专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

2. 发明申请

US20060076104A1 Film peeling apparatus and method of manufacturing wiring board 审中-公开
标题翻译：薄膜剥离装置及其制造方法
公开(公告)号：US20060076104A1
公开(公告)日：2006-04-13
申请号：US11226232
申请日：2005-09-15
申请人： Masashi Inaishi
发明人： Masashi Inaishi
IPC分类号： B65H41/00
CPC分类号： B29C63/0013 , B29L2031/3425 , B32B38/10 , B32B43/006 , B32B2457/08 , H05K3/4673 , H05K2203/0221 , H05K2203/0264 , H05K2203/066
摘要： A film peeling apparatus including a board support section 41, a hole forming jig 51, a punch unit 21, and a film peeling mechanism. The board support section 41 supports a board 15 to which an inter-layer insulating film and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board. The hole forming jig 51 has needles 57 serving as a tip-sharpened member. The needles 57 pierce a peripheral portion of the carrier film so as to form through holes. The punch unit 21 drives the hole forming jig 51 so as to piercing the carrier film by use of the needles 57. The film peeling mechanism peels off the carrier film, starting from air pockets formed around the through holes. Also disclosed is a method of manufacturing a wiring board having an insulating layer, which includes a step of peeling a carrier film from a board to which the insulating material and carrier film has been bonded.
摘要翻译：一种膜剥离装置，包括板支撑部分41，孔形成夹具51，冲头单元21和膜剥离机构。板支撑部分41支撑已经结合了层间绝缘膜和载体膜的板15，载体膜布置在与板相对的绝缘材料的一侧。孔形成用夹具51具有用作尖锐部件的针57。针57刺穿载体膜的周边部分以形成通孔。打孔单元21驱动孔形成夹具51，以便通过针57刺穿载体膜。膜剥离机构从形成在通孔周围的气穴开始剥离载体膜。还公开了一种制造具有绝缘层的布线板的方法，其包括从绝缘材料和载体膜已经结合的基板上剥离载体膜的步骤。

IPRDB

热门服务

关于我们

友情链接

联系方式