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    • 4. 发明授权
    • Method of fabricating organic light emitting device
    • 制造有机发光装置的方法
    • US08383208B2
    • 2013-02-26
    • US11400474
    • 2006-04-06
    • Han-Ki KimMyung-Soo HuhMyoung-Soo KimKyu-Sung Lee
    • Han-Ki KimMyung-Soo HuhMyoung-Soo KimKyu-Sung Lee
    • H05H1/24C23C16/00H05B3/00
    • C23C16/45565C23C16/45574C23C16/5096H01L51/5253
    • Methods of fabricating an organic light emitting device using plasma and/or thermal decomposition are provided. An insulating layer is formed by reacting first and second radicals. The first radical is formed by passing a first gas through a plasma generating region and a heating body, and the second radical is formed by passing a second gas through the heating body. The methods improve the characteristics of the resulting insulating layer and increase the use efficiency of the source gas by substantially decomposing the source gas. The insulating layer can be a passivation layer formed on an organic light emitting device. The methods use plasma apparatuses such as an inductively coupled plasma chemical vapor deposition (ICP-CVD) apparatuses or plasma enhanced chemical vapor deposition (PECVD) apparatuses.
    • 提供了使用等离子体和/或热分解制造有机发光器件的方法。 通过使第一和第二自由基反应形成绝缘层。 通过使第一气体通过等离子体生成区域和加热体而形成第一基团,通过使第二气体通过加热体而形成第二自由基。 该方法通过基本分解源气体来改善所得绝缘层的特性并提高源气体的使用效率。 绝缘层可以是形成在有机发光器件上的钝化层。 该方法使用诸如感应耦合等离子体化学气相沉积(ICP-CVD)装置或等离子体增强化学气相沉积(PECVD)装置之类的等离子体装置。
    • 6. 发明申请
    • Catalyst enhanced chemical vapor deposition apparatus and deposition method using the same
    • 催化剂增强化学气相沉积装置及其沉积方法
    • US20060254513A1
    • 2006-11-16
    • US11405552
    • 2006-04-18
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • C23C16/00
    • C23C16/44C23C16/46
    • A catalyst-enhanced chemical vapor deposition (CECVD) apparatus and a deposition method, in which tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated. The CECVD apparatus may be constructed with a process chamber, a showerhead to introduce process gas into process chamber, a tensile catalyst wire structure provided in the process chamber to decompose the gas introduced from the showerhead, and a substrate on which the gas decomposed by the catalyst wire structure is deposited, so that the tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated, thereby eliminating occurrences of non-uniform temperatures of a substrate and non-uniform film growth, and concomitantly enhancing the durability of the catalyst wire.
    • 催化剂增强化学气相沉积(CECVD)装置和沉积方法,其中向催化剂丝施加张力以防止催化剂丝由于热变形而下垂,并且使用另外的气体来防止异物 生成。 CECVD装置可以构造有处理室,将工艺气体引入处理室的喷头,设置在处理室中的分解从喷头引入的气体的拉伸催化剂丝线结构以及由其分解的气体 催化剂丝线结构被沉积,使得张力被施加到催化剂丝上,以防止催化剂丝由于热变形而下垂,并且使用额外的气体来防止产生异物,从而消除不均匀的发生 底物的温度和不均匀的膜生长,并且伴随地提高催化剂丝的耐久性。
    • 7. 发明授权
    • Catalyst enhanced chemical vapor deposition apparatus and deposition method using the same
    • 催化剂增强化学气相沉积装置及其沉积方法
    • US08052795B2
    • 2011-11-08
    • US11405552
    • 2006-04-18
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • C23C16/00
    • C23C16/44C23C16/46
    • A catalyst-enhanced chemical vapor deposition (CECVD) apparatus and a deposition method, in which tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated. The CECVD apparatus may be constructed with a process chamber, a showerhead to introduce process gas into process chamber, a tensile catalyst wire structure provided in the process chamber to decompose the gas introduced from the showerhead, and a substrate on which the gas decomposed by the catalyst wire structure is deposited, so that the tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated, thereby eliminating occurrences of non-uniform temperatures of a substrate and non-uniform film growth, and concomitantly enhancing the durability of the catalyst wire.
    • 催化剂增强化学气相沉积(CECVD)装置和沉积方法,其中向催化剂丝施加张力以防止催化剂丝由于热变形而下垂,并且使用另外的气体来防止异物 生成。 CECVD装置可以构造有处理室,将工艺气体引入处理室的喷头,设置在处理室中的分解从喷头引入的气体的拉伸催化剂丝线结构以及由其分解的气体 催化剂丝线结构被沉积,使得张力被施加到催化剂丝上,以防止催化剂丝由于热变形而下垂,并且使用额外的气体来防止产生异物,从而消除不均匀的发生 底物的温度和不均匀的膜生长,并且伴随地提高催化剂丝的耐久性。
    • 10. 发明授权
    • Semiconductor device having one-time programmable ROM and method of fabricating the same
    • 具有一次可编程ROM的半导体器件及其制造方法
    • US07084452B2
    • 2006-08-01
    • US10722935
    • 2003-11-26
    • Myoung-Soo Kim
    • Myoung-Soo Kim
    • H01L29/76H01L29/788
    • H01L27/11526H01L27/11531H01L29/66825
    • A semiconductor device with a one-time programmable (OTP) ROM disposed over a semiconductor substrate including a memory cell area and a peripheral circuit area includes a MOS transistor and an OTP ROM capacitor. The MOS transistor has a floating gate electrode and is disposed at the memory cell area. The OTP ROM capacitor has a lower electrode, an upper intermetal dielectric, and an upper electrode which are stacked in the order named. The OTP ROM capacitor is disposed on the MOS transistor, and the floating gate electrode and the lower electrode are connected by a floating gate plug to constitute an electrically insulated conductive structure. The upper intermetal dielectric is made of at least one selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride and may be disposed on an entire surface of the semiconductor substrate. A capacitor formed together with the OTP ROM is disposed at the peripheral circuit region.
    • 具有设置在包括存储单元区域和外围电路区域的半导体衬底上的一次可编程(OTP)ROM的半导体器件包括MOS晶体管和OTP ROM电容器。 MOS晶体管具有浮置栅电极,并且设置在存储单元区域。 OTP ROM电容器具有按所述顺序堆叠的下电极,上金属间电介质和上电极。 OTP ROM电容器设置在MOS晶体管上,浮栅电极和下电极通过浮栅连接,构成绝缘导电结构。 上部金属间电介质由选自氧化硅,氮化硅和氮氧化硅中的至少一种制成,并且可以设置在半导体衬底的整个表面上。 与OTP ROM一起形成的电容器设置在外围电路区域。