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1. 发明申请

US20110241792A1 PACKAGE, PIEZOELECTRIC VIBRATOR AND PIEZOELECTRIC OSCILLATOR 有权
标题翻译：包装，压电振动器和压电振荡器
公开(公告)号：US20110241792A1
公开(公告)日：2011-10-06
申请号：US13019570
申请日：2011-02-02
申请人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
发明人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
IPC分类号： H03B5/36 , H01L41/053
CPC分类号： H03H9/0509 , H03H9/0547 , H03H9/1021
摘要： A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other.
摘要翻译：封装构造成容纳压电元件。该封装包括分别具有插入电极的多个空间的引导部。引导部分的多个空间彼此分离。

2. 发明申请

US20110302774A1 METHOD FOR MANUFACTURING OSCILLATOR DEVICE AND OSCILLATOR DEVICE 有权
标题翻译：用于制造振荡器装置和振荡器装置的方法
公开(公告)号：US20110302774A1
公开(公告)日：2011-12-15
申请号：US13073292
申请日：2011-03-28
申请人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
发明人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
IPC分类号： H01R43/00
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2924/16195 , H03H3/02 , Y10T29/49005 , Y10T29/4908 , Y10T29/49117 , H01L2924/00014
摘要： An oscillator device manufacturing method includes: placing an oscillator provided with electrodes on a convex pedestal provided on an assembly table; arranging, on the assembly table, a frame member including an opening surrounded by a frame thereof and provided with electrode pads on the frame such that the opening is positioned at the pedestal; connecting the electrode pads to the electrodes of the oscillator placed on the pedestal via wires, while the frame member is arranged on the assembly table; removing the frame member from the assembly table together with the oscillator after the connecting, and bonding the frame member connected to the oscillator to a substrate. By using the method, the oscillator device including the oscillator suspended in air above the substrate can be efficiently manufactured. In stead of using the frame member, a frame body in which frame members are arrayed can be employed.
摘要翻译：振荡器装置的制造方法包括：将设置有电极的振荡器放置在组装台上的凸台上; 在组装台上布置框架构件，框架构件包括由框架围绕的开口，并且在框架上设置有电极垫，使得开口位于基座处; 通过电线将电极焊盘连接到放置在基座上的振荡器的电极，同时框架构件布置在组装台上; 在连接之后，与振荡器一起从组装台移除框架构件，并将连接到振荡器的框架构件接合到基板。通过使用该方法，可以有效地制造包括悬挂在基板上方的空气中的振荡器的振荡器装置。可以采用其中框架构件排列的框体，而不是使用框架构件。

3. 发明申请

US20110169377A1 PIEZOELECTRIC OSCILLATOR 有权
标题翻译：压电振荡器
公开(公告)号：US20110169377A1
公开(公告)日：2011-07-14
申请号：US12973194
申请日：2010-12-20
申请人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
发明人： Hajime KUBOTA , Masayuki ITOH , Masakazu KISHI
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H9/1021 , H03H9/0509 , H03H9/0547
摘要： A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package.
摘要翻译：压电晶体单元包括：包括凹部的封装; 压电元件，其具有突出的电极并设置在所述封装内; 以及包含在所述凹部中的导电性粘合剂。压电元件固定到封装件上，突出电极嵌入在封装的凹部中。

4. 发明申请

US20090235499A1 TANTALUM CAPACITOR 有权
标题翻译： TANTALUM电容
公开(公告)号：US20090235499A1
公开(公告)日：2009-09-24
申请号：US12277947
申请日：2008-11-25
申请人： Masayuki ITOH
发明人： Masayuki ITOH
IPC分类号： H01G9/07
CPC分类号： H01G9/052 , H01G2/065 , H01G9/0029 , H01G9/012 , H01G9/15 , Y10T29/417 , Y10T29/435
摘要： A tantalum capacitor includes: sintered bodies which are disposed at intervals and respectively have first surfaces forming the same surface; and electrode rods which respectively extend into the tantalum sintered bodies and project from the first surfaces of the tantalum sintered bodies. The tantalum capacitor further includes: layers composed of an oxide film layer, a functional polymer layer or a manganese layer, and a carbon layer which are sequentially laminated on surfaces of each of the tantalum sintered bodies excluding the first surface; a conductive layer which covers outside surfaces of the tantalum sintered bodies excluding the first surfaces; and an electrode plate having openings respectively formed at positions corresponding to the first surfaces of the tantalum sintered bodies so that the electrode rods are exposed through the openings. The electrode plate is connected to the conductive layer and spreads across the first surfaces of the tantalum sintered bodies.
摘要翻译：钽电容器包括：间隔设置并分别具有形成相同表面的第一表面的烧结体; 以及分别延伸到钽烧结体中并从钽烧结体的第一表面突出的电极棒。钽电容器还包括：层叠在除了第一面以外的各个钽烧结体的表面上的由氧化物膜层，功能聚合物层或锰层构成的层和碳层，导电层，其覆盖除了第一表面之外的钽烧结体的外表面; 以及电极板，其具有分别形成在与所述钽烧结体的所述第一表面相对应的位置处的开口，使得所述电极棒通过所述开口露出。电极板与导电层连接，并扩散到钽烧结体的第一表面。

5. 发明申请

US20120275128A1 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY APPARATUS 有权
标题翻译：电子元件和电子元件组装装置
公开(公告)号：US20120275128A1
公开(公告)日：2012-11-01
申请号：US13420131
申请日：2012-03-14
申请人： Katsumi TAKADA , Kiyokazu MORIIZUMI , Masayuki ITOH
发明人： Katsumi TAKADA , Kiyokazu MORIIZUMI , Masayuki ITOH
IPC分类号： H05K1/18 , H05K13/04
CPC分类号： H05K1/0212 , H01L23/345 , H01L23/3735 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29111 , H01L2224/29116 , H01L2224/29144 , H01L2224/32238 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/81444 , H01L2224/83444 , H01L2924/0001 , H01L2924/01015 , H01L2924/01047 , H01L2924/12041 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H05K3/22 , H05K3/3494 , H05K2201/09263 , H05K2203/1115 , H05K2203/176 , H01L2924/00014 , H01L2924/0105 , H01L2924/01029 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
摘要： An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
摘要翻译：电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层，所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

6. 发明申请

US20120088335A1 MANUFACTURING METHOD OF THE ELECTRONIC COMPONENT 有权
标题翻译：电子元件的制造方法
公开(公告)号：US20120088335A1
公开(公告)日：2012-04-12
申请号：US13313908
申请日：2011-12-07
申请人： Masayuki ITOH , Takao ISHIKAWA , Tomokazu NAKASHIMA
发明人： Masayuki ITOH , Takao ISHIKAWA , Tomokazu NAKASHIMA
IPC分类号： H01L21/50
CPC分类号： H05K1/182 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K2201/10106 , H05K2201/10651 , H01L2924/00
摘要： Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.
摘要翻译：一种电子部件的制造方法，包括将一对引线的一个引线连接到与pn连接层与p型层和n型层连接的电子元件的pn连接层平行的表面设置在p型层和n型层之间，将另一引线连接到与pn连接层平行的另一表面; 并且通过将一对引线弯曲到外部，形成连接并支撑电子元件的一对引线的支撑部分和用作电极的电极部分。

7. 发明申请

US20080190647A1 ELECTRONIC COMPONENT AND LEAD UNIT THEREFOR 有权
标题翻译：电子元件及其导线单元
公开(公告)号：US20080190647A1
公开(公告)日：2008-08-14
申请号：US12102280
申请日：2008-04-14
申请人： Masayuki ITOH
发明人： Masayuki ITOH
IPC分类号： H01B5/00
CPC分类号： H01G9/008 , H01G9/10 , H01G9/151
摘要： An electronic component has a casing. An electrically-conductive body enclosed in the casing. The inner end of a lead is welded to the electrically-conductive body. The outer end of the lead projects outward out of the casing through a through hole formed in the casing. An enlarged portion is formed in the lead at a position between the inner end and the outer end. The enlarged portion is set in the through hole to close the through hole. Even if whiskers are generated at a position between the electrically-conductive body and the lead based on stress generated during a welding process, the whiskers are received on the enlarged portion in the through hole. No whisker falls out of the casing through the through hole.
摘要翻译：电子部件具有外壳。封闭在壳体内的导电体。引线的内端焊接到导电体上。引线的外端通过形成在壳体中的通孔向外伸出壳体。在内端部和外端部之间的位置，在引线上形成有扩大部。放大部分设置在通孔中以关闭通孔。即使在基于焊接过程中产生的应力的情况下在导电体与导线之间的位置产生晶须，晶须也被容纳在通孔的扩大部分上。没有晶须从通孔穿过套管。

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