会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Thermoelectric cooling assembly
    • US11840095B2
    • 2023-12-12
    • US17223761
    • 2021-04-06
    • Hand Held Products, Inc.
    • Ramanathan Alaganchetty
    • B41J2/335
    • B41J2/3358
    • The present disclosure provides a printer apparatus including a thermoelectric cooling assembly and a processor coupled to the thermoelectric cooling assembly. The thermoelectric cooling assembly includes a thermoelectric cooling element that includes a first substrate, a second substrate, and a first plurality of semiconductor elements electrically coupled to a second plurality of semiconductor elements in a space between the first substrate and the second substrate. The thermoelectric cooling element includes a base plate electrically coupled to the first substrate. The base plate is positioned proximate to a plurality of labels traversing above the thermoelectric cooling assembly. The processor receives sensor signals indicative of a temperature of a label that comes in contact with the thermoelectric cooling assembly, compares the temperature of the label with a threshold temperature, and generates an output signal indicative of current supplied to the thermoelectric cooling element to adjust the temperature of the thermoelectric cooling element.
    • 2. 发明申请
    • THERMOELECTRIC COOLING ASSEMBLY
    • US20220315266A1
    • 2022-10-06
    • US17223761
    • 2021-04-06
    • Hand Held Products, Inc.
    • Ramanathan Alaganchetty
    • B65C9/38B41J2/335
    • The present disclosure provides a printer apparatus including a thermoelectric cooling assembly and a processor coupled to the thermoelectric cooling assembly. The thermoelectric cooling assembly includes a thermoelectric cooling element that includes a first substrate, a second substrate, and a first plurality of semiconductor elements electrically coupled to a second plurality of semiconductor elements in a space between the first substrate and the second substrate. The thermoelectric cooling element includes a base plate electrically coupled to the first substrate. The base plate is positioned proximate to a plurality of labels traversing above the thermoelectric cooling assembly. The processor receives sensor signals indicative of a temperature of a label that comes in contact with the thermoelectric cooling assembly, compares the temperature of the label with a threshold temperature, and generates an output signal indicative of current supplied to the thermoelectric cooling element to adjust the temperature of the thermoelectric cooling element.