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    • 1. 发明授权
    • CPP read sensor having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers and method of making same
    • CPP读取传感器具有由具有周围的氧化金属子层的光刻定义的导电通孔制成的约束电流路径及其制造方法
    • US07646570B2
    • 2010-01-12
    • US11496604
    • 2006-07-31
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • G11B5/39H04R31/00
    • G11B5/398B82Y25/00B82Y40/00G01R33/093G11B5/3906G11B5/3983H01F41/306H01F41/308Y10T29/49046Y10T29/49052
    • Current-perpendicular-to-plane (CPP) read sensors having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers, and methods of making the same, are disclosed. In one illustrative example, at least part of a sensor stack structure which includes an electrically conductive spacer layer is formed. A metal (e.g. Ta) sublayer is then deposited over and adjacent the spacer layer, followed by one of an oxidation process, a nitridation process, and an oxynitridation process, to produce an insulator (e.g. TaOx) from the metal sublayer. The metal sublayer deposition and oxidation/nitridation/oxynitridation processes are repeated as necessary to form the insulator with a suitable thickness. Next, a resist structure which exposes one or more portions of the insulator is formed over the insulator. With the resist structure in place, exposed insulator materials are removed by etching to form one or more apertures through the insulator down to the spacer layer. Electrically conductive materials are subsequently deposited within the one or more apertures to form one or more lithographically-defined conductive vias of a current-constraining structure. Advantageously, the lithographically-defined conductive vias increase the current density of the read sensor in the region of the sensing layers to thereby simultaneously increase its resistance and magnetoresistance. With use of the process of oxidation, nitridation, or oxynitridation on each metal sublayer, degradation of the spacer layer is reduced or eliminated such that the desirable soft magnetics of the sensing layers in the read sensor are maintained.
    • 公开了具有由具有周围氧化金属子层的光刻定义的导电通孔制成的约束电流路径的电流垂直平面(CPP)读取传感器及其制造方法。 在一个说明性示例中,形成包括导电间隔层的传感器堆叠结构的至少一部分。 然后将金属(例如Ta)子层沉积在间隔层上并与其相邻,随后是氧化工艺,氮化工艺和氧氮化工艺中的一种,以从金属子层产生绝缘体(例如TaO x)。 根据需要重复金属亚层沉积和氧化/氮化/氧氮化处理以形成具有合适厚度的绝缘体。 接下来,在绝缘体上形成露出绝缘体的一个或多个部分的抗蚀剂结构。 在抗蚀剂结构就位的情况下,通过蚀刻去除暴露的绝缘体材料,以形成穿过绝缘体的一个或多个孔向下到间隔层。 导电材料随后沉积在一个或多个孔内以形成电流约束结构的一个或多个光刻定义的导电通孔。 有利地,光刻定义的导电通孔增加读取传感器在感测层的区域中的电流密度,从而同时增加其电阻和磁阻。 通过使用在每个金属子层上的氧化,氮化或氧氮化的过程,间隔层的劣化被减少或消除,使得保持读取传感器中感测层的期望的软磁性。
    • 2. 发明申请
    • CPP read sensor having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers
    • CPP读取传感器具有由具有周围的氧化金属子层的光刻定义的导电通孔制成的约束电流路径
    • US20080024937A1
    • 2008-01-31
    • US11496604
    • 2006-07-31
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • G11B5/33G11B5/127
    • G11B5/398B82Y25/00B82Y40/00G01R33/093G11B5/3906G11B5/3983H01F41/306H01F41/308Y10T29/49046Y10T29/49052
    • Current-perpendicular-to-plane (CPP) read sensors having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers, and methods of making the same, are disclosed. In one illustrative example, at least part of a sensor stack structure which includes an electrically conductive spacer layer is formed. A metal (e.g. Ta) sublayer is then deposited over and adjacent the spacer layer, followed by one of an oxidation process, a nitridation process, and an oxynitridation process, to produce an insulator (e.g. TaOx) from the metal sublayer. The metal sublayer deposition and oxidation/nitridation/oxynitridation processes are repeated as necessary to form the insulator with a suitable thickness. Next, a resist structure which exposes one or more portions of the insulator is formed over the insulator. With the resist structure in place, exposed insulator materials are removed by etching to form one or more apertures through the insulator down to the spacer layer. Electrically conductive materials are subsequently deposited within the one or more apertures to form one or more lithographically-defined conductive vias of a current-constraining structure. Advantageously, the lithographically-defined conductive vias increase the current density of the read sensor in the region of the sensing layers to thereby simultaneously increase its resistance and magnetoresistance. With use of the process of oxidation, nitridation, or oxynitridation on each metal sublayer, degradation of the spacer layer is reduced or eliminated such that the desirable soft magnetics of the sensing layers in the read sensor are maintained.
    • 公开了具有由具有周围氧化金属子层的光刻定义的导电通孔制成的约束电流路径的电流垂直平面(CPP)读取传感器及其制造方法。 在一个说明性示例中,形成包括导电间隔层的传感器堆叠结构的至少一部分。 然后将金属(例如Ta)子层沉积在间隔层上并与其相邻,随后是氧化工艺,氮化工艺和氧氮化工艺中的一种,以从金属子层产生绝缘体(例如TaO x)。 根据需要重复金属亚层沉积和氧化/氮化/氧氮化处理以形成具有合适厚度的绝缘体。 接下来,在绝缘体上形成露出绝缘体的一个或多个部分的抗蚀剂结构。 在抗蚀剂结构就位的情况下,通过蚀刻去除暴露的绝缘体材料,以形成穿过绝缘体的一个或多个孔向下到间隔层。 导电材料随后沉积在一个或多个孔内以形成电流约束结构的一个或多个光刻定义的导电通孔。 有利地,光刻定义的导电通孔增加读取传感器在感测层的区域中的电流密度,从而同时增加其电阻和磁阻。 通过使用在每个金属子层上的氧化,氮化或氧氮化的过程,间隔层的劣化被减少或消除,使得保持读取传感器中感测层的期望的软磁性。
    • 4. 发明授权
    • CPP dual free layer magnetoresistive head for magnetic data storage
    • CPP双自由层磁阻磁头用于磁数据存储
    • US08018691B2
    • 2011-09-13
    • US12254662
    • 2008-10-20
    • Hardayal Singh GillChang-Man Park
    • Hardayal Singh GillChang-Man Park
    • G11B5/39
    • G11B5/3932B82Y10/00B82Y25/00G01R33/098G11B2005/3996
    • A magnetoresistive sensor having a scissor free layer design and no pinned layer. The sensor includes first and second free layers that have magnetizations that are oriented at 90 degrees to one another and has a third magnetic layer with a magnetization that is antiparallel coupled with one of the free layers. The antiparallel coupling of the third magnetic layer with one of the free layers, allows the sensor to be used in a tunnel valve design, having an electrically insulating barrier layer between the free layers. The tunnel valve design reduces spin torque noise in the sensor, and the presence of the third magnetic layer allows the free layers to remain bias at 90 degrees to one another in spite of interfacial coupling through the very thin barrier layer.
    • 具有无剪切层设计且无固定层的磁阻传感器。 该传感器包括第一自由层和第二自由层,其具有以彼此成90度的方向定向的磁化,并且具有与第一自由层反平行耦合的磁化的第三磁性层。 第三磁性层与自由层之一的反平行耦合允许传感器以隧道阀设计使用,在自由层之间具有电绝缘阻挡层。 隧道阀设计减少了传感器中的自旋扭矩噪声,并且第三磁性层的存在允许自由层保持彼此90度的偏压,尽管通过非常薄的阻挡层进行界面耦合。
    • 10. 发明授权
    • Read sensor having a self-pinned layer formed in both central and side regions for increased thermal stability
    • 读取传感器,其具有形成在中央和侧部区域中的自固定层,以增加热稳定性
    • US07382588B2
    • 2008-06-03
    • US10856152
    • 2004-05-28
    • Hardayal Singh Gill
    • Hardayal Singh Gill
    • G11B5/33G11B5/127
    • B82Y25/00B82Y10/00G11B5/3909G11B5/3912G11B5/3932G11B2005/3996
    • A magnetic head includes first and second shield layers and a read sensor formed between and in electrical contact with the first and second shield layers. The read sensor includes a free layer structure; an antiparallel (AP) self-pinned structure which includes a first AP self-pinned layer, a second AP self-pinned layer, and an AP coupling layer formed between the first and the second AP self-pinned layers; and a non-magnetic spacer layer formed between the free layer structure and the AP self-pinned structure. The first AP self-pinned layer is formed in both a central region of the read sensor and in side regions adjacent the central region. Since thermal stability of the first AP self-pinned layer is proportional to its volume, extending the first AP self-pinned layer in the side regions improves the thermal stability to reduce the likelihood of amplitude flip in the self-pinned sensor.
    • 磁头包括形成在第一和第二屏蔽层之间并且与第一和第二屏蔽层电接触的第一和第二屏蔽层和读取传感器。 读取传感器包括自由层结构; 一个反平行(AP)自固定结构,其包括第一AP自固定层,第二AP自固定层和形成在第一和第二AP自固定层之间的AP耦合层; 以及形成在自由层结构和AP自固定结构之间的非磁性间隔层。 第一AP自固定层形成在读取传感器的中心区域和与中心区域相邻的侧面区域中。 由于第一AP自固定层的热稳定性与其体积成比例,因此在侧面区域中扩展第一AP自固位层可提高热稳定性,以降低自固定传感器中振幅翻转的可能性。