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    • 2. 发明授权
    • Method for structuring a flat substrate consisting of a glass-type material
    • 用于构造由玻璃型材料构成的平坦基底的方法
    • US07416961B2
    • 2008-08-26
    • US10471581
    • 2002-03-13
    • Hans-Joachim QuenzerArne Veit SchulzBernd WagnerPeter Merz
    • Hans-Joachim QuenzerArne Veit SchulzBernd WagnerPeter Merz
    • H01L21/00
    • H01L21/2007B81C99/0085C03B19/02C03C27/00H01L2924/16235
    • Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps:providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface,connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same, tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate, removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.
    • 公开了一种用于构造由玻璃型材料组成的平坦基底的方法。 本发明的方法通过以下步骤的组合来区分:提供由半导体材料组成的半导体平板基板,构成所述半导体平板基板的至少一个表面以在所述表面中获得凹部,将所述半导体平板基板的所述表面连接到 所述玻璃型平板基板,其中所述半导体平板基板的所述结构化表面连接到所述玻璃型平表面的至少部分覆盖该玻璃平面的表面,以这样的方式回火所述连接的平坦基板,使得至少部分 所述玻璃型材料流入所述半导体平板基板的所述结构化表面的所述凹部中,至少从所述再固化玻璃型平板基板除去材料,使得所述玻璃型平板基板呈现与 所述半导体平面基板的所述结构化表面。
    • 4. 发明授权
    • Glass-type planar substrate, use thereof, and method for the production thereof
    • 玻璃型平面基板,其用途及其制造方法
    • US07259080B2
    • 2007-08-21
    • US10526962
    • 2003-08-22
    • Hans-Joachim QuenzerArne-Veit SchulzPeter Merz
    • Hans-Joachim QuenzerArne-Veit SchulzPeter Merz
    • H01L21/46H01L21/30H01L21/324H01L21/50H01L21/48
    • B81C1/00611B81C2201/0126C03B19/02C03B23/02
    • The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface region of reduced thickness forms a fluid-tight bond with the surface region of reduced thickness, with the planar substrate covering the impressions in a fluid-tight manner under vacuum conditions, and that in a second tempering phase, at least partial areas of the glasslike material flow into the impressions of the structured surface of the semiconductor planar substrate.
    • 本发明的方法通过以下方法步骤的组合来区分:提供由半导体材料构成的半导体平面基板,减小半导体平面基板的至少一个表面区域内的半导体平面基板的厚度,以形成 相对于减小厚度的表面平面区域的凸起表面区域,通过局部机械去除材料构造半导体平面基板的凸起表面区域,以将印模放置在凸起表面区域内,将结构化表面 具有玻璃状平面基板的半导体平面基板,使得玻璃状平面基板至少部分地覆盖厚度减小的表面平面区域,以这样的方式回火接合的平面基板,使得在真空下进行的第一回火阶段 条件,玻璃状平面基板cov 减小厚度的表面区域形成与减小厚度的表面区域的流体密封结合,其中平面基板在真空条件下以流体密封的方式覆盖印模,并且在第二回火阶段中,至少部分区域 的玻璃状材料流入半导体平面基板的结构化表面的印模中。
    • 5. 发明申请
    • Glass-type planar substrate, use thereof, and method for the production thereof
    • 玻璃型平面基板,其用途及其制造方法
    • US20060110893A1
    • 2006-05-25
    • US10526962
    • 2003-08-22
    • Hans-Joachim QuenzerArne-Veit SchulzPeter Merz
    • Hans-Joachim QuenzerArne-Veit SchulzPeter Merz
    • H01L21/30
    • B81C1/00611B81C2201/0126C03B19/02C03B23/02
    • The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface region of reduced thickness forms a fluid-tight bond with the surface region of reduced thickness, with the planar substrate covering the impressions in a fluid-tight manner under vacuum conditions, and that in a second tempering phase, at least partial areas of the glasslike material flow into the impressions of the structured surface of the semiconductor planar substrate.
    • 本发明的方法通过以下方法步骤的组合来区分:提供由半导体材料构成的半导体平面基板,减小半导体平面基板的至少一个表面区域内的半导体平面基板的厚度,以形成 相对于减小厚度的表面平面区域的凸起表面区域,通过局部机械去除材料构造半导体平面基板的凸起表面区域,以将印模放置在凸起表面区域内,将结构化表面 具有玻璃状平面基板的半导体平面基板,使得玻璃状平面基板至少部分地覆盖厚度减小的表面平面区域,以这样的方式回火接合的平面基板,使得在真空下进行的第一回火阶段 条件,玻璃状平面基板cov 减小厚度的表面区域形成与减小厚度的表面区域的流体密封结合,其中平面基板在真空条件下以流体密封的方式覆盖印模,并且在第二回火阶段中,至少部分区域 的玻璃状材料流入半导体平面基板的结构化表面的印模中。
    • 6. 发明申请
    • Method and device for aftertreating an optical lens
    • 光学透镜后处理方法和装置
    • US20060096321A1
    • 2006-05-11
    • US10540211
    • 2003-12-19
    • Hans-Joachim QuenzerPeter MerzUwe Bott
    • Hans-Joachim QuenzerPeter MerzUwe Bott
    • C03B23/00
    • C03B23/02C03B11/082C03B2215/414C03B2215/44
    • The invention relates to a method and a device for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding said circumferential line and which has a lens underside facing the convex lens surface. The invention, wherein along said circumferential line of the optical lens on said plane section is placed a means perfectly matching said circumferential line and at least laterally bordering said convex lens surface, said optical lens is heated to a temperature of at least the transformation temperature of said glass or glass-type material, pressure equalization prevails between said convex lens surface and said lens underside, after a certain period of time, during which said optical lens undergoes said temperature treatment and subsequent cooling below said transformation temperature, said means is removed from said optical lens.
    • 本发明涉及一种用于后续处理至少一个光学透镜的表面轮廓的方法和装置,特别是由玻璃或玻璃类材料制成并具有凸透镜表面限定的微透镜 通过邻接在围绕所述圆周线的平面部分并且具有面向凸透镜表面的透镜下侧的圆周线。 本发明,其中沿着所述平面部分上的光学透镜的所述圆周线设置完全匹配所述圆周线并且至少横向邻接所述凸透镜表面的装置,所述光学透镜被加热至至少相对于 所述玻璃或玻璃类材料在所述凸透镜表面和所述透镜下侧之间经过一段时间之后,在所述光学透镜经历所述温度处理并随后冷却到所述转变温度以下之前,压力均衡化是所述装置从 所述光学透镜。
    • 10. 发明授权
    • Method and device for selectively changing the contour of the surface of an optical lens made of glass or a glass-type material
    • 用于选择性地改变由玻璃或玻璃类材料制成的光学透镜的表面轮廓的方法和装置
    • US08015843B2
    • 2011-09-13
    • US10540211
    • 2003-12-19
    • Hans-Joachim QuenzerPeter MerzUwe Bott
    • Hans-Joachim QuenzerPeter MerzUwe Bott
    • C03B23/035
    • C03B23/02C03B11/082C03B2215/414C03B2215/44
    • A method and a device are disclosed for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding the circumferential line and which has a lens underside facing the convex lens surface. Along the circumferential line of the optical lens on the plane section is placed a device perfectly matching the circumferential line and at least laterally bordering the convex lens surface, the optical lens is heated to a temperature of at least the transformation temperature of glass or glass-type material, pressure equalization prevails between the convex lens surface and the lens underside, after a certain period of time, during which the optical lens undergoes the temperature treatment and subsequent cooling below the transformation temperature, the device is removed from the optical lens.
    • 公开了用于后续处理至少一个光学透镜的表面的方法和装置,特别是由玻璃或玻璃类材料制成的微透镜,并且具有由透镜表面限定的凸透镜表面 圆周线邻接在围绕圆周线的平面部分上,并且具有面向凸透镜表面的透镜下侧。 沿着平面部分上的光学透镜的圆周线放置与圆周线完全匹配的装置,并且至少横向邻近凸透镜表面,将光学透镜加热至至少玻璃或玻璃 - 在一段时间之后,在光学透镜进行温度处理和随后的冷却转变温度以下,该装置从光学透镜去除。