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    • 3. 发明授权
    • Carbosiloxane dendrimer and dendrimer-containing organic polymers
    • 碳硅氧烷树枝状大分子和含树枝状大分子的有机聚合物
    • US06306992B1
    • 2001-10-23
    • US09625011
    • 2000-07-25
    • Makoto YoshitakeTadashi OkawaYoshitsugu MoritaHaruhiko Furukawa
    • Makoto YoshitakeTadashi OkawaYoshitsugu MoritaHaruhiko Furukawa
    • C08F23008
    • C07F7/0838
    • A novel carbosiloxane dendrimer is disclosed containing a radically polymerizable group in the molecule and which possesses excellent polymerization reactivity. The carbosiloxane dendrimer can be used to provide organic polymers as afforded by the polymerization of the carbosiloxane dendrimer either alone or with other organic monomers. The radically polymerizable group-functional carbosiloxane dendrimer with the general formula (R1 is C1 to C10 alkyl or aryl, R2 is a divalent organic group excluding C1 to C10 alkylene, b is 1 to 3, X1 is a silylalkyl group, and Y is a radically polymerizable group). Also, dendrimer-containing organic polymer as afforded by the polymerization of (A) the aforesaid carbosiloxane dendrimer and (B) radically polymerizable organic monomer.
    • 公开了一种在分子中含有自由基聚合性基团并且具有优异的聚合反应性的新型碳硅氧烷树枝状聚合物。 碳硅氧烷树枝状聚合物可以用于提供单独或与其它有机单体聚合碳硅氧烷树枝状聚合物所提供的有机聚合物。 具有通式(R1为C1〜C10烷基或芳基,R2为除C1〜C10亚烷基外的二价有机基团,b为1〜3,X 1为甲硅烷基烷基,Y为甲硅烷基烷基)的自由基聚合性基团官能团的碳硅氧烷树枝状大分子 自由基聚合性基团)。 另外,通过(A)上述碳硅氧烷树枝状聚合物和(B)可自由基聚合的有机单体的聚合提供的含树枝状大分子的有机聚合物。
    • 5. 发明授权
    • Epoxy group-containing silicone resin and compositions based thereon
    • 含环氧基的硅氧烷树脂及其组合物
    • US5952439A
    • 1999-09-14
    • US226539
    • 1994-04-12
    • Yoshitsugu MoritaJunji NakanishiKen TanakaToshio Saruyama
    • Yoshitsugu MoritaJunji NakanishiKen TanakaToshio Saruyama
    • C08G59/32C08G77/14C08L61/06C08L63/00C08L79/08C08L83/06C08L101/00C08G77/00C08L283/00
    • C08L61/06C08G59/3254C08G77/14C08L101/00C08L79/08C08L83/06C08L63/00
    • There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
    • 公开了一种固化性树脂组合物,其在固化前具有优异的流动性,并且可固化形成柔性,高度防潮并且耐热冲击性强的模制树脂,所述组合物包含(A)100重量份的可固化 树脂; 和(B)0.1〜500重量份具有通式(R1SiO3 / 2)a(R2R3SiO2 / 2)b(SiO4 / 2)c的含环氧基的有机硅树脂,其中R1,R2和R3各自表示基团 选自含有环氧基的有机基团和一价烃基,条件是所述含环氧基的有机基团包含所述有机硅树脂(B)中的总硅键合有机基团的0.1至40摩尔% ,a为正数,b为零或正数,c为零或正数,b / a的值为零至10,c /(a + b + c)的值为零至0.3 所述有机硅树脂(B)的玻璃化转变温度为-90℃〜150℃。