04
    • C09D183/06C08G77/045C08G77/12C08G77/20C08K5/5425C08K5/56C08L83/00C08L83/04H01L23/296H01L33/56H01L2924/0002Y10T428/31663H01L2924/00
    • The present invention relates to a curable organopolysiloxane composition, which comprises: (A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4; (B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)M.(R4R5SiO2/2)D.(R6SiO3/2)T.(SiO4/2)Q  (II) wherein R1 to R5 are identical or different groups selected from organic groups and hydrogen atom, and at least one of R1 to R5 is a hydrogen atom directly bonded to a silicon atom, and on average at least two hydrogen atoms directly bonded to silicon atoms are contained in one hydrosilicone resin molecule, R6 is an organic group identical to or different from R1 to R5, as organic groups R1 to R6 may independently be linear/branched alkyl or alkenyl groups having 1-20 carbon atoms or halides thereof; cycloalkyl groups or cycloalkenyl groups having 5-25 carbon atoms or halides thereof; M, T and Q each represents a number ranging from 0 to less than 1, 0 0; and (C) platinum-based catalysts.
    • 本发明涉及可固化的有机基聚硅氧烷组合物,其包含:(A)具有烯基的有机环氧硅氧烷,其由n = 3或4的下式(I)表示; (R 2 R 3 SiO 1/2)D(R 6 SiO 3/2)T(SiO 4/2)Q(II)其中R 1至R 5是相同或不同的基团(II)的氢硅氧烷树脂 选自有机基团和氢原子,并且R 1至R 5中的至少一个为与硅原子直接键合的氢原子,并且平均至少两个与硅原子键合的氢原子包含在一个氢硅氧烷树脂分子中,R6为 有机基团R 1至R 6可以独立地为具有1-20个碳原子的直链/支链烷基或烯基或其卤化物; 具有5-25个碳原子的环烷基或环烯基或其卤化物; M,T和Q各自表示0至小于1,0 0的数字; 和(C)铂基催化剂。