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    • 2. 发明授权
    • Chipping-resistant composition
    • 抗剪切组合物
    • US5432005A
    • 1995-07-11
    • US71103
    • 1993-06-04
    • Hajime TanigamiHiroshi Mashima
    • Hajime TanigamiHiroshi Mashima
    • B05D5/00B05D7/14C09D5/00C09D5/08C09D175/04B32B27/38
    • C09D175/04Y10T428/31515Y10T428/31913Y10T428/31928
    • A method for forming a chipping-resistant film, a chipping resistant composition and coated articles containing the chipping-resistant film are disclosed. The method includes applying a water-based chipping-resistant composition in either (1) a coating process including electrodeposition, intermediate coating, and topcoating to form (a) a film disposed between an electrodeposited film and an intermediate-coated film, or (b) a film disposed between an intermediate-coated film and a topcoated film; or (2) a coating process including electrodeposition coating and topcoating to form (c) a film disposed between an electrodeposited film and a topcoated film. The water-based, chipping-resistant composition includes: (A) a modified ethylenical polymer which is obtained from an ethylene monomer and an ethylenically unsaturated monomer containing a carboxyl group and which has been made water-dispersible by the addition of a base, and in which at least the backbone of the ethylenical polymer molecule has carboxyl groups bonded thereto and derived from the ethylenically unsaturated monomer, the total amount of the carboxyl groups being not less than 10% by weight based on the amount of the ethylenical polymer; and (B) a water-based polyurethane resin, where the proportion of component (A) to component (B) is from 10/90 to 50/50 by weight.
    • 公开了一种形成耐崩裂膜,耐破碎组合物和含有耐崩裂膜的涂覆制品的方法。 该方法包括在(1)包括电沉积,中间涂层和表面涂层的涂覆工艺中应用水性耐崩裂组合物,以形成(a)设置在电沉积膜和中间涂膜之间的膜,或(b )设置在中间涂覆膜和顶涂膜之间的膜; 或(2)包括电沉积涂覆和表面涂层以形成(c)设置在电沉积膜和顶涂膜之间的膜的涂布方法。 水溶性耐崩裂组合物包括:(A)由乙烯单体和含有羧基的烯属不饱和单体得到的改性乙烯聚合物,其通过加入碱而被水分散, 其中至少乙烯聚合物分子的主链具有与其结合并衍生自烯属不饱和单体的羧基,羧基的总量基于乙烯聚合物的量不小于10重量%; 和(B)成分(A)与成分(B)的比例为10/90〜50/50的水性聚氨酯树脂。