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1. 发明授权

US6012964A Carrier and CMP apparatus 失效
标题翻译：载体和CMP装置
公开(公告)号：US6012964A
公开(公告)日：2000-01-11
申请号：US149501
申请日：1998-09-08
申请人： Hatsuyuki Arai , Shigeto Izumi , Xu-Jin Wang , Misuo Sugiyama , Hisato Matsubara , Hideo Tanaka , Toshikuni Shimizu
发明人： Hatsuyuki Arai , Shigeto Izumi , Xu-Jin Wang , Misuo Sugiyama , Hisato Matsubara , Hideo Tanaka , Toshikuni Shimizu
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier and CMP apparatus which improve the uniformity of polishing in a wafer or other workpiece and increase the margin of the amount of wear of the retainer ring to improve the operating rate of the CMP apparatus. A carrier 1 is constituted by a housing 10, a carrier base 11, a retainer ring 12, a sheet supporter 13, a hard sheet 18, and a soft backing sheet 19. The sheet supporter 13 is formed by a supporter body portion 14 having an air opening 14a communicating with an air outlet/inlet 11b of the carrier base 11, a flexible diaphragm 15, and an edge ring 16. Therefore, a wafer W is uniformly pressed by the air pressure in the pressure chamber R and fluctuation in the force pressing against the outer peripheral rim of the wafer W caused by the wear of the retainer ring 12 is countered by the diaphragm 15.
摘要翻译：一种载体和CMP装置，其改善晶片或其它工件中的抛光均匀性并增加保持环的磨损量的余量以提高CMP装置的工作速率。载体1由壳体10，载体基体11，保持环12，片材支撑体13，硬片18和软背衬片19构成。片材支撑体13由支撑体主体部14形成，与承载基座11的空气出口/入口11b连通的空气开口14a，柔性隔膜15和边缘环16.因此，晶片W被压力室R中的空气压力均匀地压缩，抵抗由保持环12的磨损引起的晶片W的外周缘的力被隔膜15抵消。

2. 发明授权

US06273803B1 Carriers and polishing apparatus 失效
标题翻译：载体和抛光装置
公开(公告)号：US06273803B1
公开(公告)日：2001-08-14
申请号：US09346466
申请日：1999-07-01
申请人： Xu-Jin Wang , Shigeto Izumi , Misuo Sugiyama , Hideo Tanaka
发明人： Xu-Jin Wang , Shigeto Izumi , Misuo Sugiyama , Hideo Tanaka
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier and a polishing apparatus are designed to improve the mass producibility of wafers while using a retainer ring formed by a soft material. A rubber sheet 4 is bonded to the bottom surface of a carrier body 2 of the carrier 1 to define a pressure chamber R, a retainer ring 13 formed by a soft material such as EG is bonded to the bottom surface of the sheet 4. A margin block 40 is provided projecting out from the bottom side of the sheet 4, and the thickness of the retainer ring 13 is set to be substantially equal to the sum of the thickness L1 of the margin block 40 and the thickness L2 of the wafer W.
摘要翻译：设计载体和抛光装置，以在使用由柔软材料形成的保持环时提高晶片的批量生产能力。将橡胶片4接合到载体1的载体2的底面，以形成压力室R，将由诸如EG的软质材料形成的保持环13粘合到片材4的底面。设置从片材4的底侧突出的边缘块40，并且保持环13的厚度被设定为基本上等于边缘块40的厚度L1与晶片W的厚度L2之和。

3. 发明授权

US06210260B1 Carrier and CMP apparatus 有权
标题翻译：载体和CMP装置
公开(公告)号：US06210260B1
公开(公告)日：2001-04-03
申请号：US09260335
申请日：1999-03-01
申请人： Hideo Tanaka , Xu-Jin Wang , Misuo Sugiyama , Kei Tanaka , Makoto Ishida , Shunji Hakomori
发明人： Hideo Tanaka , Xu-Jin Wang , Misuo Sugiyama , Kei Tanaka , Makoto Ishida , Shunji Hakomori
IPC分类号： B24B500
CPC分类号： B24B37/30 , H01L21/6838
摘要： A carrier comprising a disk-shaped body portion having fluid circulation holes, a ring-shaped diaphragm portion expanding outward from the outer peripheral surface of the body portion and having pliability, a ring-shaped edge portion projecting at least downward from an outer edge portion of the diaphragm portion and having an inner diameter of at least an outer diameter of a work piece, a pliable sheet having an outer peripheral portion affixed air tightly to a bottom end portion of said edge portion, the back surface of the sheet defining a single pressure chamber communicating with the fluid circulation holes, and a ring-shaped member surrounding the work piece affixed to the bottom surface of the sheet.
摘要翻译：一种载体，包括具有流体循环孔的盘形主体部分，从主体部分的外周表面向外扩展并具有柔韧性的环形隔膜部分，从外边缘部分至少向下突出的环形边缘部分并且具有至少外径为工件的内径的柔性片，具有外周部分的气密紧固到所述边缘部分的底端部分的柔性片，所述片的背面限定单个与流体循环孔连通的压力室以及围绕固定在片材底面的工件的环状构件。

4. 发明授权

US5099614A Flat lapping machine with sizing mechanism 失效
标题翻译：平面研磨机具有上胶机构
公开(公告)号：US5099614A
公开(公告)日：1992-03-31
申请号：US091438
申请日：1987-08-31
申请人： Hatsuyuki Arai , Misuo Sugiyama
发明人： Hatsuyuki Arai , Misuo Sugiyama
IPC分类号： B24B7/04 , B24B49/02 , G01B17/02
CPC分类号： B24B37/013 , G01B17/02
摘要： A flat lapping machine with an ultrasonic sizing mechanism for automatically lapping the work, such as a semiconductor wafer and a magnetic disk substrate, to the present desired thickness. The flat lapping machine permits high-precision thickness measurement or sizing and uniform work lapping by assuring stable propagation of ultrasonic waves by eliminating such noise-induced waveform disturbance as might occur when slurried abrasive is used as the propagation medium and such localized dilution of slurried abrasive as might occur when water is used as the propagation medium. The flat lapping machine may have a sizing mechanism for automatically lapping the work to the preset desired thickness based on the difference between the preset and measured thicknesses of the work. The machine comprises top and bottom rotatable lapping surface plates and a transducer attached to the top surface plate in a position opposite to the work to send out ultrasonic waves to the work to determine its thickness. An ultrasonic-wave propagation medium of such solid material as metal, glass or plastic is interposed between the transducer and the work.
摘要翻译：具有用于自动研磨工件的超声波定尺寸机构的平面研磨机，例如半导体晶片和磁盘基板，达到目前所需的厚度。平板研磨机允许通过消除如使用浆料磨料作为传播介质时可能发生的噪声引起的波形干扰，确保超声波的稳定传播，进行高精度的厚度测量或施胶和均匀的工作研磨，并且这种局部稀释的浆状磨料当水被用作传播介质时可能发生。平面研磨机可以具有尺寸机构，用于基于工件的预设厚度和测量厚度之间的差自动将工件研磨到预设所需厚度。该机器包括顶部和底部可旋转研磨表面板和在与工件相对的位置附接到顶部表面板的换能器，以向工件发出超声波以确定其厚度。这种固体材料如金属，玻璃或塑料的超声波传播介质介于传感器和工件之间。

5. 发明授权

US4805348A Flat lapping machine 失效
标题翻译：平面研磨机
公开(公告)号：US4805348A
公开(公告)日：1989-02-21
申请号：US891241
申请日：1986-07-29
申请人： Hatsuyuki Arai , Isao Nagahashi , Seiichi Maeda , Kazumi Yasuda , Shiro Furusawa , Kazuhiko Hirata , Kastunori Nagao , Kazuhiko Kondo , Takaya Sanoki , Misuo Sugiyama , Shinichi Kusano
发明人： Hatsuyuki Arai , Isao Nagahashi , Seiichi Maeda , Kazumi Yasuda , Shiro Furusawa , Kazuhiko Hirata , Kastunori Nagao , Kazuhiko Kondo , Takaya Sanoki , Misuo Sugiyama , Shinichi Kusano
IPC分类号： B24B37/08 , B24B37/28 , B24B7/00
CPC分类号： B24B37/28 , B24B37/08
摘要： Described herein is a flat lapping machine capable of precision-abrading simultaneously flat surfaces on the front and rear sides of a work in the fashion of lapping, polishing and grinding machines. The present invention contemplates to provide a flat lapping machine which is simplified in construction as compared with conventional flap lapping machines having a large number of carriers in planetary motions, and which can stop the respective carriers easily in specific positions and directions at the end of a lapping operation. To this end, the present invention employs a large number of support gear mechanisms each constituted by a plural number of small gears and located at uniform intervals around a center gear, rotatably supporting the respective carriers in predetermined positions while the respective carriers are driven by the center gear.
摘要翻译：这里描述的是能够以研磨，抛光和研磨机器的方式同时精确研磨工件的前后两侧的平坦表面的平板研磨机。本发明旨在提供一种与具有行星运动中的大量载体的常规翼片研磨机相比，其结构简化的平板研磨机，其能够在特定位置和方向上容易地停止相应的载体研磨操作。为此，本发明采用大量支撑齿轮机构，每个支撑齿轮机构由多个小齿轮构成，并且围绕中心齿轮以均匀的间隔设置，可旋转地支撑各个载体在预定位置，同时各个载体由中心齿轮

6. 发明授权

US5605499A Flattening method and flattening apparatus of a semiconductor device 失效
标题翻译：半导体器件的扁平化方法和扁平化装置
公开(公告)号：US5605499A
公开(公告)日：1997-02-25
申请号：US421706
申请日：1995-04-13
申请人： Misuo Sugiyama , Hatsuyuki Arai
发明人： Misuo Sugiyama , Hatsuyuki Arai
IPC分类号： B24B1/00 , B24B37/20 , B24B37/22 , B24B37/24 , B24B53/007 , B24B53/017 , B24D13/14 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/768 , B24B21/18
CPC分类号： B24B37/04 , B24B53/017
摘要： A method for flattening an inter-layer insulating film of a semiconductor device of a multi-wiring is carried out with a chemical-mechanical polishing process by using an apparatus, which includes two-layer polishing cloth having an unwoven cloth and a hard foamed layer affixed on a support plate. In order to fluff on a surface of the hard foamed layer or recreate on the whole surface thereof, a tool is provided on the polishing cloth. A silicon wafer is held through a backing pad so that an insulating film of a semiconductor device formed on the wafer is polished by the polishing cloth by rotation of the support plate and the wafer, and at the same time the surface layer of the polishing cloth is fluffed by the tool provided with a polishing surface having the curvature as that of the backing pad. Therefore, a polishing rate can be kept stable, and uniformity of polishing quantity is improved.
摘要翻译：通过使用包括具有无纺布和硬发泡层的双层抛光布的设备，通过化学机械抛光工艺进行多层布线的半导体器件的层间绝缘膜的平坦化的方法固定在支撑板上。为了绒毛在硬质发泡层的表面上或在其整个表面上重新产生，在抛光布上设置工具。通过背衬保持硅晶片，使得通过支撑板和晶片的旋转，抛光布在晶片上形成的半导体器件的绝缘膜被抛光，同时抛光布的表面层被提供有具有与衬垫的曲率一样的抛光表面的工具起毛。因此，抛光速度可以保持稳定，并且提高了抛光量的均匀性。

7. 发明授权

US6159082A Slurry circulation type surface polishing machine 有权
标题翻译：泥浆循环式表面抛光机
公开(公告)号：US6159082A
公开(公告)日：2000-12-12
申请号：US257726
申请日：1999-03-02
申请人： Misuo Sugiyama , Xu Jin Wang , Shinya Iida
发明人： Misuo Sugiyama , Xu Jin Wang , Shinya Iida
IPC分类号： B24B37/00 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： The bottom of each collection groove for collecting a used abrasive slurry and a rinsing solution is formed like the letter V, an exhaust port is formed at the lowest position of the bottom of the groove, the collection pipe of a slurry supply unit and the collection pipe of a rinsing solution supply unit are connected to the exhaust port, and the collection pipe of the rinsing solution exhaust unit is connected to a suction pump for forcedly discharging the rinsing solution by suction.
摘要翻译：用于收集使用过的磨料浆料和冲洗溶液的每个收集槽的底部形成为字母V，在槽的底部的最下部形成排气口，浆料供应单元的收集管和收集冲洗溶液供给单元的管道连接到排气口，并且冲洗溶液排出单元的收集管连接到用于通过抽吸强制排出冲洗溶液的抽吸泵。

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