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1. 发明授权

US09115875B2 LED light lamps using stack effect for improving heat dissipation 有权
标题翻译： LED灯具采用堆叠效应，改善散热
公开(公告)号：US09115875B2
公开(公告)日：2015-08-25
申请号：US14309750
申请日：2014-06-19
申请人： Huga Optotech Inc. , Interlight Optotech Corporation
发明人： Hwa Su , Tzu-Chi Cheng , Hong-Zhi Liu , Yu-Min Li
IPC分类号： H01J61/52 , F21V29/00 , F21K99/00 , F21V29/83 , F21Y103/00 , F21V3/00 , F21Y101/02 , F21V29/506
CPC分类号： F21V29/004 , F21K9/232 , F21V3/00 , F21V29/506 , F21V29/83 , F21Y2103/10 , F21Y2115/10
摘要： A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.
摘要翻译：发光灯具有灯泡壳，对流加速器，发光灯丝和灯泡基座。灯泡壳体限定填充有填充气体的内部容积，并且包括第一透明材料。对流加速器设置在内部容积内，并且包括第二透明材料。对流加速器含有具有第一和第二开口的烟道。发光灯丝设置在烟道内，包括多个半导体发光元件。当发光灯丝发光以产生热量时，烟道允许填充气体的对流流动进入第一和第二开口之一。灯泡底座支撑灯泡壳和发光灯丝，并且具有与发光灯丝电连通的电导体。第一和第二开口具有与灯泡基座不同的距离。

2. 发明授权

US09157579B2 LED assembly with omnidirectional light field 有权
标题翻译： LED组件采用全向光场
公开(公告)号：US09157579B2
公开(公告)日：2015-10-13
申请号：US14309836
申请日：2014-06-19
申请人： HUGA OPTOTECH INC. , Interlight Optotech Corporation
发明人： Hong-Zhi Liu , Tzu-Chi Cheng
IPC分类号： F21K99/00 , F21V19/00 , H01L25/075 , F21Y101/02 , F21Y103/00 , F21Y111/00 , H01L33/62 , H05K1/11 , H05K3/28 , H05K3/32 , H05K3/34 , H05K3/36
CPC分类号： F21K9/00 , F21K9/232 , F21K9/90 , F21V19/003 , F21Y2103/10 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K1/117 , H05K3/285 , H05K3/326 , H05K3/3405 , H05K3/366 , H05K2201/09481 , H05K2201/10674 , H01L2924/00014
摘要： Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.
摘要翻译：公开了具有全向光场的LED组件。 LED组件具有透明基板，LED芯片以及第一和第二电极板。透明基板包括分别面对相反取向的第一表面和第二表面。透明基板具有穿过其中的通孔，其由导电材料形成以提供导电通孔。 LED芯片安装在第一表面上。第一和第二电极板分别形成在第一和第二表面上。发光二极管芯片和导电通孔串联地电连接在第一和第二电极板之间。

3. 发明授权

US09231171B2 Flexible LED assemblies and LED light bulbs 有权
标题翻译：柔性LED组件和LED灯泡
公开(公告)号：US09231171B2
公开(公告)日：2016-01-05
申请号：US14480084
申请日：2014-09-08
申请人： HUGA OPTOTECH INC. , INTERLIGHT OPTOTECH CORPORATION
发明人： Hong-Zhi Liu , Tzu-Chi Cheng
IPC分类号： H01L33/62 , H01L33/50 , F21K99/00 , H01L25/075 , F21V3/00 , F21Y101/02
CPC分类号： H01L33/504 , F21K9/232 , F21V3/00 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.
摘要翻译： LED组件及相关LED灯泡。 LED组件具有柔性的透明基板，第一表面上的LED芯片，并且电连接到两个相邻的导电部分，形成在第一表面上以基本上覆盖LED芯片的第一波长转换层，以及第二波长转换层形成在第二表面上。柔性透明基板具有彼此相对的第一和第二表面，以及在第一表面上分开形成的若干导电部分。

4. 发明授权

US10724721B2 Light emitting diode device 有权
公开(公告)号：US10724721B2
公开(公告)日：2020-07-28
申请号：US15064256
申请日：2016-03-08
申请人： InterLight Optotech Corporation
发明人： Hwa Su , Tzu-Chi Cheng , Hong-Zhi Liu
IPC分类号： F21V23/00 , F21K9/232 , F21K9/238 , F21Y115/10 , F21Y107/90
摘要： A LED bulb includes a circuit board, a lighting module, an electrical connector, and a lamp shade. The circuit board includes a slot. The lighting module includes a transmissive substrate having a first surface and a second surface opposite to the first surface. The lighting module includes a circuit layer arranged on the first surface, an electrode component arranged on the first surface and electrically connected to the circuit layer, a plurality of LED dies arranged on the first surface and electrically connected to the circuit layer and the electrode component, and the phosphor layer covering the first surface and the second surface. The electrical connector is electrically connected to the circuit board. The lamp shade is associated with the electrical connector.

5. 再颁专利

USRE49031E1 Flexible LED assemblies and LED light bulbs 有权
公开(公告)号：USRE49031E1
公开(公告)日：2022-04-12
申请号：US15863710
申请日：2018-01-05
申请人： EPISTAR CORPORATION , INTERLIGHT OPTOTECH CORPORATION
发明人： Hong-Zhi Liu , Tzu-Chi Cheng
IPC分类号： H01L33/62 , H01L33/50 , H01L25/075 , F21K99/00 , F21V3/00 , F21K9/232 , F21Y109/00 , F21Y115/10 , F21Y107/70
摘要： LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.

6. 发明授权

US09653668B2 LED filament and filament-type LED bulb 有权
公开(公告)号：US09653668B2
公开(公告)日：2017-05-16
申请号：US14880198
申请日：2015-10-10
申请人： KAISTAR Lighting (Xiamen) Co., Ltd. , InterLight Optotech Corporation
发明人： Yu-Chun Chung , Chien-Li Yang , Hong-Zhi Liu
IPC分类号： H01L33/62 , F21V19/00 , F21K9/232
CPC分类号： H01L33/62 , F21K9/232 , F21V19/003
摘要： A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.

7. 发明申请

US20170016580A1 LED FILAMENT AND FILAMENT-TYPE LED BULB 有权
标题翻译： LED灯条和LED灯条
公开(公告)号：US20170016580A1
公开(公告)日：2017-01-19
申请号：US14880198
申请日：2015-10-10
申请人： KAISTAR Lighting (Xiamen) Co., Ltd. , InterLight Optotech Corporation
发明人： Yu-Chun Chung , Chien-Li Yang , Hong-Zhi Liu
IPC分类号： F21K99/00 , H01L33/62 , F21S2/00
CPC分类号： H01L33/62 , F21K9/232 , F21V19/003
摘要： A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.
摘要翻译：公开了一种LED灯丝和使用其的LED灯丝灯泡。 LED灯丝包括载体，布置在载体上的LED芯片和连接到载体的导电引线。导电引线电连接到LED芯片，并且包括引线头部分，引线尾部分和将引线头部分与引线尾部连接的引线颈部。引线颈部的实心宽度小于引线头部的最大固体宽度。由于具有减小的固体宽度的引线颈部可以用作导电引线的易受攻击的位置，所以当导电引线上施加应力时，引线颈部将首先采取动作，因此引线头部分与引线头部分之间的接合位置承运人或承运人本身可以得到保护。

8. 发明授权

US09310031B2 Light emitting diode bulb 有权
标题翻译：发光二极管灯泡
公开(公告)号：US09310031B2
公开(公告)日：2016-04-12
申请号：US13911435
申请日：2013-06-06
申请人： InterLight Optotech Corporation
发明人： Hwa Su , Tzu-Chi Cheng , Hong-Zhi Liu
IPC分类号： F21K99/00
CPC分类号： F21V23/006 , F21K9/232 , F21K9/238 , F21Y2107/90 , F21Y2115/10
摘要： A LED bulb includes a circuit board, a lighting module, a conductive connector, and a lamp shade. The circuit board includes a slot. The lighting module is arranged on the circuit board and includes a transmissive substrate. The lighting module includes a circuit layer attached to the transmissive substrate, an electrode component arranged on one end of the transmissive substrate and inserted into the slot and electrically connected to the circuit layer, and a plurality of LED dies placed on the transmissive substrate and electrically connected to the circuit layer. The conductive connector is arranged on the other side of the circuit board and electrically connected to the circuit. The lamp shade is assembled with the conductive connector such that the circuit board and the lighting module are arranged between the conductive connector and the lamp shade.
摘要翻译： LED灯泡包括电路板，照明模块，导电连接器和灯罩。电路板包括一个插槽。照明模块布置在电路板上并且包括透射基板。照明模块包括附接到透射基板的电路层，布置在透射基板的一端并插入槽中并电连接到电路层的电极部件和放置在透射基板上的多个LED管芯，连接到电路层。导电连接器布置在电路板的另一侧并电连接到电路。灯罩与导电连接器组装，使得电路板和照明模块布置在导电连接器和灯罩之间。

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