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1. 发明授权

US5439896A Thermosetting powdery coating composition 失效
标题翻译：热固性粉末涂料组合物
公开(公告)号：US5439896A
公开(公告)日：1995-08-08
申请号：US128313
申请日：1993-09-28
申请人： Haruki Ito , Kenzou Maeda , Nobuyuki Miyazaki , Masao Unoki , Chiaki Sagawa , Motoi Kamba
发明人： Haruki Ito , Kenzou Maeda , Nobuyuki Miyazaki , Masao Unoki , Chiaki Sagawa , Motoi Kamba
IPC分类号： C08G18/62 , C08K5/00 , C09D5/46 , C09D127/12 , C09D127/18 , C08L27/12 , C08L27/18 , C08L27/20
CPC分类号： C09D127/12 , C08G18/6279 , C08K5/0025 , C09D127/18 , Y10S524/904 , Y10S525/934
摘要： A thermosetting powdery coating composition which comprises, in admixture: (A) from 40 to 98 parts by weight of a fluorine-containing copolymer, which is a copolymer of a fluoroolefin and a comonomer having a crosslinkable reactive group, e.g., hydroxy, carboxyl, amino and glycidyl groups, containing at least 10% by weight of fluorine and having an intrinsic viscosity of 0.05-2 dl/g (30.degree. C., tetrahydrofuran), a glass transition temperature of 30.degree.-120.degree. C. and a weight loss by heating which does not exceed 2% and (B) from 60 to 2 parts by weight of a curing agent capable of forming crosslinks by reacting with the crosslinkable reactive groups in (A), except for the composition wherein (A) is a hydroxyl group and a weight loss by heating which does not exceed 2% and (B) is a blocked isocyanate compound. The powdery coating composition is excellent in the dispersibility of pigments and efficiency in the coating works therewith and capable of giving a coating film having improved adhesion to a substrate surface, surface luster, impact resistance and insusceptibility to staining.
摘要翻译：一种热固性粉末涂料组合物，其包含：（A）40至98重量份的含氟共聚物，其为氟代烯烃和具有可交联反应性基团的共聚单体的共聚物，例如羟基，羧基，氨基和缩水甘油基，其含有至少10重量％的氟，特性粘度为0.05-2dl / g（30℃，四氢呋喃），玻璃化转变温度为30-120℃，重量除了不超过2％的加热损失，（B）60至2重量份的能够通过与（A）中的可交联反应性基团反应形成交联的固化剂，除了其中（A）为羟基，加热失重不超过2％，（B）为封端异氰酸酯化合物。粉末涂料组合物在颜料的分散性方面优异，并且在其涂料中效率高，并且能够提供对基材表面具有改善的粘附性的涂膜，表面光泽，耐冲击性和不可感染性。

2. 发明授权

US5147934A Thermosetting powdery coating composition 失效
标题翻译：热成型粉末涂料组合物
公开(公告)号：US5147934A
公开(公告)日：1992-09-15
申请号：US607610
申请日：1990-10-30
申请人： Haruki Ito , Kenzou Maeda , Nobuyuki Miyazaki , Masao Unoki , Chiaki Sagawa , Motoi Kamba
发明人： Haruki Ito , Kenzou Maeda , Nobuyuki Miyazaki , Masao Unoki , Chiaki Sagawa , Motoi Kamba
IPC分类号： C08G18/62 , C08K5/00 , C09D5/46 , C09D127/12 , C09D127/18
CPC分类号： C09D127/12 , C08G18/6279 , C08K5/0025 , C09D127/18 , Y10S524/904 , Y10S525/934
摘要： The thermosetting powdery coating composition of the invention comprises (A) from 40 to 98 parts by weight of a fluorinecontaining copolymer, which is a copolymer of a fluoroolefin and a comonomer having a crosslinkable reactive group, e.g., hydroxy, carbonyl, amino and glycidyl groups, containing at least 10% by weight of fluorine and having an intrinsic viscosity of 0.05-2 dl/g (30.degree. C., tetrahydrofuran) and a glass transition temperature of 30.degree.-120.degree. C. and (B) from 60 to 2 parts by weight of a curing agent capable of forming crosslinks by reacting with the crosslinkable reactive groups in (A). The powdery coating composition of the invention is excellent in the dispersibility of pigments and efficiency in the coating works therewith and capable of giving a coating film having improved adhesion to the substrate surface, surface luster, impact resistance and insusceptibility to stain.

3. 发明授权

US5164219A Method of preparation of a patterned decorative material 失效
标题翻译：图案化装饰材料的制备方法
公开(公告)号：US5164219A
公开(公告)日：1992-11-17
申请号：US721288
申请日：1991-06-26
申请人： Kenzou Maeda , Haruki Ito
发明人： Kenzou Maeda , Haruki Ito
IPC分类号： B29C43/02 , B29C59/04 , B44C1/24
CPC分类号： B44C1/24 , B29C43/021 , B29C59/046
摘要： A patterned decorative material is prepared by a method which comprises applying a thermosetting powder coating material to a base plate; melting of the thermosetting powder coating material by heating; simultaneously embossing the coating layer and the base plate while the melted thermosetting powder coating material has a gel fraction formed by a hardening reaction of 0 to 75 weight percent; and further heating to form a hardened coating on the base plate. The patterned decorative material is excellent in appearance, corrosion resistance, weathering resistance and abrasion resistance and is free from the defects of conventional steel plates coated with polyvinyl chloride and the like, such as formation of craze and loss of luster.
摘要翻译：图案化装饰材料通过包括将热固性粉末涂料施加于基板的方法制备; 通过加热熔化热固性粉末涂料; 同时对涂层和基板进行压花，同时熔化的热固性粉末涂料具有通过0至75重量％的硬化反应形成的凝胶分数; 并进一步加热以在基板上形成硬化涂层。图案化的装饰材料的外观，耐腐蚀性，耐候性和耐磨性优异，并且不存在涂覆有聚氯乙烯等的常规钢板的缺陷，例如形成热潮和失光。

4. 发明授权

US5051273A Method of preparation of a patterned decorative material 失效
标题翻译：图案化装饰材料的制备方法
公开(公告)号：US5051273A
公开(公告)日：1991-09-24
申请号：US464403
申请日：1990-01-12
申请人： Kenzou Maeda , Haruki Ito
发明人： Kenzou Maeda , Haruki Ito
IPC分类号： B29C43/02 , B29C59/04 , B44C1/24
CPC分类号： B29C43/021 , B29C59/046 , B44C1/24
摘要： A patterned decorative material is prepared by a method which comprises application of a thermosetting powder coating material to a base plate; melting of the thermosetting powder coating material by heating; embossing of the coating layer alone while the melt thermosetting powder coating material has a gel fraction formed by a hardening reaction of 15 to 75 weight percent; and further heating to form a hardened coating on the base plate. The prepared patterned decorative material is excellent in appearance, corrosion resistance, weathering resistance and abrasion resistance and free from the defects of conventional steel plates coated with polyvinyl chloride and the like, such as formation of craze and loss of luster.
摘要翻译：图案化装饰材料通过包括将热固性粉末涂料施加于基板的方法制备; 通过加热熔化热固性粉末涂料; 在熔融热固性粉末涂料具有通过15至75重量％的硬化反应形成的凝胶部分的情况下，单独地对涂层进行压印; 并进一步加热以在基板上形成硬化涂层。所制备的图案化装饰材料的外观，耐腐蚀性，耐候性和耐磨性优异，并且不含有聚氯乙烯等常规钢板的缺陷，例如形成热潮和失光。

5. 发明授权

US07982310B2 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus 有权
标题翻译：半导体装置及其制造方法，电路基板及电子设备
公开(公告)号：US07982310B2
公开(公告)日：2011-07-19
申请号：US12569478
申请日：2009-09-29
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/5226 , H01L23/293 , H01L23/3114 , H01L23/3192 , H01L23/49816 , H01L23/5329 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/02125 , H01L2224/02126 , H01L2224/02331 , H01L2224/0236 , H01L2224/02373 , H01L2224/02375 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/024 , H01L2224/11334 , H01L2224/1146 , H01L2224/13014 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/14131 , H01L2224/16225 , H01L2224/16227 , H01L2224/94 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01074 , H01L2924/013 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/186 , H01L2924/3512 , H01L2924/00 , H01L2224/11
摘要： A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.
摘要翻译：提供一种半导体器件，包括：包括多个电极的半导体元件; 第一布线耦合到电极并且从耦合到电极的部分引导到半导体元件的中心; 耦合在第一布线和外部端子之间的第二布线，第二布线相对于中心引导到半导体元件的外部区域; 以及形成在第一布线和第二布线之间的至少一个树脂层。

6. 发明授权

US07888799B2 Semiconductor device, circuit substrate, electro-optic device and electronic appliance 失效
标题翻译：半导体器件，电路基板，电光器件和电子设备
公开(公告)号：US07888799B2
公开(公告)日：2011-02-15
申请号：US12776667
申请日：2010-05-10
申请人： Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
发明人： Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
IPC分类号： H01L23/48
CPC分类号： G09G3/006 , H01L27/14601 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05548 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
摘要翻译：第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。半导体器件通过树脂凸块电极导电地连接到相对的基板。测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

7. 发明申请

US20060288572A1 Method of manufacturing semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US20060288572A1
公开(公告)日：2006-12-28
申请号：US11446731
申请日：2006-06-05
申请人： Shuichi Tanaka , Haruki Ito
发明人： Shuichi Tanaka , Haruki Ito
IPC分类号： H05K3/10 , H01K3/22
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05548 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05671 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/13671 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/19043 , Y10T29/49155 , Y10T29/49158 , Y10T29/49204 , Y10T29/49224 , H01L2924/0665 , H01L2924/00014 , H01L2924/01074 , H01L2924/00
摘要： A method of manufacturing a semiconductor device includes (a) forming a first resin layer on a semiconductor substrate including an electrode pad and a passivation film, (b) curing the first resin layer, (c) forming a second resin layer which slopes more gently than the cured first resin layer on at least a lower portion of the first resin layer, (d) curing the second resin layer to form a resin protrusion including the first and second resin layers, and (e) forming a conductive layer which is electrically connected with the electrode pad and passes over the resin protrusion.
摘要翻译：一种制造半导体器件的方法包括：（a）在包括电极焊盘和钝化膜的半导体衬底上形成第一树脂层，（b）固化第一树脂层，（c）形成更缓和地倾斜的第二树脂层比第一树脂层的至少下部固化的第一树脂层，（d）固化第二树脂层以形成包括第一和第二树脂层的树脂突起，以及（e）形成导电层，其为电与电极焊盘连接并且越过树脂突起。

8. 发明授权

US07132749B2 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment 有权
标题翻译：半导体装置及其制造方法，电路基板，电光装置和电子设备
公开(公告)号：US07132749B2
公开(公告)日：2006-11-07
申请号：US11099255
申请日：2005-04-05
申请人： Haruki Ito
发明人： Haruki Ito
IPC分类号： H01L23/48
CPC分类号： H01L24/14 , G02F1/13458 , H01L21/4846 , H01L23/485 , H01L24/02 , H01L24/11 , H01L24/13 , H01L2224/0236 , H01L2224/02375 , H01L2224/02377 , H01L2224/024 , H01L2224/0401 , H01L2224/05124 , H01L2224/114 , H01L2224/1145 , H01L2224/1146 , H01L2224/1161 , H01L2224/11622 , H01L2224/11901 , H01L2224/12105 , H01L2224/13008 , H01L2224/13013 , H01L2224/13018 , H01L2224/1319 , H01L2224/13582 , H01L2224/13644 , H01L2224/13666 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.
摘要翻译：半导体器件具有多个由树脂制成并且高于电极的突起，以及与电极电连接并覆盖突起的顶表面的导电层。一种半导体器件的制造方法，其特征在于，除了电极以外，还具有对半导体装置施加一层树脂的工序，根据突起对电极上的导电层和树脂层进行图案化的工序，通过使用图案化的导电层作为掩模去除位于导电层之间的树脂层以形成突起的步骤。

9. 发明申请

US20060049840A1 Test probe and tester, method for manufacturing the test probe 有权
标题翻译：测试探针和测试仪，制造测试探针的方法
公开(公告)号：US20060049840A1
公开(公告)日：2006-03-09
申请号：US11184763
申请日：2005-07-19
申请人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
发明人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
IPC分类号： G01R31/02
CPC分类号： G09G3/006 , G01R1/06761 , G01R1/07314 , G09G3/3622 , Y10T29/49204
摘要： A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.
摘要翻译：一种测试探针，其具有与测试对象器件的端子电连接的导电部分，包括：硅衬底; 设置在硅基板上的由树脂制成的突起; 第一导电部，设置在突起上并与端子接触; 以及第二导电部，其设置在除了在所述硅基板上具有所述突起的区域以外的区域中，并且与所述第一导电部电连接。

10. 发明申请

US20050275115A1 Semiconductor device, circuit substrate, electro-optic device and electronic appliance 失效
标题翻译：半导体器件，电路基板，电光器件和电子设备
公开(公告)号：US20050275115A1
公开(公告)日：2005-12-15
申请号：US11128848
申请日：2005-05-13
申请人： Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
发明人： Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
IPC分类号： G02F1/1345 , G09G3/00 , H01L21/3205 , H01L21/60 , H01L23/52 , H01L27/146 , H01L29/40
CPC分类号： G09G3/006 , H01L27/14601 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05548 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
摘要翻译：第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。半导体器件通过树脂凸块电极导电地连接到相对的基板。测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

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