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1. 发明申请

US20110180938A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：US20110180938A1
公开(公告)日：2011-07-28
申请号：US13005741
申请日：2011-01-13
申请人： Kazuya HIRASAWA , Yuuji Ootani , Akiyoshi Asai , Hirokazu Imai , Hiroyoshi Kunieda , Harumi Kodama , Masayuki Onishi , Ryo Sakaguchi , Kazumi Nakayoshi
发明人： Kazuya HIRASAWA , Yuuji Ootani , Akiyoshi Asai , Hirokazu Imai , Hiroyoshi Kunieda , Harumi Kodama , Masayuki Onishi , Ryo Sakaguchi , Kazumi Nakayoshi
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/4334 , C08G77/04 , C08G77/20 , C08L83/04 , H01L23/296 , H01L23/3121 , H01L23/36 , H01L23/49531 , H01L24/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).
摘要翻译：在电子设备中，粘合第一和第二构件的硅氧烷粘合剂由以下组合物制成：（A）100质量份在一分子中含有至少两个烯基并且不含硅键合的羟基和烷氧基的有机聚硅氧烷其中具有4〜20个硅氧烷单元的环状硅氧烷的含量为0.1质量％以下。（B）在一个分子中含有至少两个与硅键合的氢原子并且不含烯基的有机聚硅氧烷和与硅键合的羟基和烷氧基; （C）至少0.05质量份粘合促进剂; （D）100〜2000质量份导热性填料; 和（E）氢化硅烷化反应催化剂。包含（B），使得与（A）的链烯基相比，与硅键合的氢原子为0.5〜10摩尔的范围，（B）和（C）的和为0.5〜10质量％（A），（B）和（C）的总和的百分比。

2. 发明申请

US20120292558A1 Thermally Conductive Silicone Rubber Composition 审中-公开
标题翻译：导热硅橡胶组合物
公开(公告)号：US20120292558A1
公开(公告)日：2012-11-22
申请号：US13574830
申请日：2011-01-20
申请人： Harumi Kodama , Masayuki Onishi , Ryo Sakaguchi , Kazumi Nakayoshi
发明人： Harumi Kodama , Masayuki Onishi , Ryo Sakaguchi , Kazumi Nakayoshi
IPC分类号： C09K5/00
CPC分类号： H01L23/296 , C08G77/20 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
摘要翻译：导热硅橡胶组合物包含：（A）在每个分子中含有至少两个硅键合的烯基的有机聚硅氧烷，其不含硅键合的羟基和烷氧基，并且具有含有4个至20个以质量计不超过1000ppm的硅氧烷单元; （B）在每个分子中含有至少两个与硅键合的氢原子并且不含硅键合的烯基，羟基和烷氧基的有机聚硅氧烷; （C）粘合促进剂; （D）导热填料; 和（E）氢化硅烷化反应催化剂; 其中组分（B）和（C）的总量为组分（A），（B）和（C）总量的0.5至10质量％。组合物的特征在于在固化过程中渗出的油馏分减少，以及在固化过程中挥发挥发的低沸点馏分的降低。

3. 发明授权

US08957153B2 Room-temperature-curable silicone rubber composition 有权
标题翻译：室温可固化硅橡胶组合物
公开(公告)号：US08957153B2
公开(公告)日：2015-02-17
申请号：US14009671
申请日：2012-03-28
申请人： Harumi Kodama , Masayuki Onishi
发明人： Harumi Kodama , Masayuki Onishi
IPC分类号： C08L83/04 , C08K3/36 , C08L83/14 , C08G77/18
CPC分类号： C08K3/36 , C08G77/18 , C08G77/50 , C08K5/5419 , C08K5/57 , C08L83/00 , C08L83/14 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.
摘要翻译：室温可固化的硅橡胶组合物包含：（A）在一分子中具有至少两个特定的含有烷氧基甲硅烷基的基团的分子链上的硅原子上的有机聚硅氧烷; （B）在分子链中的硅原子上既不具有羟基也不具有烷氧基的有机聚硅氧烷; （C）烷氧基硅烷或其部分水解和缩合产物; （D）缩合反应催化剂; 并且任选地包含（E）粘合促进剂和/或（F）增强填料。组合物由于与大气湿气接触而在室温下固化，并且在组合物固化期间与组合物接触时对基材表现出优异的粘附性。

4. 发明申请

US20070244287A1 Room-Temperature-Curable Organopolysiloxane Composition 有权
标题翻译：室温固化有机聚硅氧烷组合物
公开(公告)号：US20070244287A1
公开(公告)日：2007-10-18
申请号：US11765811
申请日：2007-06-20
申请人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
发明人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
IPC分类号： C08G77/06
CPC分类号： C08K5/0025 , C08G77/045 , C08G77/06 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/24 , C08G77/70 , C08K3/016 , C08K5/0066 , C08K9/10 , C08L83/04 , Y10S528/901 , C08L83/00 , C08L2666/54 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 μm; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）平均具有至少一个羟基的具有1.5个或更多个端基的有机聚硅氧烷; （B）具有三个或更多个硅键合的可水解基团的硅烷或硅氧烷低聚物; （D）无机粉末; 和（C）含有平均直径为0.1〜20μm的铂化合物的热塑性树脂微粒; 或（C1）铂化合物; 和（C2）含有芳基和烯基并且在每个分子中具有8个或更少的硅原子并且在每个分子中含有至少一个如下式所示的二价有机硅氧烷的有机硅氧烷低聚物：<？in-line-formula description =“ - （R 2）（R 3） - （R 2）（R 3）（R 3） Si-，<β在线公式描述=“In-line formula”end =“tail”？>（其中R 2是芳基，和R 3为链烯基），其量为组分（C1）中每1摩尔铂原子至少2摩尔组分（C2）。

5. 发明授权

US07250467B2 Room-temperature-curable organopolysiloxane composition 有权
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US07250467B2
公开(公告)日：2007-07-31
申请号：US10482904
申请日：2002-07-26
申请人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
发明人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
IPC分类号： C08L83/06
CPC分类号： C08K5/0025 , C08G77/045 , C08G77/06 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/24 , C08G77/70 , C08K3/016 , C08K5/0066 , C08K9/10 , C08L83/04 , Y10S528/901 , C08L83/00 , C08L2666/54 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 μm; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）平均具有至少一个羟基的具有1.5个或更多个端基的有机聚硅氧烷; （B）具有三个或更多个硅键合的可水解基团的硅烷或硅氧烷低聚物; （D）无机粉末; 和（C）含有平均直径为0.1〜20μm的铂化合物的热塑性树脂微粒; 或（C1）铂化合物; 和（C2）含有芳基和烯基并且在每个分子中具有8个或更少的硅原子并且在每个分子中含有至少一个如下式所示的二价有机硅氧烷的有机硅氧烷低聚物：<？in-line-formula description =“ - （R 2）（R 3） - （R 2）（R 3）（R 3） Si - ，<？在线公式描述=“在线公式”end =“tail”？>（其中R 2是芳基，和R 3为链烯基），其量为组分（C1）中每1摩尔铂原子至少2摩尔组分（C2）。

6. 发明申请

US20140066570A1 Room-Temperature-Curable Silicone Rubber Composition 有权
标题翻译：室温可固化硅橡胶组合物
公开(公告)号：US20140066570A1
公开(公告)日：2014-03-06
申请号：US14009671
申请日：2012-03-28
申请人： Harumi Kodama , Masayuki Onishi
发明人： Harumi Kodama , Masayuki Onishi
IPC分类号： C08K3/36 , C08G77/18
CPC分类号： C08K3/36 , C08G77/18 , C08G77/50 , C08K5/5419 , C08K5/57 , C08L83/00 , C08L83/14 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a re-inforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.
摘要翻译：室温可固化的硅橡胶组合物包含：（A）在一分子中具有至少两个特定的含有烷氧基甲硅烷基的基团的分子链上的硅原子上的有机聚硅氧烷; （B）在分子链中的硅原子上既不具有羟基也不具有烷氧基的有机聚硅氧烷; （C）烷氧基硅烷或其部分水解和缩合产物; （D）缩合反应催化剂; 并且任选地包含（E）粘合促进剂和/或（F）再充填填料。组合物由于与大气湿气接触而在室温下固化，并且在组合物固化期间与组合物接触时对基材表现出优异的粘附性。

7. 发明申请

US20080319121A1 Room-Temperature Curable Organopolysiloxane Composition and Electrical or Electronic Devices 审中-公开
标题翻译：室温固化有机聚硅氧烷组合物和电气或电子设备
公开(公告)号：US20080319121A1
公开(公告)日：2008-12-25
申请号：US11571770
申请日：2005-06-17
申请人： Osamu Mitani , Masayuki Onishi , Harumi Kodama
发明人： Osamu Mitani , Masayuki Onishi , Harumi Kodama
IPC分类号： C08K3/36 , C08L83/06
CPC分类号： C08L83/04 , C08G77/18 , C08G77/70 , C08K5/0091 , C08L83/00 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) organopolysiloxane that contains in each molecule at least two trialkoxysilyl-containing groups that are bonded to silicon atoms of the molecular chain; (B) diorganodi-alkoxysilane or product of its partial hydrolyzation; (C) organopolysiloxane that contains at least one silicon-bonded phenyl group in each molecule and is free of alkoxy groups; and (D) a titanium chelate catalyst, adheres during curing to a substrate with a sufficient strength but allows separation of a cured body of the composition from the substrate at the interface even after a long period of time.
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）在每个分子中含有至少两个与所述分子链的硅原子键合的含有三烷氧基甲硅烷基的基团的有机聚硅氧烷; （B）二有机二烷氧基硅烷或其部分水解产物; （C）在每个分子中含有至少一个与硅键合的苯基并且不含烷氧基的有机聚硅氧烷; 和（D）钛螯合催化剂，在固化期间以足够的强度固化到基材上，但是即使在长时间之后也允许组合物的固化体在界面处与界面处的界面分离。

8. 发明授权

US07550548B2 Room-temperature-curable organopolysiloxane composition 有权
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US07550548B2
公开(公告)日：2009-06-23
申请号：US11765811
申请日：2007-06-20
申请人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
发明人： Hidekatsu Hatanaka , Harumi Kodama , Masayuki Onishi , Hiroji Enami , Koji Nakanishi
IPC分类号： C08G77/04
CPC分类号： C08K5/0025 , C08G77/045 , C08G77/06 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/24 , C08G77/70 , C08K3/016 , C08K5/0066 , C08K9/10 , C08L83/04 , Y10S528/901 , C08L83/00 , C08L2666/54 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of from 100 to 500,000 mPa·s at 25° C. and having in one molecule 1.5 or more end groups represented by the general formula: (X)aR13-aSi—, where each X is independently a hydroxyl group or a hydrolyzable group, each R1 is independently a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group, and a is 1, 2, or 3; (B) 0.01 to 40 parts by weight of a cross-linking agent selected from a silane or a siloxane oligomer where the cross-linking agent has three or more silicon-bonded hydrolyzable groups per molecule; and (C) microparticles of thermoplastic resin containing a platinum compound in such an amount that the content of metallic platinum in component (C) is within the range of 0.01 to 5 wt. %, where the microparticles have an average diameter from 0.1 to 20 μm, component (C) is present in an amount sufficient to provide 1 to 2,000 ppm of metallic platinum in the composition; and (D) 5 to 300 parts by weight of an inorganic powder.
摘要翻译：一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）100重量份在25℃下粘度为100至500,000mPa.s并且在一个分子中具有由一般分子表示的1.5个或更多个端基的有机聚硅氧烷公式：<？in-line-formula description =“In-line Formulas”end =“lead”？>（X）aR13-aSi-，其中<？in-line-formula description =“In-line Formulas”end = “尾”→“X”各自独立地为羟基或可水解基团，每个R 1独立地为一价烃基或卤素取代的一价烃基，a为1,2或3; （B）0.01〜40重量份选自硅烷或硅氧烷低聚物的交联剂，其中交联剂每分子具有三个或更多个硅键合的可水解基团; 和（C）含有铂化合物的热塑性树脂微粒的量使得组分（C）中金属铂的含量在0.01至5重量％的范围内。％，其中微粒的平均直径为0.1-20μm，组分（C）的存在量足以在组合物中提供1至2,000ppm的金属铂; 和（D）5〜300重量份的无机粉末。

9. 发明授权

US08247516B2 Room-temperature curable organopolysiloxane composition 有权
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US08247516B2
公开(公告)日：2012-08-21
申请号：US12739343
申请日：2008-10-06
申请人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
发明人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

10. 发明授权

US07329706B2 Heat-conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US07329706B2
公开(公告)日：2008-02-12
申请号：US10476998
申请日：2002-05-14
申请人： Hiroshi Fukui , Manabu Sutoh , Hiroji Enami , Masayuki Onishi , Tadashi Okawa , Satoshi Onodera
发明人： Hiroshi Fukui , Manabu Sutoh , Hiroji Enami , Masayuki Onishi , Tadashi Okawa , Satoshi Onodera
IPC分类号： C08L83/05
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08K3/22 , C08K9/06 , C08L83/14 , C08L83/00
摘要： A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.
摘要翻译：包含至少（A）有机聚硅氧烷，（B）导热填料和（C）特定有机硅氧烷的导热硅氧烷组合物。硅氧烷组合物即使在含有大量导热性填料的情况下也具有优异的操作性，因此为了达到更高的导热性。

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